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Class Information
Number: 438/124
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7589404 Semiconductor device Sep. 15, 2009
7579219 Semiconductor device with a protected active die region and method therefor Aug. 25, 2009
7576403 Method of manufacturing infrared rays receiver and structure thereof Aug. 18, 2009
7572680 Packaged integrated circuit with enhanced thermal dissipation Aug. 11, 2009
7572679 Heat extraction from packaged semiconductor chips, scalable with chip area Aug. 11, 2009
7572678 Methods of making and using a floating lead finger on a lead frame Aug. 11, 2009
7569427 Semiconductor component with connecting elements and method for producing the same Aug. 4, 2009
7566648 Method of making solder pad Jul. 28, 2009
7566584 Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method Jul. 28, 2009
7563649 Chip packaging with metal frame pin grid array Jul. 21, 2009
7563648 Semiconductor device package and method for manufacturing same Jul. 21, 2009
7563644 Optical device and method for fabricating the same Jul. 21, 2009
7556986 Tape supported memory card leadframe structure Jul. 7, 2009
7553752 Method of making a wafer level integration package Jun. 30, 2009
7553701 Semiconductor packaging method Jun. 30, 2009
7550859 System and method for hermetically sealing a package Jun. 23, 2009
7550316 Board on chip package and manufacturing method thereof Jun. 23, 2009
7547583 Light emitting diode package with direct leadframe heat dissipation Jun. 16, 2009
7544540 Encapsulated electrical component and production method Jun. 9, 2009
7537962 Method of fabricating a shielded stacked integrated circuit package system May. 26, 2009
7534716 System and method for venting pressure from an integrated circuit package sealed with a lid May. 19, 2009
7534661 Method of forming molded resin semiconductor device May. 19, 2009
7528077 Semiconductor device and method for manufacturing the same May. 5, 2009
7528014 Semiconductor device and method of manufacturing the same May. 5, 2009
7528013 Method for fabricating high performance leadframe in electronic package May. 5, 2009
7521294 Lead frame for semiconductor package Apr. 21, 2009
7517729 Integrated circuit package system with heat slug Apr. 14, 2009
7517722 Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds Apr. 14, 2009
7510913 Method of making an encapsulated plasma sensitive device Mar. 31, 2009
7507606 Semiconductor device and method of manufacturing the same Mar. 24, 2009
7504712 Electronic device with selective nickel palladium gold plated leadframe and method of making the same Mar. 17, 2009
7501313 Method of making semiconductor BGA package having a segmented voltage plane Mar. 10, 2009
7498678 Electronic assemblies and systems with filled no-flow underfill Mar. 3, 2009
7498197 Silica nanoparticles thermoset resin compositions Mar. 3, 2009
7494843 Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding Feb. 24, 2009
7488903 Method for manufacturing circuit modules and circuit module Feb. 10, 2009
7485501 Method of manufacturing flash memory cards Feb. 3, 2009
7485493 Singulating surface-mountable semiconductor devices and fitting external contacts to said devices Feb. 3, 2009
7485491 Secure digital memory card using land grid array structure Feb. 3, 2009
7479412 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device Jan. 20, 2009
7479411 Apparatus and method for forming solder seals for semiconductor flip chip packages Jan. 20, 2009
7476569 Leadframe enhancement and method of producing a multi-row semiconductor package Jan. 13, 2009
7473585 Technique for manufacturing an overmolded electronic assembly Jan. 6, 2009
7473584 Method for fabricating a fan-in leadframe semiconductor package Jan. 6, 2009
7468294 Semiconductor device and a method of manufacturing the same Dec. 23, 2008
7459345 Packaging method for an electronic element Dec. 2, 2008
7456053 Packaging method for segregating die paddles of a leadframe Nov. 25, 2008
7449370 Production process for manufacturing such semiconductor package Nov. 11, 2008
7449369 Integrated circuit package system with multiple molding Nov. 11, 2008
7449362 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material Nov. 11, 2008

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