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Class Information
Number: 438/124
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7614888 |
Flip chip package process |
Nov. 10, 2009 |
| 7615408 |
Method of manufacturing semiconductor device |
Nov. 10, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7611926 |
Thermosetting die bonding film |
Nov. 3, 2009 |
| 7608482 |
Integrated circuit package with molded insulation |
Oct. 27, 2009 |
| 7605018 |
Method for forming a die-attach layer during semiconductor packaging processes |
Oct. 20, 2009 |
| 7601563 |
Small form factor molded memory card and a method thereof |
Oct. 13, 2009 |
| 7602054 |
Method of forming a molded array package device having an exposed tab and structure |
Oct. 13, 2009 |
| 7598606 |
Integrated circuit package system with die and package combination |
Oct. 6, 2009 |
| 7595228 |
Method for manufacturing electronic component-mounted board |
Sep. 29, 2009 |
| 7592204 |
Package design of small diameter sensor |
Sep. 22, 2009 |
| 7589404 |
Semiconductor device |
Sep. 15, 2009 |
| 7579219 |
Semiconductor device with a protected active die region and method therefor |
Aug. 25, 2009 |
| 7576403 |
Method of manufacturing infrared rays receiver and structure thereof |
Aug. 18, 2009 |
| 7572678 |
Methods of making and using a floating lead finger on a lead frame |
Aug. 11, 2009 |
| 7572679 |
Heat extraction from packaged semiconductor chips, scalable with chip area |
Aug. 11, 2009 |
| 7572680 |
Packaged integrated circuit with enhanced thermal dissipation |
Aug. 11, 2009 |
| 7569427 |
Semiconductor component with connecting elements and method for producing the same |
Aug. 4, 2009 |
| 7566648 |
Method of making solder pad |
Jul. 28, 2009 |
| 7566584 |
Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method |
Jul. 28, 2009 |
| 7563644 |
Optical device and method for fabricating the same |
Jul. 21, 2009 |
| 7563648 |
Semiconductor device package and method for manufacturing same |
Jul. 21, 2009 |
| 7563649 |
Chip packaging with metal frame pin grid array |
Jul. 21, 2009 |
| 7556986 |
Tape supported memory card leadframe structure |
Jul. 7, 2009 |
| 7553752 |
Method of making a wafer level integration package |
Jun. 30, 2009 |
| 7553701 |
Semiconductor packaging method |
Jun. 30, 2009 |
| 7550316 |
Board on chip package and manufacturing method thereof |
Jun. 23, 2009 |
| 7550859 |
System and method for hermetically sealing a package |
Jun. 23, 2009 |
| 7547583 |
Light emitting diode package with direct leadframe heat dissipation |
Jun. 16, 2009 |
| 7544540 |
Encapsulated electrical component and production method |
Jun. 9, 2009 |
| 7537962 |
Method of fabricating a shielded stacked integrated circuit package system |
May. 26, 2009 |
| 7534661 |
Method of forming molded resin semiconductor device |
May. 19, 2009 |
| 7534716 |
System and method for venting pressure from an integrated circuit package sealed with a lid |
May. 19, 2009 |
| 7528013 |
Method for fabricating high performance leadframe in electronic package |
May. 5, 2009 |
| 7528077 |
Semiconductor device and method for manufacturing the same |
May. 5, 2009 |
| 7528014 |
Semiconductor device and method of manufacturing the same |
May. 5, 2009 |
| 7521294 |
Lead frame for semiconductor package |
Apr. 21, 2009 |
| 7517729 |
Integrated circuit package system with heat slug |
Apr. 14, 2009 |
| 7517722 |
Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds |
Apr. 14, 2009 |
| 7510913 |
Method of making an encapsulated plasma sensitive device |
Mar. 31, 2009 |
| 7507606 |
Semiconductor device and method of manufacturing the same |
Mar. 24, 2009 |
| 7504712 |
Electronic device with selective nickel palladium gold plated leadframe and method of making the same |
Mar. 17, 2009 |
| 7501313 |
Method of making semiconductor BGA package having a segmented voltage plane |
Mar. 10, 2009 |
| 7498678 |
Electronic assemblies and systems with filled no-flow underfill |
Mar. 3, 2009 |
| 7498197 |
Silica nanoparticles thermoset resin compositions |
Mar. 3, 2009 |
| 7494843 |
Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding |
Feb. 24, 2009 |
| 7488903 |
Method for manufacturing circuit modules and circuit module |
Feb. 10, 2009 |
| 7485501 |
Method of manufacturing flash memory cards |
Feb. 3, 2009 |
| 7485493 |
Singulating surface-mountable semiconductor devices and fitting external contacts to said devices |
Feb. 3, 2009 |
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