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Class Information
Number: 438/124
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710675 Integrated circuit package system with bonding lands Apr. 29, 2014
8710668 Integrated circuit packaging system with laser hole and method of manufacture thereof Apr. 29, 2014
8710652 Embedded package and method for manufacturing the same Apr. 29, 2014
8710649 Wafer level package and fabrication method Apr. 29, 2014
8710640 Integrated circuit packaging system with heat slug and method of manufacture thereof Apr. 29, 2014
8709878 Methods of packaging imager devices and optics modules, and resulting assemblies Apr. 29, 2014
8709865 Fabrication method of packaging substrate having through-holed interposer embedded therein Apr. 29, 2014
8703545 Aluminum alloy lead-frame and its use in fabrication of power semiconductor package Apr. 22, 2014
8703537 System and method to manufacture an implantable electrode Apr. 22, 2014
8692387 Stacked die semiconductor package Apr. 8, 2014
8691631 Device including two mounting surfaces Apr. 8, 2014
8691341 Method of controlling the height of encapsulant on an inkjet printhead Apr. 8, 2014
8685797 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof Apr. 1, 2014
8679865 Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package Mar. 25, 2014
8673690 Method for manufacturing a semiconductor device and a semiconductor device Mar. 18, 2014
8669655 Chip package and a method for manufacturing a chip package Mar. 11, 2014
8669142 Method of manufacturing package structure Mar. 11, 2014
8669137 Copper post solder bumps on substrate Mar. 11, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8659129 Semiconductor device and method of manufacturing same Feb. 25, 2014
8658472 Semiconductor device Feb. 25, 2014
8658470 Integrated circuit packaging system with formed interconnects and method of manufacture thereof Feb. 25, 2014
8658465 System and method to manufacture an implantable electrode Feb. 25, 2014
8653661 Package having MEMS element and fabrication method thereof Feb. 18, 2014
8652882 Chip package structure and chip packaging method Feb. 18, 2014
8643181 Integrated circuit packaging system with encapsulation and method of manufacture thereof Feb. 4, 2014
8643166 Integrated circuit packaging system with leads and method of manufacturing thereof Feb. 4, 2014
8642395 Method of making chip-on-lead package Feb. 4, 2014
8642394 Method of manufacturing electronic device on leadframe Feb. 4, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8642381 Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die Feb. 4, 2014
8637974 Integrated circuit packaging system with tiebar-less design and method of manufacture thereof Jan. 28, 2014
8637349 Method and apparatus for integrated-circuit battery devices Jan. 28, 2014
8633602 Semiconductor device, and method and apparatus for manufacturing the same Jan. 21, 2014
8633063 Integrated circuit packaging system with pad connection and method of manufacture thereof Jan. 21, 2014
8633061 Method of fabricating package structure Jan. 21, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8624381 Integrated antennas in wafer level package Jan. 7, 2014
8623708 Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof Jan. 7, 2014
8618664 Semiconductor package and method for packaging the same Dec. 31, 2013
8618653 Integrated circuit package system with wafer scale heat slug Dec. 31, 2013
8617933 Integrated circuit packaging system with interlock and method of manufacture thereof Dec. 31, 2013
8617413 Method and device for encapsulating microstructures Dec. 31, 2013
8610292 Resin sealing method of semiconductor device Dec. 17, 2013
8610253 Lead frame, semiconductor device, and method of manufacturing semiconductor device Dec. 17, 2013
8609469 Method of manufacturing semiconductor device Dec. 17, 2013
8603865 Semiconductor storage device and manufacturing method thereof Dec. 10, 2013
8598693 Die pad package with a concave portion in the sealing resin Dec. 3, 2013
8598034 Package-on-package system with through vias and method of manufacture thereof Dec. 3, 2013
8597989 Manufacturing method of semiconductor device Dec. 3, 2013











 
 
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