| |
 |
|
Class Information
Number: 438/124
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8710675 |
Integrated circuit package system with bonding lands |
Apr. 29, 2014 |
| 8710668 |
Integrated circuit packaging system with laser hole and method of manufacture thereof |
Apr. 29, 2014 |
| 8710652 |
Embedded package and method for manufacturing the same |
Apr. 29, 2014 |
| 8710649 |
Wafer level package and fabrication method |
Apr. 29, 2014 |
| 8710640 |
Integrated circuit packaging system with heat slug and method of manufacture thereof |
Apr. 29, 2014 |
| 8709878 |
Methods of packaging imager devices and optics modules, and resulting assemblies |
Apr. 29, 2014 |
| 8709865 |
Fabrication method of packaging substrate having through-holed interposer embedded therein |
Apr. 29, 2014 |
| 8703545 |
Aluminum alloy lead-frame and its use in fabrication of power semiconductor package |
Apr. 22, 2014 |
| 8703537 |
System and method to manufacture an implantable electrode |
Apr. 22, 2014 |
| 8692387 |
Stacked die semiconductor package |
Apr. 8, 2014 |
| 8691631 |
Device including two mounting surfaces |
Apr. 8, 2014 |
| 8691341 |
Method of controlling the height of encapsulant on an inkjet printhead |
Apr. 8, 2014 |
| 8685797 |
Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof |
Apr. 1, 2014 |
| 8679865 |
Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package |
Mar. 25, 2014 |
| 8673690 |
Method for manufacturing a semiconductor device and a semiconductor device |
Mar. 18, 2014 |
| 8669655 |
Chip package and a method for manufacturing a chip package |
Mar. 11, 2014 |
| 8669142 |
Method of manufacturing package structure |
Mar. 11, 2014 |
| 8669137 |
Copper post solder bumps on substrate |
Mar. 11, 2014 |
| 8664752 |
Semiconductor die package and method for making the same |
Mar. 4, 2014 |
| 8659129 |
Semiconductor device and method of manufacturing same |
Feb. 25, 2014 |
| 8658472 |
Semiconductor device |
Feb. 25, 2014 |
| 8658470 |
Integrated circuit packaging system with formed interconnects and method of manufacture thereof |
Feb. 25, 2014 |
| 8658465 |
System and method to manufacture an implantable electrode |
Feb. 25, 2014 |
| 8653661 |
Package having MEMS element and fabrication method thereof |
Feb. 18, 2014 |
| 8652882 |
Chip package structure and chip packaging method |
Feb. 18, 2014 |
| 8643181 |
Integrated circuit packaging system with encapsulation and method of manufacture thereof |
Feb. 4, 2014 |
| 8643166 |
Integrated circuit packaging system with leads and method of manufacturing thereof |
Feb. 4, 2014 |
| 8642395 |
Method of making chip-on-lead package |
Feb. 4, 2014 |
| 8642394 |
Method of manufacturing electronic device on leadframe |
Feb. 4, 2014 |
| 8642388 |
Method for manufacturing light emitting diodes including forming circuit structures with a connecting section |
Feb. 4, 2014 |
| 8642381 |
Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die |
Feb. 4, 2014 |
| 8637974 |
Integrated circuit packaging system with tiebar-less design and method of manufacture thereof |
Jan. 28, 2014 |
| 8637349 |
Method and apparatus for integrated-circuit battery devices |
Jan. 28, 2014 |
| 8633602 |
Semiconductor device, and method and apparatus for manufacturing the same |
Jan. 21, 2014 |
| 8633063 |
Integrated circuit packaging system with pad connection and method of manufacture thereof |
Jan. 21, 2014 |
| 8633061 |
Method of fabricating package structure |
Jan. 21, 2014 |
| 8629537 |
Padless die support integrated circuit package system |
Jan. 14, 2014 |
| 8624381 |
Integrated antennas in wafer level package |
Jan. 7, 2014 |
| 8623708 |
Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof |
Jan. 7, 2014 |
| 8618664 |
Semiconductor package and method for packaging the same |
Dec. 31, 2013 |
| 8618653 |
Integrated circuit package system with wafer scale heat slug |
Dec. 31, 2013 |
| 8617933 |
Integrated circuit packaging system with interlock and method of manufacture thereof |
Dec. 31, 2013 |
| 8617413 |
Method and device for encapsulating microstructures |
Dec. 31, 2013 |
| 8610292 |
Resin sealing method of semiconductor device |
Dec. 17, 2013 |
| 8610253 |
Lead frame, semiconductor device, and method of manufacturing semiconductor device |
Dec. 17, 2013 |
| 8609469 |
Method of manufacturing semiconductor device |
Dec. 17, 2013 |
| 8603865 |
Semiconductor storage device and manufacturing method thereof |
Dec. 10, 2013 |
| 8598693 |
Die pad package with a concave portion in the sealing resin |
Dec. 3, 2013 |
| 8598034 |
Package-on-package system with through vias and method of manufacture thereof |
Dec. 3, 2013 |
| 8597989 |
Manufacturing method of semiconductor device |
Dec. 3, 2013 |
|
|
|
