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Class Information
Number: 438/123
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > Lead frame
Description: Process wherein the metallic body joined to the semiconductor device is in the form of a metallic support with electrically conductive leads depending therefrom.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710675 Integrated circuit package system with bonding lands Apr. 29, 2014
8710630 Mechanisms for marking the orientation of a sawed die Apr. 29, 2014
8709876 Electronic device Apr. 29, 2014
8709875 Power device and method of packaging same Apr. 29, 2014
8709867 Dual-leadframe multi-chip package and method of manufacture Apr. 29, 2014
8704342 Resin sealing type semiconductor device and method of manufacturing the same, and lead frame Apr. 22, 2014
8703598 Manufacturing method of lead frame substrate Apr. 22, 2014
8703545 Aluminum alloy lead-frame and its use in fabrication of power semiconductor package Apr. 22, 2014
8703544 Electronic component employing a layered frame Apr. 22, 2014
8692367 Wafer-level packaged device having self-assembled resilient leads Apr. 8, 2014
8692134 Brace for long wire bond Apr. 8, 2014
8691630 Semiconductor package structure and manufacturing method thereof Apr. 8, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8686545 Semiconductor device and method for manufacturing the same Apr. 1, 2014
8685794 Lead frame land grid array with routing connector trace under unit Apr. 1, 2014
8674488 Light emitting diode (LED) packages Mar. 18, 2014
8669654 Integrated circuit packaging system with die paddle and method of manufacture thereof Mar. 11, 2014
8669652 Lead component and method for manufacturing the same, and semiconductor package Mar. 11, 2014
8669649 Integrated circuit packaging system with interlock and method of manufacture thereof Mar. 11, 2014
8669173 Methods of fluxless micro-piercing of solder balls, and resulting devices Mar. 11, 2014
8664755 Power module package and method for manufacturing the same Mar. 4, 2014
8664754 High power semiconductor package with multiple conductive clips Mar. 4, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8664046 Manufacturing method thereof and a semiconductor device Mar. 4, 2014
8664045 LED lamp strip and manufacturing process thereof Mar. 4, 2014
8658470 Integrated circuit packaging system with formed interconnects and method of manufacture thereof Feb. 25, 2014
8653647 Plastic package and method of fabricating the same Feb. 18, 2014
8652882 Chip package structure and chip packaging method Feb. 18, 2014
8652881 Integrated circuit package system with anti-peel contact pads Feb. 18, 2014
8652879 Lead frame ball grid array with traces under die Feb. 18, 2014
8648452 Resin molded semiconductor device and manufacturing method thereof Feb. 11, 2014
8643166 Integrated circuit packaging system with leads and method of manufacturing thereof Feb. 4, 2014
8643157 Integrated circuit package system having perimeter paddle Feb. 4, 2014
8643156 Lead frame for assembling semiconductor device Feb. 4, 2014
8642408 Semiconductor device Feb. 4, 2014
8642397 Semiconductor wafer level package (WLP) and method of manufacture thereof Feb. 4, 2014
8642396 Ultra-thin quad flat no-lead (QFN) package Feb. 4, 2014
8642395 Method of making chip-on-lead package Feb. 4, 2014
8642394 Method of manufacturing electronic device on leadframe Feb. 4, 2014
8637974 Integrated circuit packaging system with tiebar-less design and method of manufacture thereof Jan. 28, 2014
8637353 Through silicon via repair Jan. 28, 2014
8637352 Ball grid array to pin grid array conversion Jan. 28, 2014
8633063 Integrated circuit packaging system with pad connection and method of manufacture thereof Jan. 21, 2014
8633062 Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof Jan. 21, 2014
RE44699 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size Jan. 14, 2014
8629549 Carrier body for a semiconductor component, semiconductor component and method for producing a carrier body Jan. 14, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8623708 Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof Jan. 7, 2014
8623701 Semiconductor device, semiconductor device storage method, semiconductor device manufacturing method, and semiconductor manufacturing apparatus Jan. 7, 2014
8618664 Semiconductor package and method for packaging the same Dec. 31, 2013











 
 
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