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Class Information
Number: 438/123
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > Lead frame
Description: Process wherein the metallic body joined to the semiconductor device is in the form of a metallic support with electrically conductive leads depending therefrom.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622800 |
Stacked semiconductor packages and method therefor |
Nov. 24, 2009 |
| 7622333 |
Integrated circuit package system for package stacking and manufacturing method thereof |
Nov. 24, 2009 |
| 7622332 |
Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
Nov. 24, 2009 |
| 7618848 |
Integrated circuit package system with supported stacked die |
Nov. 17, 2009 |
| 7612446 |
Structures to enhance cooling of computer memory modules |
Nov. 3, 2009 |
| 7612429 |
Chip resistor, process for producing the same, and frame for use therein |
Nov. 3, 2009 |
| 7608925 |
Relay board with bonding pads connected by wirings |
Oct. 27, 2009 |
| 7608916 |
Aluminum leadframes for semiconductor QFN/SON devices |
Oct. 27, 2009 |
| 7608484 |
Non-pull back pad package with an additional solder standoff |
Oct. 27, 2009 |
| 7608482 |
Integrated circuit package with molded insulation |
Oct. 27, 2009 |
| 7602054 |
Method of forming a molded array package device having an exposed tab and structure |
Oct. 13, 2009 |
| 7602053 |
Leadframe of a leadless flip-chip package and method for manufacturing the same |
Oct. 13, 2009 |
| 7601562 |
Microelectronic component assemblies having lead frames adapted to reduce package bow |
Oct. 13, 2009 |
| 7601560 |
Method for producing an electronic circuit |
Oct. 13, 2009 |
| 7598596 |
Methods and apparatus for a dual-metal magnetic shield structure |
Oct. 6, 2009 |
| 7598101 |
LED of side view type and the method for manufacturing the same |
Oct. 6, 2009 |
| 7595228 |
Method for manufacturing electronic component-mounted board |
Sep. 29, 2009 |
| 7589404 |
Semiconductor device |
Sep. 15, 2009 |
| 7582552 |
Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering |
Sep. 1, 2009 |
| 7575957 |
Leadless semiconductor package and method for manufacturing the same |
Aug. 18, 2009 |
| 7575956 |
Fabrication method for semiconductor package heat spreaders |
Aug. 18, 2009 |
| 7572678 |
Methods of making and using a floating lead finger on a lead frame |
Aug. 11, 2009 |
| 7566592 |
Method and process of manufacturing robust high temperature solder joints |
Jul. 28, 2009 |
| 7563648 |
Semiconductor device package and method for manufacturing same |
Jul. 21, 2009 |
| 7560312 |
Void formation for semiconductor junction capacitance reduction |
Jul. 14, 2009 |
| 7560311 |
Robust leaded molded packages and methods for forming the same |
Jul. 14, 2009 |
| 7557432 |
Thermally enhanced power semiconductor package system |
Jul. 7, 2009 |
| 7556987 |
Method of fabricating an integrated circuit with etched ring and die paddle |
Jul. 7, 2009 |
| 7556986 |
Tape supported memory card leadframe structure |
Jul. 7, 2009 |
| 7554181 |
Semiconductor device with non-overlapping chip mounting sections |
Jun. 30, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7550828 |
Leadframe package for MEMS microphone assembly |
Jun. 23, 2009 |
| 7547583 |
Light emitting diode package with direct leadframe heat dissipation |
Jun. 16, 2009 |
| 7547582 |
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies |
Jun. 16, 2009 |
| 7547581 |
Manufacturing method of a semiconductor device to suppress generation of whiskers |
Jun. 16, 2009 |
| 7541278 |
Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
Jun. 2, 2009 |
| 7541221 |
Integrated circuit package system with leadfinger support |
Jun. 2, 2009 |
| 7541220 |
Integrated circuit device having flexible leadframe |
Jun. 2, 2009 |
| 7537965 |
Manufacturing method for a leadless multi-chip electronic module |
May. 26, 2009 |
| 7537958 |
High performance multi-chip flip chip package |
May. 26, 2009 |
| 7535086 |
Integrated circuit package-on-package stacking system |
May. 19, 2009 |
| 7534661 |
Method of forming molded resin semiconductor device |
May. 19, 2009 |
| 7534660 |
Methods for assembly and packaging of flip chip configured dice with interposer |
May. 19, 2009 |
| 7528014 |
Semiconductor device and method of manufacturing the same |
May. 5, 2009 |
| 7528013 |
Method for fabricating high performance leadframe in electronic package |
May. 5, 2009 |
| 7525184 |
Semiconductor device and its manufacturing method |
Apr. 28, 2009 |
| 7524702 |
Conductor substrate, semiconductor device and production method thereof |
Apr. 28, 2009 |
| 7524701 |
Chip-scale package |
Apr. 28, 2009 |
| 7524696 |
Sensor including lead frame and method of forming sensor including lead frame |
Apr. 28, 2009 |
| 7521295 |
Leadframe and method of manufacturing the same |
Apr. 21, 2009 |
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