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Class Information
Number: 438/122
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > Possessing thermal dissipation structure (i.e., heat sink)
Description: Process wherein the metallic body joined to the semiconductor substrate possesses structure for the dissipation of thermal energy generated during operation of the electrical device.










Patents under this class:

Patent Number Title Of Patent Date Issued
8709866 Methods of forming integrated circuit packages Apr. 29, 2014
8709865 Fabrication method of packaging substrate having through-holed interposer embedded therein Apr. 29, 2014
8704346 Semiconductor package and radiation lead frame Apr. 22, 2014
8703540 Chip-scale semiconductor die packaging method Apr. 22, 2014
8703536 In-situ foam material as integrated heat spreader (IHS) sealant Apr. 22, 2014
8692365 Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof Apr. 8, 2014
8686545 Semiconductor device and method for manufacturing the same Apr. 1, 2014
8680674 Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices Mar. 25, 2014
8679900 Integrated circuit packaging system with heat conduction and method of manufacture thereof Mar. 25, 2014
8679899 Multipath soldered thermal interface between a chip and its heat sink Mar. 25, 2014
8679872 Light emitting device package and manufacturing method thereof Mar. 25, 2014
8674499 Heat radiation component and semiconductor package including same Mar. 18, 2014
8664758 Semiconductor package having reliable electrical connection and assembling method Mar. 4, 2014
8660157 Means for improved implementation of laser diodes and laser diode arrays Feb. 25, 2014
8659147 Power semiconductor circuit device and method for manufacturing the same Feb. 25, 2014
8659130 Power module and power module manufacturing method Feb. 25, 2014
8653626 Package structures including a capacitor and methods of forming the same Feb. 18, 2014
8648456 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Feb. 11, 2014
8643172 Heat spreader for center gate molding Feb. 4, 2014
8637979 Semiconductor device Jan. 28, 2014
8637925 Nickel-silicide formation with differential Pt composition Jan. 28, 2014
8637887 Thermally enhanced semiconductor packages and related methods Jan. 28, 2014
8633061 Method of fabricating package structure Jan. 21, 2014
8633060 Semiconductor device production method and semiconductor device Jan. 21, 2014
8629004 Method of manufacturing semiconductor modules and semiconductor module Jan. 14, 2014
8623707 Method of fabricating a semiconductor package with integrated substrate thermal slug Jan. 7, 2014
8623706 Microelectronic package with terminals on dielectric mass Jan. 7, 2014
8623705 Nanotube based vapor chamber for die level cooling Jan. 7, 2014
8618653 Integrated circuit package system with wafer scale heat slug Dec. 31, 2013
8618652 Forming functionalized carrier structures with coreless packages Dec. 31, 2013
8610262 Ball grid array package with improved thermal characteristics Dec. 17, 2013
8609463 Integrated circuit package system employing multi-package module techniques Dec. 17, 2013
8604603 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers Dec. 10, 2013
8597986 System in package and method of fabricating same Dec. 3, 2013
8597984 Modular low stress package technology Dec. 3, 2013
8592992 Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP Nov. 26, 2013
8592971 Direct semiconductor contact ebullient cooling package Nov. 26, 2013
8592830 LED unit Nov. 26, 2013
8592254 Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices Nov. 26, 2013
8587019 Grooved plate for improved solder bonding Nov. 19, 2013
8586418 Method for the production of an electronic component and electronic component produced according to this method Nov. 19, 2013
8582297 Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics Nov. 12, 2013
8581390 Semiconductor device with heat dissipation Nov. 12, 2013
8581343 Electrical connectivity for circuit applications Nov. 12, 2013
8574935 Manufacturing method of solid state light emitting element Nov. 5, 2013
8564122 Circuit board component shim structure Oct. 22, 2013
8564121 Semiconductor device and manufacturing method of semiconductor device Oct. 22, 2013
8564120 Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside Oct. 22, 2013
8564119 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system Oct. 22, 2013
8564116 Semiconductor device with reinforcement plate and method of forming same Oct. 22, 2013











 
 
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