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Class Information
Number: 438/122
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support > Possessing thermal dissipation structure (i.e., heat sink)
Description: Process wherein the metallic body joined to the semiconductor substrate possesses structure for the dissipation of thermal energy generated during operation of the electrical device.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618849 |
Integrated circuit package with etched leadframe for package-on-package interconnects |
Nov. 17, 2009 |
| 7615862 |
Heat dissipating package structure and method for fabricating the same |
Nov. 10, 2009 |
| 7611923 |
Method and apparatus for forming stacked die and substrate structures for increased packing density |
Nov. 3, 2009 |
| 7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
Nov. 3, 2009 |
| 7605022 |
Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby |
Oct. 20, 2009 |
| 7595227 |
Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same |
Sep. 29, 2009 |
| 7592698 |
Power semiconductor modules having a cooling component and method for producing them |
Sep. 22, 2009 |
| 7592204 |
Package design of small diameter sensor |
Sep. 22, 2009 |
| 7589418 |
Pressure contact power semiconductor module |
Sep. 15, 2009 |
| 7589417 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
Sep. 15, 2009 |
| 7585702 |
Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate |
Sep. 8, 2009 |
| 7586189 |
Heat dissipation structure accommodated in electronic control device |
Sep. 8, 2009 |
| 7579687 |
Circuit module turbulence enhancement systems and methods |
Aug. 25, 2009 |
| 7579217 |
Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader |
Aug. 25, 2009 |
| 7579218 |
Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
Aug. 25, 2009 |
| 7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof |
Aug. 25, 2009 |
| 7575956 |
Fabrication method for semiconductor package heat spreaders |
Aug. 18, 2009 |
| 7573131 |
Die-up integrated circuit package with grounded stiffener |
Aug. 11, 2009 |
| 7572668 |
Method of patterning an organic thin film, an organic thin film transistor, a method of manufacturing an organic thin film transistor, and an organic electroluminescence display device having |
Aug. 11, 2009 |
| 7569425 |
Method for manufacturing thermal interface material with carbon nanotubes |
Aug. 4, 2009 |
| 7569426 |
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
Aug. 4, 2009 |
| 7566590 |
Low voltage drop and high thermal performance ball grid array package |
Jul. 28, 2009 |
| 7566591 |
Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features |
Jul. 28, 2009 |
| 7563647 |
Integrated circuit package system with interconnect support |
Jul. 21, 2009 |
| 7560309 |
Drop-in heat sink and exposed die-back for molded flip die package |
Jul. 14, 2009 |
| 7560310 |
Semiconductor constructions and semiconductor device fabrication methods |
Jul. 14, 2009 |
| 7553694 |
Methods of forming a high conductivity diamond film and structures formed thereby |
Jun. 30, 2009 |
| 7553702 |
Integrating a heat spreader with an interface material having reduced void size |
Jun. 30, 2009 |
| 7550319 |
Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
Jun. 23, 2009 |
| 7550840 |
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof |
Jun. 23, 2009 |
| 7547412 |
Composite material, method for producing same and member using same |
Jun. 16, 2009 |
| 7544527 |
Method and apparatus for providing optoelectronic communication with an electronic device |
Jun. 9, 2009 |
| 7545032 |
Integrated circuit package system with stiffener |
Jun. 9, 2009 |
| 7541220 |
Integrated circuit device having flexible leadframe |
Jun. 2, 2009 |
| 7538422 |
Integrated circuit micro-cooler having multi-layers of tubes of a CNT array |
May. 26, 2009 |
| 7534650 |
Carbon-carbon and/or metal-carbon fiber composite heat spreader |
May. 19, 2009 |
| 7531386 |
Semiconductor package |
May. 12, 2009 |
| 7528012 |
Method for forming heat sinks on silicon on insulator wafers |
May. 5, 2009 |
| 7528009 |
Wafer-leveled chip packaging structure and method thereof |
May. 5, 2009 |
| 7524703 |
Integrated circuit stacking system and method |
Apr. 28, 2009 |
| 7521794 |
Intrinsic thermal enhancement for FBGA package |
Apr. 21, 2009 |
| 7518233 |
Sealing structure for multi-chip module |
Apr. 14, 2009 |
| 7518219 |
Integrated heat spreader lid |
Apr. 14, 2009 |
| 7517731 |
Semiconductor package |
Apr. 14, 2009 |
| 7517730 |
Coreless substrate and manufacturing method thereof |
Apr. 14, 2009 |
| 7517729 |
Integrated circuit package system with heat slug |
Apr. 14, 2009 |
| 7517728 |
Semiconductor light emitting devices including a luminescent conversion element |
Apr. 14, 2009 |
| 7510912 |
Method of making wirebond electronic package with enhanced chip pad design |
Mar. 31, 2009 |
| 7510911 |
Semiconductor apparatus and method of manufacturing the same |
Mar. 31, 2009 |
| 7511315 |
Semiconductor device and manufacturing method therefor |
Mar. 31, 2009 |
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