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Class Information
Number: 438/121
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support
Description: Process for mounting, packaging, or encapsulating a semiconductor device wherein a semiconductive substrate is supported or enclosed by joining the substrate to a metallic body.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7608920 |
Memory card and method for devising |
Oct. 27, 2009 |
| 7605454 |
Memory card and method for devising |
Oct. 20, 2009 |
| 7598125 |
Method for wafer level packaging and fabricating cap structures |
Oct. 6, 2009 |
| 7586194 |
Semiconductor device having exposed heat dissipating metal plate |
Sep. 8, 2009 |
| 7582553 |
Method of bonding flying leads |
Sep. 1, 2009 |
| 7579679 |
Chipcard with contact areas and method for producing contact areas |
Aug. 25, 2009 |
| 7576414 |
Electrostatic discharge (ESD) protection structure |
Aug. 18, 2009 |
| 7573131 |
Die-up integrated circuit package with grounded stiffener |
Aug. 11, 2009 |
| 7572677 |
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support |
Aug. 11, 2009 |
| 7566648 |
Method of making solder pad |
Jul. 28, 2009 |
| 7563648 |
Semiconductor device package and method for manufacturing same |
Jul. 21, 2009 |
| 7556984 |
Package structure of chip and the package method thereof |
Jul. 7, 2009 |
| 7547583 |
Light emitting diode package with direct leadframe heat dissipation |
Jun. 16, 2009 |
| 7547576 |
Solder wall structure in flip-chip technologies |
Jun. 16, 2009 |
| 7545027 |
Wafer level package having redistribution interconnection layer and method of forming the same |
Jun. 9, 2009 |
| 7544540 |
Encapsulated electrical component and production method |
Jun. 9, 2009 |
| 7537958 |
High performance multi-chip flip chip package |
May. 26, 2009 |
| 7537962 |
Method of fabricating a shielded stacked integrated circuit package system |
May. 26, 2009 |
| 7528014 |
Semiconductor device and method of manufacturing the same |
May. 5, 2009 |
| 7524701 |
Chip-scale package |
Apr. 28, 2009 |
| 7521794 |
Intrinsic thermal enhancement for FBGA package |
Apr. 21, 2009 |
| 7513035 |
Method of integrated circuit packaging |
Apr. 7, 2009 |
| 7514785 |
Semiconductor device and manufacturing method thereof |
Apr. 7, 2009 |
| 7510913 |
Method of making an encapsulated plasma sensitive device |
Mar. 31, 2009 |
| 7507605 |
Low cost lead-free preplated leadframe having improved adhesion and solderability |
Mar. 24, 2009 |
| 7498615 |
Electro-static discharge protection circuit and semiconductor device having the same |
Mar. 3, 2009 |
| 7498192 |
Methods of providing a family of related integrated circuits of different sizes |
Mar. 3, 2009 |
| 7485493 |
Singulating surface-mountable semiconductor devices and fitting external contacts to said devices |
Feb. 3, 2009 |
| 7482638 |
Package for a semiconductor light emitting device |
Jan. 27, 2009 |
| 7473585 |
Technique for manufacturing an overmolded electronic assembly |
Jan. 6, 2009 |
| 7464459 |
Method of forming a MEMS actuator and relay with vertical actuation |
Dec. 16, 2008 |
| 7465488 |
Bow control in an electronic package |
Dec. 16, 2008 |
| 7459346 |
Intrinsic thermal enhancement for FBGA package |
Dec. 2, 2008 |
| 7459345 |
Packaging method for an electronic element |
Dec. 2, 2008 |
| 7456052 |
Thermal intermediate apparatus, systems, and methods |
Nov. 25, 2008 |
| 7453141 |
Semiconductor device package, method of manufacturing the same, and semiconductor device |
Nov. 18, 2008 |
| 7449361 |
Semiconductor substrate with islands of diamond and resulting devices |
Nov. 11, 2008 |
| 7449363 |
Semiconductor package substrate with embedded chip and fabrication method thereof |
Nov. 11, 2008 |
| 7446407 |
Chip package structure |
Nov. 4, 2008 |
| 7446402 |
Substrate structure with embedded semiconductor chip and fabrication method thereof |
Nov. 4, 2008 |
| 7443002 |
Encapsulated microstructure and method of producing one such microstructure |
Oct. 28, 2008 |
| 7429501 |
Lid and method of employing a lid on an integrated circuit |
Sep. 30, 2008 |
| 7425469 |
Method for encapsulating an electronic component using a foil layer |
Sep. 16, 2008 |
| 7423342 |
Method for assembling semiconductor switching elements and heat sink in rotary electric machine and rotary electric machine |
Sep. 9, 2008 |
| 7414663 |
Imaging element, imaging device, camera module and camera system |
Aug. 19, 2008 |
| 7410886 |
Method for fabricating protective caps for protecting elements on a wafer surface |
Aug. 12, 2008 |
| 7405106 |
Quad flat no-lead chip carrier with stand-off |
Jul. 29, 2008 |
| 7402462 |
Folded frame carrier for MOSFET BGA |
Jul. 22, 2008 |
| 7388295 |
Multi-chip module |
Jun. 17, 2008 |
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