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Class Information
Number: 438/121
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Metallic housing or support
Description: Process for mounting, packaging, or encapsulating a semiconductor device wherein a semiconductive substrate is supported or enclosed by joining the substrate to a metallic body.










Sub-classes under this class:

Class Number Class Name Patents
438/124 And encapsulating 1,341
438/123 Lead frame 1,962
438/122 Possessing thermal dissipation structure (i.e., heat sink) 1,193


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Patent Number Title Of Patent Date Issued
8709865 Fabrication method of packaging substrate having through-holed interposer embedded therein Apr. 29, 2014
8703543 Vertical sensor assembly method Apr. 22, 2014
8704377 Compliant conductive nano-particle electrical interconnect Apr. 22, 2014
8685793 Chip assembly having via interconnects joined by plating Apr. 1, 2014
8679898 Semiconductor device and production method therefor Mar. 25, 2014
8683413 Method for making high-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost Mar. 25, 2014
8673689 Single layer BGA substrate process Mar. 18, 2014
8669653 Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor Mar. 11, 2014
8664045 LED lamp strip and manufacturing process thereof Mar. 4, 2014
8664046 Manufacturing method thereof and a semiconductor device Mar. 4, 2014
8659154 Semiconductor device including adhesive covered element Feb. 25, 2014
8658472 Semiconductor device Feb. 25, 2014
8658437 Package method for electronic components by thin substrate Feb. 25, 2014
8651359 Flip chip bonder head for forming a uniform fillet Feb. 18, 2014
8653647 Plastic package and method of fabricating the same Feb. 18, 2014
8653670 Electrical interconnect for an integrated circuit package and method of making same Feb. 18, 2014
8648456 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Feb. 11, 2014
8647927 Microwave circuit package Feb. 11, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8642394 Method of manufacturing electronic device on leadframe Feb. 4, 2014
8643166 Integrated circuit packaging system with leads and method of manufacturing thereof Feb. 4, 2014
8643192 Integrated circuit package with discrete components surface mounted on exposed side Feb. 4, 2014
8643198 Electronic device package and method for forming the same Feb. 4, 2014
8637349 Method and apparatus for integrated-circuit battery devices Jan. 28, 2014
8637353 Through silicon via repair Jan. 28, 2014
8637887 Thermally enhanced semiconductor packages and related methods Jan. 28, 2014
8633061 Method of fabricating package structure Jan. 21, 2014
8627566 Method for packaging a microelectromechanical system (MEMS) device Jan. 14, 2014
8629541 Semiconductor package for controlling warpage Jan. 14, 2014
8623706 Microelectronic package with terminals on dielectric mass Jan. 7, 2014
8618652 Forming functionalized carrier structures with coreless packages Dec. 31, 2013
8617932 Display device, organic light emitting diode display, and manufacturing method of sealing substrate Dec. 31, 2013
8609466 Cap and substrate electrical connection at wafer level Dec. 17, 2013
8603860 Process for forming packages Dec. 10, 2013
8603878 Vertical-type semiconductor devices and methods of manufacturing the same Dec. 10, 2013
8603864 Method of fabricating a semiconductor device Dec. 10, 2013
8592259 Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layer Nov. 26, 2013
8592971 Direct semiconductor contact ebullient cooling package Nov. 26, 2013
8586420 Power semiconductor arrangement and method for producing a power semiconductor arrangement Nov. 19, 2013
8586417 Isostress grid array and method of fabrication thereof Nov. 19, 2013
8580620 Method of manufacturing semiconductor device Nov. 12, 2013
8580621 Solder interconnect by addition of copper Nov. 12, 2013
8575767 Reflow of thermoplastic sheet for passivation of power integrated circuits Nov. 5, 2013
8573836 Apparatus and method for evaluating a substrate mounting device Nov. 5, 2013
8574964 Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape Nov. 5, 2013
8569112 Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof Oct. 29, 2013
8569878 Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same Oct. 29, 2013
8563364 Method for producing a power semiconductor arrangement Oct. 22, 2013
8564113 Electrostatic chucking of an insulator handle substrate Oct. 22, 2013
8551813 Wafer level IC assembly method Oct. 8, 2013

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17










 
 
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