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Class Information
Number: 438/120
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > With vibration step
Description: Process for packaging a semiconductor substrate including a step of applying vibratory energy.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6849477 Method of fabricating and mounting flip chips Feb. 1, 2005
6838316 Semiconductor device manufacturing method using ultrasonic flip chip bonding technique Jan. 4, 2005
6821813 Process for bonding solder bumps to a substrate Nov. 23, 2004
6809044 Method for making a thin film using pressurization Oct. 26, 2004
6808962 Semiconductor device and method for fabricating the semiconductor device Oct. 26, 2004
6716668 Method for forming semiconductor device Apr. 6, 2004
6653171 Flip-chip type semiconductor device having split voids within under-fill layer and its manufacturing method Nov. 25, 2003
6610560 Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same Aug. 26, 2003
6602733 Method for fabricating electronic circuit device, semiconductor device and electronic circuit device including bump bonding Aug. 5, 2003
6586278 Method for mounting electronic component and structure having mounted thereon an electronic component Jul. 1, 2003
6582993 Method of underfilling semiconductor device Jun. 24, 2003
6524885 Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques Feb. 25, 2003
6524892 Method of fabricating multilayer flexible wiring boards Feb. 25, 2003
6492195 Method of thinning a semiconductor substrate using a perforated support substrate Dec. 10, 2002
6461890 Structure of semiconductor chip suitable for chip-on-board system and methods of fabricating and mounting the same Oct. 8, 2002
6461898 Two step wire bond process Oct. 8, 2002
6455933 Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of flip chip Sep. 24, 2002
6424541 Electronic device attachment methods and apparatus for forming an assembly Jul. 23, 2002
6399414 Method for forming semiconductor device Jun. 4, 2002
6387829 Separation process for silicon-on-insulator wafer fabrication May. 14, 2002
6365436 Connecting multiple microelectronic elements with lead deformation Apr. 2, 2002
6346433 Method of coating semiconductor wafer with resin and mold used therefor Feb. 12, 2002
6284568 Method and system for producing semiconductor device Sep. 4, 2001
6269999 Semiconductor chip mounting method utilizing ultrasonic vibrations Aug. 7, 2001
6255138 Process for producing microencapsulated electroconductive filler Jul. 3, 2001
6225145 Method of fabricating vacuum micro-structure May. 1, 2001
6214635 Method and apparatus for underfill of bumped or raised die Apr. 10, 2001
6204094 Method and apparatus for populating an adhesive sheet with particles Mar. 20, 2001
6194250 Low-profile microelectronic package Feb. 27, 2001
6165888 Two step wire bond process Dec. 26, 2000
6150253 Controllable ovonic phase-change semiconductor memory device and methods of fabricating the same Nov. 21, 2000
6107202 Passivation photoresist stripping method to eliminate photoresist extrusion after alloy Aug. 22, 2000
6049130 Semiconductor device using gold bumps and copper leads as bonding elements Apr. 11, 2000
5985694 Semiconductor die bumping method utilizing vacuum stencil Nov. 16, 1999
5973404 Underfill of bumped or raised die using a barrier adjacent to the sidewall of semiconductor device Oct. 26, 1999
5972738 PBGA stiffener package Oct. 26, 1999
5956574 Lead frame flash removing method and apparatus Sep. 21, 1999
5950071 Detachment and removal of microscopic surface contaminants using a pulsed detach light Sep. 7, 1999
5888847 Technique for mounting a semiconductor die Mar. 30, 1999
5851852 Die attached process for SiC Dec. 22, 1998
5837566 Vertical interconnect process for silicon segments Nov. 17, 1998
5545589 Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device Aug. 13, 1996
4933305 Process of wire bonding for semiconductor device Jun. 12, 1990

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