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Class Information
Number: 438/120
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > With vibration step
Description: Process for packaging a semiconductor substrate including a step of applying vibratory energy.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8709866 Methods of forming integrated circuit packages Apr. 29, 2014
8674520 Semiconductor device, method for manufacturing the same, and power supply unit Mar. 18, 2014
8609454 Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices Dec. 17, 2013
8546191 Disposing underfill in an integrated circuit structure Oct. 1, 2013
8420444 Semiconductor device and method of manufacturing the same Apr. 16, 2013
8304863 Electromigration immune through-substrate vias Nov. 6, 2012
8169058 Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars May. 1, 2012
8093106 Method for manufacturing packaging structure Jan. 10, 2012
8084778 Light emitting diode package Dec. 27, 2011
8009442 Directing the flow of underfill materials using magnetic particles Aug. 30, 2011
7977157 Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages Jul. 12, 2011
7901984 Integrated circuit micro-module Mar. 8, 2011
7875528 Method, system, program product for bonding two circuitry-including substrates and related stage Jan. 25, 2011
7863107 Semiconductor device and manufacturing method of the same Jan. 4, 2011
7858493 Cleaving edge-emitting lasers from a wafer cell Dec. 28, 2010
7858438 Semiconductor device, chip package and method of fabricating the same Dec. 28, 2010
7824945 Method for making micro-electromechanical system devices Nov. 2, 2010
7814645 Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration Oct. 19, 2010
7790509 Method for fine-pitch, low stress flip-chip interconnect Sep. 7, 2010
7754529 Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method Jul. 13, 2010
7754536 Semiconductor device and fabrication process thereof Jul. 13, 2010
7754534 Semiconductor device and manufacturing method thereof Jul. 13, 2010
7714421 Small structure and method for fabricating the same May. 11, 2010
7700406 Methods of assembling integrated circuit packages Apr. 20, 2010
7687296 Semiconductor device fabrication method Mar. 30, 2010
7632715 Method of packaging semiconductor devices Dec. 15, 2009
7582553 Method of bonding flying leads Sep. 1, 2009
7514788 Structure of mounting electronic component Apr. 7, 2009
7507654 Method for mounting electronic element on a circuit board Mar. 24, 2009
7439475 Thermally conductive body and method of manufacturing the same Oct. 21, 2008
7435622 High performance reworkable heatsink and packaging structure with solder release layer and method of making Oct. 14, 2008
7432129 Bonding apparatus and method of bonding for a semiconductor chip Oct. 7, 2008
7425499 Methods for forming interconnects in vias and microelectronic workpieces including such interconnects Sep. 16, 2008
7397117 Chip package with die and substrate Jul. 8, 2008
7378616 Heating apparatus and method for semiconductor devices May. 27, 2008
7285447 Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations Oct. 23, 2007
7235429 Conductive block mounting process for electrical connection Jun. 26, 2007
7229854 Electronic component mounting method and apparatus and ultrasonic bonding head Jun. 12, 2007
7217592 Method of magnetic field assisted self-assembly May. 15, 2007
7186586 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities Mar. 6, 2007
7169245 Methods of using sonication to couple a heat sink to a heat-generating component Jan. 30, 2007
7141443 Semiconductor wafer dividing method utilizing laser beam Nov. 28, 2006
7132310 Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and SAW device Nov. 7, 2006
7034403 Durable electronic assembly with conductive adhesive Apr. 25, 2006
7033865 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module Apr. 25, 2006
7015071 Method of manufacturing a semiconductor device Mar. 21, 2006
6943062 Contaminant particle removal by optical tweezers Sep. 13, 2005
6916687 Bump process for flip chip package Jul. 12, 2005
6867087 Formation of dual work function gate electrode Mar. 15, 2005
6855578 Vibration-assisted method for underfilling flip-chip electronic devices Feb. 15, 2005

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