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Class Information
Number: 438/120
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > With vibration step
Description: Process for packaging a semiconductor substrate including a step of applying vibratory energy.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7582553 |
Method of bonding flying leads |
Sep. 1, 2009 |
| 7514788 |
Structure of mounting electronic component |
Apr. 7, 2009 |
| 7507654 |
Method for mounting electronic element on a circuit board |
Mar. 24, 2009 |
| 7439475 |
Thermally conductive body and method of manufacturing the same |
Oct. 21, 2008 |
| 7435622 |
High performance reworkable heatsink and packaging structure with solder release layer and method of making |
Oct. 14, 2008 |
| 7432129 |
Bonding apparatus and method of bonding for a semiconductor chip |
Oct. 7, 2008 |
| 7425499 |
Methods for forming interconnects in vias and microelectronic workpieces including such interconnects |
Sep. 16, 2008 |
| 7397117 |
Chip package with die and substrate |
Jul. 8, 2008 |
| 7378616 |
Heating apparatus and method for semiconductor devices |
May. 27, 2008 |
| 7285447 |
Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations |
Oct. 23, 2007 |
| 7235429 |
Conductive block mounting process for electrical connection |
Jun. 26, 2007 |
| 7229854 |
Electronic component mounting method and apparatus and ultrasonic bonding head |
Jun. 12, 2007 |
| 7217592 |
Method of magnetic field assisted self-assembly |
May. 15, 2007 |
| 7186586 |
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
Mar. 6, 2007 |
| 7169245 |
Methods of using sonication to couple a heat sink to a heat-generating component |
Jan. 30, 2007 |
| 7141443 |
Semiconductor wafer dividing method utilizing laser beam |
Nov. 28, 2006 |
| 7132310 |
Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and SAW device |
Nov. 7, 2006 |
| 7033865 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
Apr. 25, 2006 |
| 7034403 |
Durable electronic assembly with conductive adhesive |
Apr. 25, 2006 |
| 7015071 |
Method of manufacturing a semiconductor device |
Mar. 21, 2006 |
| 6943062 |
Contaminant particle removal by optical tweezers |
Sep. 13, 2005 |
| 6916687 |
Bump process for flip chip package |
Jul. 12, 2005 |
| 6867087 |
Formation of dual work function gate electrode |
Mar. 15, 2005 |
| 6855578 |
Vibration-assisted method for underfilling flip-chip electronic devices |
Feb. 15, 2005 |
| 6849477 |
Method of fabricating and mounting flip chips |
Feb. 1, 2005 |
| 6838316 |
Semiconductor device manufacturing method using ultrasonic flip chip bonding technique |
Jan. 4, 2005 |
| 6821813 |
Process for bonding solder bumps to a substrate |
Nov. 23, 2004 |
| 6809044 |
Method for making a thin film using pressurization |
Oct. 26, 2004 |
| 6808962 |
Semiconductor device and method for fabricating the semiconductor device |
Oct. 26, 2004 |
| 6716668 |
Method for forming semiconductor device |
Apr. 6, 2004 |
| 6653171 |
Flip-chip type semiconductor device having split voids within under-fill layer and its manufacturing method |
Nov. 25, 2003 |
| 6610560 |
Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same |
Aug. 26, 2003 |
| 6602733 |
Method for fabricating electronic circuit device, semiconductor device and electronic circuit device including bump bonding |
Aug. 5, 2003 |
| 6586278 |
Method for mounting electronic component and structure having mounted thereon an electronic component |
Jul. 1, 2003 |
| 6582993 |
Method of underfilling semiconductor device |
Jun. 24, 2003 |
| 6524892 |
Method of fabricating multilayer flexible wiring boards |
Feb. 25, 2003 |
| 6524885 |
Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques |
Feb. 25, 2003 |
| 6492195 |
Method of thinning a semiconductor substrate using a perforated support substrate |
Dec. 10, 2002 |
| 6461898 |
Two step wire bond process |
Oct. 8, 2002 |
| 6461890 |
Structure of semiconductor chip suitable for chip-on-board system and methods of fabricating and mounting the same |
Oct. 8, 2002 |
| 6455933 |
Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of flip chip |
Sep. 24, 2002 |
| 6424541 |
Electronic device attachment methods and apparatus for forming an assembly |
Jul. 23, 2002 |
| 6399414 |
Method for forming semiconductor device |
Jun. 4, 2002 |
| 6387829 |
Separation process for silicon-on-insulator wafer fabrication |
May. 14, 2002 |
| 6365436 |
Connecting multiple microelectronic elements with lead deformation |
Apr. 2, 2002 |
| 6346433 |
Method of coating semiconductor wafer with resin and mold used therefor |
Feb. 12, 2002 |
| 6284568 |
Method and system for producing semiconductor device |
Sep. 4, 2001 |
| 6269999 |
Semiconductor chip mounting method utilizing ultrasonic vibrations |
Aug. 7, 2001 |
| 6255138 |
Process for producing microencapsulated electroconductive filler |
Jul. 3, 2001 |
| 6225145 |
Method of fabricating vacuum micro-structure |
May. 1, 2001 |
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