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Class Information
Number: 438/119
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Including adhesive bonding step > Electrically conductive adhesive
Description: Process wherein the nonmetallic bonding material is electrically conductive.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8709866 Methods of forming integrated circuit packages Apr. 29, 2014
8709878 Methods of packaging imager devices and optics modules, and resulting assemblies Apr. 29, 2014
8710666 Semiconductor device and method for fabricating the same Apr. 29, 2014
8692968 Chip component mounting structure, chip component mounting method and liquid crystal display device Apr. 8, 2014
8687030 Exposing device, method of manufacturing the same, and image forming apparatus Apr. 1, 2014
8683674 Method for stacking microelectronic devices Apr. 1, 2014
8671560 In system reflow of low temperature eutectic bond balls Mar. 18, 2014
8674520 Semiconductor device, method for manufacturing the same, and power supply unit Mar. 18, 2014
8669141 Capped integrated device with protective cap, composite wafer incorporating integrated devices and process for bonding integrated devices with respective protective caps Mar. 11, 2014
8642393 Package on package devices and methods of forming same Feb. 4, 2014
8637379 Device including a semiconductor chip and a carrier and fabrication method Jan. 28, 2014
8623699 Method of chip package build-up Jan. 7, 2014
8614504 Chip package and method for making same Dec. 24, 2013
8592260 Process for producing a semiconductor device Nov. 26, 2013
8586480 Power MOSFET having selectively silvered pads for clip and bond wire attach Nov. 19, 2013
8574961 Method of marking a low profile packaged semiconductor device Nov. 5, 2013
8574964 Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape Nov. 5, 2013
8518748 Method and system for providing a laser submount for an energy assisted magnetic recording head Aug. 27, 2013
8513062 Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device Aug. 20, 2013
8501583 Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates Aug. 6, 2013
8501543 Direct-write wafer level chip scale package Aug. 6, 2013
8497164 Semiconductor die package and method for making the same Jul. 30, 2013
8492202 Semiconductor device and method of manufacturing the same Jul. 23, 2013
8486764 Wafer level package and fabrication method Jul. 16, 2013
8481370 Semiconductor device and method for manufacturing the same Jul. 9, 2013
8435837 Panel based lead frame packaging method and device May. 7, 2013
8409928 Method for making contactless portable objects Apr. 2, 2013
8409918 Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting Apr. 2, 2013
8399997 Power package including multiple semiconductor devices Mar. 19, 2013
8378506 Packaged electronic device having metal comprising self-healing die attach material Feb. 19, 2013
8372694 Semiconductor package fabrication process and semiconductor package Feb. 12, 2013
8354747 Conductive polymer lid for a sensor package and method therefor Jan. 15, 2013
8338234 Hybrid integrated circuit device and manufacturing method thereof Dec. 25, 2012
8329493 Stretchable circuit configuration Dec. 11, 2012
8304878 Embedded component substrate, semiconductor package structure using the same and fabrication methods thereof Nov. 6, 2012
8298866 Wafer level package and fabrication method Oct. 30, 2012
8293586 Method of manufacturing an electronic system Oct. 23, 2012
8288200 Semiconductor devices with conductive clips Oct. 16, 2012
8283783 Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same Oct. 9, 2012
8278146 Manufacturing method of chip package with coplanarity controlling feature Oct. 2, 2012
8278153 Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby Oct. 2, 2012
8269357 Microelectronic assembly with impedance controlled wirebond and conductive reference element Sep. 18, 2012
8247259 Method for the production of an optoelectronic component using thin-film technology Aug. 21, 2012
8240545 Methods for minimizing component shift during soldering Aug. 14, 2012
8232185 Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film Jul. 31, 2012
8227297 Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm Jul. 24, 2012
8227292 Process for the production of a MWT silicon solar cell Jul. 24, 2012
8222086 Integrated semiconductor substrate structure using incompatible processes Jul. 17, 2012
8207057 Microball assembly methods, and packages using maskless microball assemblies Jun. 26, 2012
8198131 Stackable semiconductor device packages Jun. 12, 2012

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