| |
 |
|
Class Information
Number: 438/119
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Including adhesive bonding step > Electrically conductive adhesive
Description: Process wherein the nonmetallic bonding material is electrically conductive.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615462 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
Nov. 10, 2009 |
| 7588966 |
Chip mounting with flowable layer |
Sep. 15, 2009 |
| 7582552 |
Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering |
Sep. 1, 2009 |
| 7582974 |
Semiconductor device and method of manufacturing same |
Sep. 1, 2009 |
| 7569424 |
Method of forming a wall structure in a microelectronic assembly |
Aug. 4, 2009 |
| 7566590 |
Low voltage drop and high thermal performance ball grid array package |
Jul. 28, 2009 |
| 7553701 |
Semiconductor packaging method |
Jun. 30, 2009 |
| 7550318 |
Interconnect for improved die to substrate electrical coupling |
Jun. 23, 2009 |
| 7547579 |
Underfill process |
Jun. 16, 2009 |
| 7531385 |
Flip chip mounting method and method for connecting substrates |
May. 12, 2009 |
| 7524698 |
Handling and positioning of metallic plated balls for socket application in ball grid array packages |
Apr. 28, 2009 |
| 7524704 |
Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam |
Apr. 28, 2009 |
| 7521293 |
Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrument |
Apr. 21, 2009 |
| 7514295 |
Method for processing a base that includes connecting a first base to a second base with an insulating film |
Apr. 7, 2009 |
| 7514340 |
Composite integrated device and methods for forming thereof |
Apr. 7, 2009 |
| 7507604 |
Breakable interconnects and structures formed thereby |
Mar. 24, 2009 |
| 7494843 |
Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding |
Feb. 24, 2009 |
| 7470568 |
Method of manufacturing a semiconductor device |
Dec. 30, 2008 |
| 7459344 |
Method for forming micromachined structure |
Dec. 2, 2008 |
| 7456506 |
Radio frequency identification (RFID) tag lamination process using liner |
Nov. 25, 2008 |
| 7449368 |
Technique for attaching die to leads |
Nov. 11, 2008 |
| 7449363 |
Semiconductor package substrate with embedded chip and fabrication method thereof |
Nov. 11, 2008 |
| 7446399 |
Pad structures to improve board-level reliability of solder-on-pad BGA structures |
Nov. 4, 2008 |
| 7442578 |
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilli |
Oct. 28, 2008 |
| 7435622 |
High performance reworkable heatsink and packaging structure with solder release layer and method of making |
Oct. 14, 2008 |
| 7436058 |
Reactive solder material |
Oct. 14, 2008 |
| 7422930 |
Integrated circuit with re-route layer and stacked die assembly |
Sep. 9, 2008 |
| 7419855 |
Apparatus and method for miniature semiconductor packages |
Sep. 2, 2008 |
| 7394147 |
Semiconductor package |
Jul. 1, 2008 |
| 7394163 |
Method of mounting semiconductor chip |
Jul. 1, 2008 |
| 7381590 |
Method and device including reworkable alpha particle barrier and corrosion barrier |
Jun. 3, 2008 |
| 7358118 |
Mounting method of flexible printed circuit and manufacturing method of electric optical device |
Apr. 15, 2008 |
| 7354803 |
Method for manufacturing substrate conjugate, substrate conjugate, method for manufacturing electro-optical apparatus, and electro optical apparatus |
Apr. 8, 2008 |
| 7332371 |
Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
Feb. 19, 2008 |
| 7326593 |
Method of producing a package for semiconductor chips |
Feb. 5, 2008 |
| 7320902 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Jan. 22, 2008 |
| 7294532 |
Method for manufacturing semiconductor device |
Nov. 13, 2007 |
| 7291913 |
System and method for high performance heat sink for multiple chip devices |
Nov. 6, 2007 |
| 7291513 |
Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy |
Nov. 6, 2007 |
| 7288471 |
Bumping electronic components using transfer substrates |
Oct. 30, 2007 |
| 7272888 |
Method of fabricating semiconductor chip assemblies |
Sep. 25, 2007 |
| 7271034 |
Semiconductor device with a high thermal dissipation efficiency |
Sep. 18, 2007 |
| 7265012 |
Formation of standard voltage threshold and low voltage threshold MOSFET devices |
Sep. 4, 2007 |
| 7262511 |
Conductive adhesive agent with ultrafine particles |
Aug. 28, 2007 |
| 7262083 |
Method of manufacturing a semiconductor device |
Aug. 28, 2007 |
| 7241675 |
Attachment of integrated circuit structures and other substrates to substrates with vias |
Jul. 10, 2007 |
| 7241644 |
Adhesive, method of connecting wiring terminals and wiring structure |
Jul. 10, 2007 |
| 7232709 |
Process for producing a semiconductor device |
Jun. 19, 2007 |
| 7226808 |
Method of manufacturing semiconductor device and method of manufacturing electronics device |
Jun. 5, 2007 |
| 7220616 |
Methods for epoxy loc die attachment |
May. 22, 2007 |
|
|
|
