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Class Information
Number: 438/118
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Including adhesive bonding step
Description: Process for packaging a semiconductor substrate including a step of joining the semiconductor substrate to a another body by nonmetallic bonding.










Sub-classes under this class:

Class Number Class Name Patents
438/119 Electrically conductive adhesive 535


Patents under this class:

Patent Number Title Of Patent Date Issued
8710859 Method for testing multi-chip stacked packages Apr. 29, 2014
8710649 Wafer level package and fabrication method Apr. 29, 2014
8709878 Methods of packaging imager devices and optics modules, and resulting assemblies Apr. 29, 2014
8709874 Manufacturing method for semiconductor device carrier and semiconductor package using the same Apr. 29, 2014
8709868 Sensor packages and method of packaging dies of differing sizes Apr. 29, 2014
8709866 Methods of forming integrated circuit packages Apr. 29, 2014
8704382 Film for flip chip type semiconductor back surface Apr. 22, 2014
8703584 Dicing tape-integrated film for semiconductor back surface Apr. 22, 2014
8703542 Wafer-level packaging mechanisms Apr. 22, 2014
8703537 System and method to manufacture an implantable electrode Apr. 22, 2014
8692389 Dicing tape-integrated film for semiconductor back surface Apr. 8, 2014
8692288 Heterojunction bipolar transistors and methods of manufacture Apr. 8, 2014
8687030 Exposing device, method of manufacturing the same, and image forming apparatus Apr. 1, 2014
8685860 Semiconductor structure and manufacturing method thereof Apr. 1, 2014
8685796 Electronic device and method of manufacturing the same Apr. 1, 2014
8680669 Electronic component, electronic module, and method for manufacturing the same Mar. 25, 2014
8674510 Three-dimensional integrated circuit structure having improved power and thermal management Mar. 18, 2014
8673740 Method for formation of an electrically conducting through via Mar. 18, 2014
8673688 Semiconductor package and method of manufacturing the same Mar. 18, 2014
8673685 Electronic component mounting line and electronic component mounting method Mar. 18, 2014
8669653 Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor Mar. 11, 2014
8669137 Copper post solder bumps on substrate Mar. 11, 2014
8664776 Interconnection tape providing a serial electrode pad connection in a semiconductor device Mar. 4, 2014
8664773 Mounting structure of semiconductor package component and manufacturing method therefor Mar. 4, 2014
8658465 System and method to manufacture an implantable electrode Feb. 25, 2014
8658464 Mold chase design for package-on-package applications Feb. 25, 2014
8653660 Semiconductor device and package Feb. 18, 2014
8652962 Etch damage and ESL free dual damascene metal interconnect Feb. 18, 2014
8652880 Semiconductor device and method of manufacturing same Feb. 18, 2014
8648476 Dicing tape-integrated wafer back surface protective film Feb. 11, 2014
8647983 Simplified copper-copper bonding Feb. 11, 2014
8647964 Temporary wafer bonding method for semiconductor processing Feb. 11, 2014
8647923 Method of manufacturing semiconductor device Feb. 11, 2014
8643492 Encapsulated RFID tags and methods of making same Feb. 4, 2014
8643178 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same Feb. 4, 2014
8642393 Package on package devices and methods of forming same Feb. 4, 2014
8642391 Self-assembly of chips on a substrate Feb. 4, 2014
8642390 Tape residue-free bump area after wafer back grinding Feb. 4, 2014
8642386 Heat spreader as mechanical reinforcement for ultra-thin die Feb. 4, 2014
8633106 Heterojunction bipolar transistors and methods of manufacture Jan. 21, 2014
8633057 Semiconductor package and method of fabricating the same Jan. 21, 2014
8629563 Method for packaging semiconductor dies having through-silicon vias Jan. 14, 2014
8629003 Epoxy encapsulating and lamination adhesive and method of making same Jan. 14, 2014
8629002 Manufacturing method of semiconductor device Jan. 14, 2014
8623704 Adhesive/spacer island structure for multiple die package Jan. 7, 2014
8623699 Method of chip package build-up Jan. 7, 2014
8617923 Semiconductor device manufacturing apparatus and method for manufacturing semiconductor device Dec. 31, 2013
8617922 Method of manufacturing semiconductor device Dec. 31, 2013
8614515 Wiring method for semiconductor integrated circuit, semiconductor-circuit wiring apparatus and semiconductor integrated circuit Dec. 24, 2013
8614504 Chip package and method for making same Dec. 24, 2013











 
 
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