| |
 |
|
Class Information
Number: 438/118
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Including adhesive bonding step
Description: Process for packaging a semiconductor substrate including a step of joining the semiconductor substrate to a another body by nonmetallic bonding.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618847 |
Bonding method of semiconductor and laminated structure fabricated thereby |
Nov. 17, 2009 |
| 7615397 |
Micro-element package and manufacturing method thereof |
Nov. 10, 2009 |
| 7611926 |
Thermosetting die bonding film |
Nov. 3, 2009 |
| 7611925 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Nov. 3, 2009 |
| 7608480 |
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion |
Oct. 27, 2009 |
| 7605021 |
Manufacturing method of electronic device |
Oct. 20, 2009 |
| 7605019 |
Semiconductor device with stacked chips and method for manufacturing thereof |
Oct. 20, 2009 |
| 7598124 |
System and method to increase die stand-off height |
Oct. 6, 2009 |
| 7598122 |
Die attach method and microarray leadframe structure |
Oct. 6, 2009 |
| 7598117 |
Method for manufacturing semiconductor module using interconnection structure |
Oct. 6, 2009 |
| 7595220 |
Image sensor package and fabrication method thereof |
Sep. 29, 2009 |
| 7592708 |
Package board, semiconductor package, and fabricating method thereof |
Sep. 22, 2009 |
| 7588966 |
Chip mounting with flowable layer |
Sep. 15, 2009 |
| 7588965 |
Stencil and method for depositing material onto a substrate |
Sep. 15, 2009 |
| 7588963 |
Method of forming overhang support for a stacked semiconductor device |
Sep. 15, 2009 |
| 7588962 |
Method of making semiconductor device |
Sep. 15, 2009 |
| 7585701 |
Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film |
Sep. 8, 2009 |
| 7585693 |
Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method |
Sep. 8, 2009 |
| 7579268 |
Method of manufacturing an integrated circuit |
Aug. 25, 2009 |
| 7579260 |
Method of dividing an adhesive film bonded to a wafer |
Aug. 25, 2009 |
| 7579215 |
Method for fabricating a low cost integrated circuit (IC) package |
Aug. 25, 2009 |
| 7579206 |
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same |
Aug. 25, 2009 |
| 7575955 |
Method for making electronic packages |
Aug. 18, 2009 |
| 7572677 |
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support |
Aug. 11, 2009 |
| 7569921 |
Semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7569474 |
Method and apparatus for soldering modules to substrates |
Aug. 4, 2009 |
| 7569424 |
Method of forming a wall structure in a microelectronic assembly |
Aug. 4, 2009 |
| 7566590 |
Low voltage drop and high thermal performance ball grid array package |
Jul. 28, 2009 |
| 7566589 |
Apparatus and method for signal bus line layout in semiconductor device |
Jul. 28, 2009 |
| 7564496 |
Camera device, method of manufacturing a camera device, wafer scale package |
Jul. 21, 2009 |
| 7563646 |
Molded ceramic surface mount package |
Jul. 21, 2009 |
| 7562428 |
Manufacturing an ink jet head |
Jul. 21, 2009 |
| 7560308 |
Method for manufacturing bonded substrates and substrates for use in the bonded substrates |
Jul. 14, 2009 |
| 7560307 |
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same |
Jul. 14, 2009 |
| 7560305 |
Apparatus and method for high density multi-chip structures |
Jul. 14, 2009 |
| 7560303 |
Method and apparatus for linear die transfer |
Jul. 14, 2009 |
| 7556986 |
Tape supported memory card leadframe structure |
Jul. 7, 2009 |
| 7553743 |
Wafer bonding method of system in package |
Jun. 30, 2009 |
| 7553701 |
Semiconductor packaging method |
Jun. 30, 2009 |
| 7553698 |
Semiconductor package having semiconductor constructing body and method of manufacturing the same |
Jun. 30, 2009 |
| 7550836 |
Structure of package on package and method for fabricating the same |
Jun. 23, 2009 |
| 7550326 |
Method for manufacturing thin film device and semiconductor device |
Jun. 23, 2009 |
| 7547580 |
Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region |
Jun. 16, 2009 |
| 7547579 |
Underfill process |
Jun. 16, 2009 |
| 7547577 |
Method of making circuitized substrate with solder paste connections |
Jun. 16, 2009 |
| 7544539 |
Forced heat transfer apparatus for heating stacked dice |
Jun. 9, 2009 |
| 7540970 |
Methods of fabricating a semiconductor device |
Jun. 2, 2009 |
| 7537668 |
Method of fabricating high density printed circuit board |
May. 26, 2009 |
| 7534660 |
Methods for assembly and packaging of flip chip configured dice with interposer |
May. 19, 2009 |
| 7534659 |
Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device |
May. 19, 2009 |
|
|
|
