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Class Information
Number: 438/117
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Incorporating resilient component (e.g., spring, etc.)
Description: Process for packaging a semiconductor substrate wherein the resulting structure includes an elastically compressible component.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7608480 |
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion |
Oct. 27, 2009 |
| 7605019 |
Semiconductor device with stacked chips and method for manufacturing thereof |
Oct. 20, 2009 |
| 7598124 |
System and method to increase die stand-off height |
Oct. 6, 2009 |
| 7566584 |
Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method |
Jul. 28, 2009 |
| 7563645 |
Electronic package having a folded package substrate |
Jul. 21, 2009 |
| 7560364 |
Dislocation-specific lateral epitaxial overgrowth to reduce dislocation density of nitride films |
Jul. 14, 2009 |
| 7550317 |
Method for manufacture of wafer level package with air pads |
Jun. 23, 2009 |
| 7547576 |
Solder wall structure in flip-chip technologies |
Jun. 16, 2009 |
| 7547564 |
Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same |
Jun. 16, 2009 |
| 7541219 |
Integrated metallic contact probe storage device |
Jun. 2, 2009 |
| 7541672 |
Semiconductor device |
Jun. 2, 2009 |
| 7534652 |
Microelectronic elements with compliant terminal mountings and methods for making the same |
May. 19, 2009 |
| 7531443 |
Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors |
May. 12, 2009 |
| 7528413 |
Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it |
May. 5, 2009 |
| 7524700 |
Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device |
Apr. 28, 2009 |
| 7524697 |
Method for manufactuing a semiconductor integrated circuit device |
Apr. 28, 2009 |
| 7525187 |
Apparatus and method for connecting components |
Apr. 28, 2009 |
| 7494844 |
Method for manufacturing substrate with cavity |
Feb. 24, 2009 |
| 7479694 |
Membrane 3D IC fabrication |
Jan. 20, 2009 |
| 7443026 |
IC chip package having force-adjustable member between stiffener and printed circuit board |
Oct. 28, 2008 |
| 7425467 |
Web process interconnect in electronic assemblies |
Sep. 16, 2008 |
| 7402182 |
High-power LGA socket |
Jul. 22, 2008 |
| 7400514 |
Non-rigid conductor link measurement sensor and method for the production thereof |
Jul. 15, 2008 |
| 7382042 |
COF flexible printed wiring board and method of producing the wiring board |
Jun. 3, 2008 |
| 7351612 |
Method for fabricating quad flat non-leaded package |
Apr. 1, 2008 |
| 7311451 |
Method of manufacturing optical communication module, and optimum mold and lead frame for use in the manufacturing method |
Dec. 25, 2007 |
| 7291910 |
Semiconductor chip assemblies, methods of making same and components for same |
Nov. 6, 2007 |
| 7288432 |
Electronic devices with small functional elements supported on a carrier |
Oct. 30, 2007 |
| 7279363 |
Vertically stacked semiconductor device |
Oct. 9, 2007 |
| 7278857 |
Brittle fracture resistant spring |
Oct. 9, 2007 |
| 7264999 |
Semiconductor device with interlocking clip |
Sep. 4, 2007 |
| 7256067 |
LGA fixture for indium assembly process |
Aug. 14, 2007 |
| 7241680 |
Electronic packaging using conductive interposer connector |
Jul. 10, 2007 |
| 7217992 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device |
May. 15, 2007 |
| 7217580 |
Method for processing an integrated circuit |
May. 15, 2007 |
| 7217579 |
Voltage contrast test structure |
May. 15, 2007 |
| 7198989 |
Method of producing a COF flexible printed wiring board |
Apr. 3, 2007 |
| 7192806 |
Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
Mar. 20, 2007 |
| 7176059 |
Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts |
Feb. 13, 2007 |
| 7173328 |
Integrated circuit package and method having wire-bonded intra-die electrical connections |
Feb. 6, 2007 |
| 7169646 |
Interconnect assemblies and methods |
Jan. 30, 2007 |
| 7161234 |
Semiconductor component and production method suitable therefor |
Jan. 9, 2007 |
| 7160757 |
Gap control between interposer and substrate in electronic assemblies |
Jan. 9, 2007 |
| 7141448 |
Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials |
Nov. 28, 2006 |
| 7137830 |
Miniaturized contact spring |
Nov. 21, 2006 |
| 7135356 |
Semiconductor device and method of producing a high contrast identification mark |
Nov. 14, 2006 |
| 7129572 |
Submember mounted on a chip of electrical device for electrical connection |
Oct. 31, 2006 |
| 7087465 |
Method of packaging a semiconductor light emitting device |
Aug. 8, 2006 |
| 7087442 |
Process for the formation of a spatial chip arrangement and spatial chip arrangement |
Aug. 8, 2006 |
| 7078109 |
Heat spreading thermal interface structure |
Jul. 18, 2006 |
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