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Class Information
Number: 438/117
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Incorporating resilient component (e.g., spring, etc.)
Description: Process for packaging a semiconductor substrate wherein the resulting structure includes an elastically compressible component.

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8689436 Two abutting sections of an align fixture together floatingly engaging an electronic component Apr. 8, 2014
8685778 Planar cavity MEMS and related structures, methods of manufacture and design structures Apr. 1, 2014
8658911 Through-hole-vias in multi-layer printed circuit boards Feb. 25, 2014
8637789 Method for producing metallised textile surfaces using electricity-generating or electricity-consuming elements Jan. 28, 2014
8614514 Micro-spring chip attachment using ribbon bonds Dec. 24, 2013
8610265 Compliant core peripheral lead semiconductor test socket Dec. 17, 2013
8604609 Flange for semiconductor die Dec. 10, 2013
8592946 Lithography for printing constant line width features Nov. 26, 2013
8581422 Semiconductor module Nov. 12, 2013
8581378 Semiconductor device and method of manufacturing the same Nov. 12, 2013
8575954 Structures and processes for fabrication of probe card assemblies with multi-layer interconnect Nov. 5, 2013
8571405 Surface mount actuator Oct. 29, 2013
8564117 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing Oct. 22, 2013
8531042 Technique for fabricating microsprings on non-planar surfaces Sep. 10, 2013
8519524 Chip stacking structure and fabricating method of the chip stacking structure Aug. 27, 2013
8519531 Electrical and/or electronic device with elastic contact element Aug. 27, 2013
8476110 Method of manufacturing storage apparatus Jul. 2, 2013
8445327 Light-emitting diode package and wafer-level packaging process of light-emitting diode May. 21, 2013
8440506 Microelectronic package and method for a compression-based mid-level interconnect May. 14, 2013
8436429 Stacked power semiconductor device using dual lead frame and manufacturing method May. 7, 2013
8431438 Forming in-situ micro-feature structures with coreless packages Apr. 30, 2013
8404523 Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI) Mar. 26, 2013
8399296 Airgap micro-spring interconnect with bonded underfill seal Mar. 19, 2013
8399297 Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages Mar. 19, 2013
8399966 Inserts for directing molding compound flow and semiconductor die assemblies Mar. 19, 2013
8383442 Methods for reduced stress anchors Feb. 26, 2013
8373264 Semiconductor package with integrated interference shielding and method of manufacture thereof Feb. 12, 2013
8318542 Contact spring application to semiconductor devices Nov. 27, 2012
8314444 Piezoresistive pressure sensor Nov. 20, 2012
8314487 Flange for semiconductor die Nov. 20, 2012
8274144 Helical springs electrical connecting a plurality of packages Sep. 25, 2012
8258014 Method of manufacturing a power transistor module and package with integrated bus bar Sep. 4, 2012
8253226 Electronic parts, and method for arranging shielding case and chip parts Aug. 28, 2012
8242384 Through hole-vias in multi-layer printed circuit boards Aug. 14, 2012
8241957 Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Aug. 14, 2012
8207056 Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device Jun. 26, 2012
8207599 Method and apparatus for directing molding compound flow and resulting semiconductor device packages Jun. 26, 2012
8187922 Low cost flexible substrate May. 29, 2012
8179692 Board having connection terminal May. 15, 2012
8169082 Semiconductor device and method for manufacturing the same May. 1, 2012
8133762 Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core Mar. 13, 2012
8130512 Integrated circuit package system and method of package stacking Mar. 6, 2012
8124456 Methods for securing semiconductor devices using elongated fasteners Feb. 28, 2012
8115112 Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates Feb. 14, 2012
8101459 Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween Jan. 24, 2012
8093099 Lock and key through-via method for wafer level 3D integration and structures produced Jan. 10, 2012
8093712 Monolithic molded flexible electronic assemblies without solder and methods for their manufacture Jan. 10, 2012
8089144 Semiconductor device and method for manufacturing the same Jan. 3, 2012
8084348 Contact pads for silicon chip packages Dec. 27, 2011
8076774 Transistor clamping device Dec. 13, 2011

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