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Class Information
Number: 438/116
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Having light transmissive window
Description: Process wherein the housing contains light transmissive means allowing light to reach the enclosed semiconductive device.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7625780 |
Fluidic heterogeneous microsystems assembly and packaging |
Dec. 1, 2009 |
| 7622336 |
Manufacturing method of semiconductor device |
Nov. 24, 2009 |
| 7616250 |
Image capturing device |
Nov. 10, 2009 |
| 7612442 |
Semiconductor device |
Nov. 3, 2009 |
| 7605455 |
Semiconductor device |
Oct. 20, 2009 |
| 7598119 |
System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices |
Oct. 6, 2009 |
| 7598125 |
Method for wafer level packaging and fabricating cap structures |
Oct. 6, 2009 |
| 7595220 |
Image sensor package and fabrication method thereof |
Sep. 29, 2009 |
| 7585699 |
Semiconductor package board using a metal base |
Sep. 8, 2009 |
| 7576425 |
Conducting layer in chip package module |
Aug. 18, 2009 |
| 7576403 |
Method of manufacturing infrared rays receiver and structure thereof |
Aug. 18, 2009 |
| 7572676 |
Packaging structure and method of an image sensor module |
Aug. 11, 2009 |
| 7569424 |
Method of forming a wall structure in a microelectronic assembly |
Aug. 4, 2009 |
| 7566588 |
Semiconductor device with a resin-sealed optical semiconductor element |
Jul. 28, 2009 |
| 7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit |
Jul. 28, 2009 |
| 7567235 |
Self-aligning optical sensor package |
Jul. 28, 2009 |
| 7563644 |
Optical device and method for fabricating the same |
Jul. 21, 2009 |
| 7547583 |
Light emitting diode package with direct leadframe heat dissipation |
Jun. 16, 2009 |
| 7547962 |
Chip package with a ring having a buffer groove that surrounds the active region of a chip |
Jun. 16, 2009 |
| 7534656 |
Image sensor device and method of manufacturing the same |
May. 19, 2009 |
| 7521790 |
Semiconductor device module and manufacturing method of semiconductor device module |
Apr. 21, 2009 |
| 7491570 |
Die package having an adhesive flow restriction area |
Feb. 17, 2009 |
| 7488612 |
Liquid crystal display device and fabricating method thereof |
Feb. 10, 2009 |
| 7485480 |
Method of manufacturing high power light-emitting device package and structure thereof |
Feb. 3, 2009 |
| 7468293 |
Method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing |
Dec. 23, 2008 |
| 7465606 |
Resistance welded solder crimp for joining stranded wire to a copper lead-frame |
Dec. 16, 2008 |
| 7443017 |
Package having bond-sealed underbump |
Oct. 28, 2008 |
| 7427527 |
Method for aligning devices |
Sep. 23, 2008 |
| 7419854 |
Methods for packaging image sensitive electronic devices |
Sep. 2, 2008 |
| 7410816 |
Method for forming a chamber in an electronic device and device formed thereby |
Aug. 12, 2008 |
| 7405100 |
Packaging of a semiconductor device with a non-opaque cover |
Jul. 29, 2008 |
| 7402453 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
Jul. 22, 2008 |
| 7390687 |
Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers |
Jun. 24, 2008 |
| 7387902 |
Methods for packaging image sensitive electronic devices |
Jun. 17, 2008 |
| 7371652 |
Alignment using fiducial features |
May. 13, 2008 |
| 7358119 |
Thin array plastic package without die attach pad and process for fabricating the same |
Apr. 15, 2008 |
| 7338823 |
Side-emitting LED package and manufacturing method of the same |
Mar. 4, 2008 |
| 7312106 |
Method for encapsulating a chip having a sensitive surface |
Dec. 25, 2007 |
| 7291518 |
Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
Nov. 6, 2007 |
| 7285445 |
Direct cooling of LEDs |
Oct. 23, 2007 |
| 7282393 |
Microelectromechanical device packages with integral heaters |
Oct. 16, 2007 |
| 7264980 |
Method of mounting light emitting element |
Sep. 4, 2007 |
| 7262405 |
Prefabricated housings for microelectronic imagers |
Aug. 28, 2007 |
| 7253029 |
Non-magnetic, hermetically-sealed micro device package |
Aug. 7, 2007 |
| 7253028 |
Image sensor packaging method and structure thereof |
Aug. 7, 2007 |
| 7253390 |
Methods for packaging microelectronic imagers |
Aug. 7, 2007 |
| 7250324 |
Method for manufacturing an image sensor |
Jul. 31, 2007 |
| 7250320 |
Semiconductor light emitting element, manufacturing method thereof, integrated semiconductor light emitting device, manufacturing method thereof, image display device, manufacturing method the |
Jul. 31, 2007 |
| 7250664 |
Integrated circuit device packaging structure and packaging method |
Jul. 31, 2007 |
| 7238546 |
Hermetically sealed micro-device package with window |
Jul. 3, 2007 |
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