| |
 |
|
Class Information
Number: 438/115
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Including contaminant removal or mitigation
Description: Process including the step of removing undesirable material through the use of a getter, desiccant, etc.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6248599 |
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
Jun. 19, 2001 |
| 6225191 |
Process for the manufacture of optical integrated circuits |
May. 1, 2001 |
| 6194249 |
Method of assembly stress protection |
Feb. 27, 2001 |
| 6177294 |
Wiring layout method for semiconductor device and recording medium on which wiring layout program for semiconductor device is recorded |
Jan. 23, 2001 |
| 6159772 |
Packaging electrical circuits |
Dec. 12, 2000 |
| 6159770 |
Method and apparatus for fabricating semiconductor device |
Dec. 12, 2000 |
| 6133068 |
Increasing the gap between a lead frame and a semiconductor die |
Oct. 17, 2000 |
| 6110808 |
Hydrogen getter for integrated microelectronic assembly |
Aug. 29, 2000 |
| 6100108 |
Method of fabricating electronic circuit device |
Aug. 8, 2000 |
| 6074442 |
Method of separating slice base mounting member from wafer and jig adapted therefor |
Jun. 13, 2000 |
| 6074897 |
Integrated circuit bonding method and apparatus |
Jun. 13, 2000 |
| 6063207 |
Surface treatment for bonding pad |
May. 16, 2000 |
| 6048754 |
Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package |
Apr. 11, 2000 |
| 6048741 |
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
Apr. 11, 2000 |
| 6045652 |
Method of manufacturing an enclosed transceiver |
Apr. 4, 2000 |
| 6017777 |
Method of forming a plating layer of a lead frame |
Jan. 25, 2000 |
| 6014318 |
Resin-sealed type ball grid array IC package and manufacturing method thereof |
Jan. 11, 2000 |
| 6008071 |
Method of forming solder bumps onto an integrated circuit device |
Dec. 28, 1999 |
| 5985684 |
Process for manufacturing a laser diode having a heat sink |
Nov. 16, 1999 |
| 5985692 |
Process for flip-chip bonding a semiconductor die having gold bump electrodes |
Nov. 16, 1999 |
| 5970319 |
Method for assembling an integrated circuit chip package having at least one semiconductor device |
Oct. 19, 1999 |
| 5953591 |
Process for laser detection of gas and contaminants in a wafer transport gas tunnel |
Sep. 14, 1999 |
| 5950071 |
Detachment and removal of microscopic surface contaminants using a pulsed detach light |
Sep. 7, 1999 |
| 5948690 |
Pretreatment system for analyzing impurities contained in flat sample |
Sep. 7, 1999 |
| 5926743 |
Process for chlorine trifluoride chamber cleaning |
Jul. 20, 1999 |
| 5919329 |
Method for assembling an integrated circuit chip package having at least one semiconductor device |
Jul. 6, 1999 |
| 5897337 |
Process for adhesively bonding a semiconductor chip to a carrier film |
Apr. 27, 1999 |
| 5851834 |
Methods for determining impurity distributions in microelectronic structures formed from aluminum-containing materials |
Dec. 22, 1998 |
| 5837558 |
Integrated circuit chip packaging method |
Nov. 17, 1998 |
| 5766368 |
Integrated circuit chip module cleaning using a carbon dioxide jet spray |
Jun. 16, 1998 |
| 5753538 |
Method of sealing electronic parts with molded resin and mold employed therefor |
May. 19, 1998 |
| 5700697 |
Method for packaging an integrated circuit using a reconstructed package |
Dec. 23, 1997 |
| 5688708 |
Method of making an ultra-high vacuum field emission display |
Nov. 18, 1997 |
| 5643834 |
Process for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layers |
Jul. 1, 1997 |
| 5543364 |
Hydrogen out venting electronic package |
Aug. 6, 1996 |
| 5022930 |
Thin film photovoltaic panel and method |
Jun. 11, 1991 |
| 4769345 |
Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor |
Sep. 6, 1988 |
| 4622433 |
Ceramic package system using low temperature sealing glasses |
Nov. 11, 1986 |
| 4594770 |
Method of making semiconductor casing |
Jun. 17, 1986 |
| 4427992 |
Method for incorporating a desiccant in a semiconductor package |
Jan. 24, 1984 |
| 4426769 |
Moisture getter for integrated circuit packages |
Jan. 24, 1984 |
| 4382327 |
Method for particle entrapment within an electrical device package |
May. 10, 1983 |
|
|
|
