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Class Information
Number: 438/115
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Including contaminant removal or mitigation
Description: Process including the step of removing undesirable material through the use of a getter, desiccant, etc.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8624359 Wafer level chip scale package and method of manufacturing the same Jan. 7, 2014
8597982 Methods of fabricating electronics assemblies Dec. 3, 2013
8592222 Method for analysing molecular pollution of a fluid, application device and application to the analysis of pollution in a natural medium and in a controlled environment Nov. 26, 2013
8586422 Optical semiconductor device having pre-molded leadframe with window and method therefor Nov. 19, 2013
8569877 Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide Oct. 29, 2013
8546928 Micromechanical housing comprising at least two cavities having different internal pressure and/or different gas compositions and method for the production thereof Oct. 1, 2013
8536605 Micro-bead blasting process for removing a silicone flash layer Sep. 17, 2013
8524538 Integrated circuit packaging system with film assistance mold and method of manufacture thereof Sep. 3, 2013
8497525 Light emitting device and method of manufacturing the same Jul. 30, 2013
8481342 Method of manufacturing semiconductor device, semiconductor device and semiconductor composite device Jul. 9, 2013
8481364 Flexible micro-system and fabrication method thereof Jul. 9, 2013
8461681 Layered structure for corrosion resistant interconnect contacts Jun. 11, 2013
8435838 Optimization of desiccant usage in a MEMS package May. 7, 2013
8431443 Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide Apr. 30, 2013
8409919 Method for manufacturing semiconductor device Apr. 2, 2013
8399299 Cavity structure comprising an adhesion interface composed of getter material Mar. 19, 2013
8389331 Apparatus for restricting moisture ingress Mar. 5, 2013
8373069 Electronic component mounting substrate and method for manufacturing electronic component mounting substrate Feb. 12, 2013
8367476 Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide Feb. 5, 2013
8343806 Hermetic packaging of integrated circuit components Jan. 1, 2013
8283193 Integrated circuit system with sealring and method of manufacture thereof Oct. 9, 2012
8268675 Passivation layer for semiconductor device packaging Sep. 18, 2012
8263436 Apparatus for restricting moisture ingress Sep. 11, 2012
8258013 Integrated circuit assembly having vented heat-spreader Sep. 4, 2012
8242007 Semiconductor device formed using single polysilicon process and method of fabricating the same Aug. 14, 2012
8232205 Methods of manufacturing a honeycomb extrusion die Jul. 31, 2012
8138027 Optical semiconductor device having pre-molded leadframe with window and method therefor Mar. 20, 2012
8137995 Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures Mar. 20, 2012
8125073 Wafer integrated with permanent carrier and method therefor Feb. 28, 2012
8120155 Reduced stiction and mechanical memory in MEMS devices Feb. 21, 2012
8062931 Surface treatment and passivation of AlGaN/GaN HEMT Nov. 22, 2011
8040148 System in package with built-in test-facilitating circuit Oct. 18, 2011
7985625 Method of manufacturing a semiconductor device Jul. 26, 2011
7981793 Method of forming a metal directly on a conductive barrier layer by electrochemical deposition using an oxygen-depleted ambient Jul. 19, 2011
7968987 Carbon dioxide gettering for a chip module assembly Jun. 28, 2011
7901991 Method for manufacturing photovoltaic panels by the use of a polymeric tri-layer comprising a composite getter system Mar. 8, 2011
7880293 Wafer integrated with permanent carrier and method therefor Feb. 1, 2011
7875528 Method, system, program product for bonding two circuitry-including substrates and related stage Jan. 25, 2011
7867892 Packaging carrier with high heat dissipation and method for manufacturing the same Jan. 11, 2011
7858438 Semiconductor device, chip package and method of fabricating the same Dec. 28, 2010
7851241 Method for severing brittle material substrate and severing apparatus using the method Dec. 14, 2010
7838424 Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching Nov. 23, 2010
7833828 Method of fabricating a patterned device using sacrificial spacer layer Nov. 16, 2010
7833834 Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source Nov. 16, 2010
7824945 Method for making micro-electromechanical system devices Nov. 2, 2010
7821139 Flip-chip assembly and method of manufacturing the same Oct. 26, 2010
7811860 Method for producing a device and device Oct. 12, 2010
7799612 Process applying die attach film to singulated die Sep. 21, 2010
7790579 Semiconductor storage device, semiconductor device, and manufacturing method therefor Sep. 7, 2010
7790506 Method of manufacturing semiconductor devices encapsulated in chip size packages Sep. 7, 2010

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