| |
 |
|
Class Information
Number: 438/115
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Including contaminant removal or mitigation
Description: Process including the step of removing undesirable material through the use of a getter, desiccant, etc.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615406 |
Electronic device package manufacturing method and electronic device package |
Nov. 10, 2009 |
| 7595221 |
Method of fabricating a patterned device using sacrificial spacer layer |
Sep. 29, 2009 |
| 7572675 |
Mold flash removal process for electronic devices |
Aug. 11, 2009 |
| 7534657 |
Method of manufacturing a semiconductor device |
May. 19, 2009 |
| 7534658 |
Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
May. 19, 2009 |
| 7531382 |
Method of fabricating a patterned device using sacrificial spacer layer |
May. 12, 2009 |
| 7485478 |
Light emitting device and method of manufacturing the same |
Feb. 3, 2009 |
| 7465977 |
Method for producing a packaged integrated circuit |
Dec. 16, 2008 |
| 7459342 |
Manufacturing method of semiconductor device |
Dec. 2, 2008 |
| 7449366 |
Wafer level packaging cap and fabrication method thereof |
Nov. 11, 2008 |
| 7442577 |
Method of fabricating a patterned device using sacrificial spacer layer |
Oct. 28, 2008 |
| 7416918 |
Direct build-up layer on an encapsulated die package having a moisture barrier structure |
Aug. 26, 2008 |
| 7393716 |
Encapsulated organic semiconductor device and method |
Jul. 1, 2008 |
| 7387928 |
Device and method for making air, gas or vacuum capacitors and other microwave components |
Jun. 17, 2008 |
| 7387912 |
Packaging of electronic chips with air-bridge structures |
Jun. 17, 2008 |
| 7377961 |
Hydrogen vent for optoelectronic packages with resistive thermal device (RTD) |
May. 27, 2008 |
| 7374974 |
Thyristor-based device with trench dielectric material |
May. 20, 2008 |
| 7371614 |
Image sensor device and methods thereof |
May. 13, 2008 |
| 7371603 |
Method of fabricating light emitting diode package |
May. 13, 2008 |
| 7332430 |
Method for improving the mechanical properties of BOC module arrangements |
Feb. 19, 2008 |
| 7315069 |
Integrated multi-purpose getter for radio-frequency (RF) circuit modules |
Jan. 1, 2008 |
| 7303943 |
Method of manufacturing electric device |
Dec. 4, 2007 |
| 7279362 |
Semiconductor wafer coat layers and methods therefor |
Oct. 9, 2007 |
| 7264998 |
Method of removing unnecessary matter from semiconductor wafer, and apparatus using the same |
Sep. 4, 2007 |
| 7253027 |
Method of manufacturing hybrid integrated circuit device |
Aug. 7, 2007 |
| 7250324 |
Method for manufacturing an image sensor |
Jul. 31, 2007 |
| 7235427 |
Method for treating substrates for microelectronics and substrates obtained by said method |
Jun. 26, 2007 |
| 7205179 |
Hydrogen diffusion hybrid port and method of making |
Apr. 17, 2007 |
| 7186587 |
Singulation method used in image sensor packaging process and support for use therein |
Mar. 6, 2007 |
| 7148084 |
Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
Dec. 12, 2006 |
| 7141451 |
Wireless communication medium and method of manufacturing the same |
Nov. 28, 2006 |
| 7087465 |
Method of packaging a semiconductor light emitting device |
Aug. 8, 2006 |
| 7087496 |
Seal ring for integrated circuits |
Aug. 8, 2006 |
| 7087456 |
Stiction resistant release process |
Aug. 8, 2006 |
| 7084010 |
Integrated package design and method for a radiation sensing device |
Aug. 1, 2006 |
| 7078268 |
Method of fabricating a vacuum sealed microdevice package with getters |
Jul. 18, 2006 |
| 7060533 |
Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators |
Jun. 13, 2006 |
| 7056768 |
Cutting method and method of manufacturing semiconductor device |
Jun. 6, 2006 |
| 7049166 |
Methods and apparatus for making integrated circuit package including opening exposing portion of the IC |
May. 23, 2006 |
| 7045385 |
Method for fabricating surface acoustic wave filter packages and package sheet used therein |
May. 16, 2006 |
| 7041611 |
Enhancement of fabrication yields of nanomechanical devices by thin film deposition |
May. 9, 2006 |
| 7042075 |
Electronic device sealed under vacuum containing a getter and method of operation |
May. 9, 2006 |
| 7041532 |
Methods for fabricating interposers including upwardly protruding dams |
May. 9, 2006 |
| 6991952 |
Method of manufacturing semiconductor device |
Jan. 31, 2006 |
| 6979595 |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices |
Dec. 27, 2005 |
| 6979893 |
Packaged microelectromechanical device with lubricant |
Dec. 27, 2005 |
| 6969638 |
Low cost substrate for an integrated circuit device with bondpads free of plated gold |
Nov. 29, 2005 |
| 6962835 |
Method for room temperature metal direct bonding |
Nov. 8, 2005 |
| 6958260 |
Hydrogen gettering system |
Oct. 25, 2005 |
| 6953706 |
Method of providing a semiconductor package having an internal heat-activated hydrogen source |
Oct. 11, 2005 |
|
|
|
