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Class Information
Number: 438/114
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Substrate dicing > Utilizing a coating to perfect the dicing
Description: Process including a step of coating the semiconductive substrate to enhance the dicing operation.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8703583 Fabrication method of semiconductor device Apr. 22, 2014
8704382 Film for flip chip type semiconductor back surface Apr. 22, 2014
8691666 Method for producing chip with adhesive applied Apr. 8, 2014
8685795 Flank wettable semiconductor device Apr. 1, 2014
8679895 Method of making thin-wafer current sensors Mar. 25, 2014
8679931 Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device Mar. 25, 2014
8682466 Automatic virtual metrology for semiconductor wafer result prediction Mar. 25, 2014
8658515 Method of manufacturing film for semiconductor device Feb. 25, 2014
8652877 Method of manufacturing layered chip package Feb. 18, 2014
8652927 Integration of non-noble DRAM electrode Feb. 18, 2014
8647966 Method and apparatus for dicing die attach film on a semiconductor wafer Feb. 11, 2014
8642386 Heat spreader as mechanical reinforcement for ultra-thin die Feb. 4, 2014
8642389 Method of manufacturing a semiconductor device Feb. 4, 2014
8642390 Tape residue-free bump area after wafer back grinding Feb. 4, 2014
8633089 Die bonding method utilizing rotary wafer table Jan. 21, 2014
8617964 Laser processing method Dec. 31, 2013
8617928 Dicing/die bonding film Dec. 31, 2013
8614139 Dicing film with protecting film Dec. 24, 2013
8609473 Method for fabricating a neo-layer using stud bumped bare die Dec. 17, 2013
8592853 Semiconductor light emitting element Nov. 26, 2013
8586415 Dicing/die-bonding film, method of fixing chipped work and semiconductor device Nov. 19, 2013
8586422 Optical semiconductor device having pre-molded leadframe with window and method therefor Nov. 19, 2013
8574961 Method of marking a low profile packaged semiconductor device Nov. 5, 2013
8569108 Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die Oct. 29, 2013
8569877 Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide Oct. 29, 2013
8563359 Method for manufacturing semiconductor device, and semiconductor substrate Oct. 22, 2013
8563361 Packaging method of molded wafer level chip scale package (WLCSP) Oct. 22, 2013
8563404 Process for dividing wafer into individual chips and semiconductor chips Oct. 22, 2013
8552544 Package structure Oct. 8, 2013
8551817 Semiconductor substrate cutting method Oct. 8, 2013
8546210 Semiconductor device and method for manufacturing the same Oct. 1, 2013
8524537 Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue Sep. 3, 2013
8518741 Wafer-to-wafer process for manufacturing a stacked structure Aug. 27, 2013
8497161 Method for providing an LED chip with a peripheral protective film before cutting the same from a wafer Jul. 30, 2013
8492201 Semiconductor device and method of forming through vias with reflowed conductive material Jul. 23, 2013
8487434 Integrated circuit package system with redistribution layer and method for manufacturing thereof Jul. 16, 2013
8481342 Method of manufacturing semiconductor device, semiconductor device and semiconductor composite device Jul. 9, 2013
8450151 Micro surface mount device packaging May. 28, 2013
8431827 Circuit modules and method of managing the same Apr. 30, 2013
8431442 Methods of manufacturing semiconductor chips Apr. 30, 2013
8420450 Method of molding semiconductor package Apr. 16, 2013
8404496 Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state Mar. 26, 2013
8394678 Semiconductor chip stacked body and method of manufacturing the same Mar. 12, 2013
8383436 Manufacturing method for semiconductor chips, and semiconductor chip Feb. 26, 2013
8372689 Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof Feb. 12, 2013
8372695 Integrated circuit packaging system with stack interconnect and method of manufacture thereof Feb. 12, 2013
8367473 Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof Feb. 5, 2013
8357567 Manufacturing method of semiconductor device Jan. 22, 2013
8357564 Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die Jan. 22, 2013
8338234 Hybrid integrated circuit device and manufacturing method thereof Dec. 25, 2012

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