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Class Information
Number: 438/114
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Substrate dicing > Utilizing a coating to perfect the dicing
Description: Process including a step of coating the semiconductive substrate to enhance the dicing operation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615872 |
Semiconductor device |
Nov. 10, 2009 |
| 7608484 |
Non-pull back pad package with an additional solder standoff |
Oct. 27, 2009 |
| 7605021 |
Manufacturing method of electronic device |
Oct. 20, 2009 |
| 7592237 |
Laser processing method and object to be processed |
Sep. 22, 2009 |
| 7582513 |
Electronic device and method for producing electronic devices |
Sep. 1, 2009 |
| 7579260 |
Method of dividing an adhesive film bonded to a wafer |
Aug. 25, 2009 |
| 7575954 |
Ceramic substrate and method of breaking same |
Aug. 18, 2009 |
| 7572674 |
Method for manufacturing semiconductor device |
Aug. 11, 2009 |
| 7569409 |
Isolation structures for CMOS image sensor chip scale packages |
Aug. 4, 2009 |
| 7569423 |
Wafer-level-chip-scale package and method of fabrication |
Aug. 4, 2009 |
| 7563694 |
Scribe based bond pads for integrated circuits |
Jul. 21, 2009 |
| 7563643 |
Wafer processing apparatus |
Jul. 21, 2009 |
| 7552528 |
Wafer expanding device, component feeder, and expanding method for wafer sheet |
Jun. 30, 2009 |
| 7547577 |
Method of making circuitized substrate with solder paste connections |
Jun. 16, 2009 |
| 7534657 |
Method of manufacturing a semiconductor device |
May. 19, 2009 |
| 7517726 |
Wire bonded chip scale package fabrication methods |
Apr. 14, 2009 |
| 7517725 |
System and method for separating and packaging integrated circuits |
Apr. 14, 2009 |
| 7517724 |
Dicing/die bonding sheet |
Apr. 14, 2009 |
| 7510908 |
Method to dispense light blocking material for wafer level CSP |
Mar. 31, 2009 |
| 7510909 |
Fabricating method of wafer protection layers |
Mar. 31, 2009 |
| 7504318 |
Nanopowder coating for scribing and structures formed thereby |
Mar. 17, 2009 |
| 7504320 |
Method for manufacturing a tag integrated circuit flexible board |
Mar. 17, 2009 |
| 7501311 |
Fabrication method of a wafer structure |
Mar. 10, 2009 |
| 7501310 |
Structure of image sensor module and method for manufacturing of wafer level package |
Mar. 10, 2009 |
| 7495315 |
Method and apparatus of fabricating a semiconductor device by back grinding and dicing |
Feb. 24, 2009 |
| 7485548 |
Die loss estimation using universal in-line metric (UILM) |
Feb. 3, 2009 |
| 7482251 |
Etch before grind for semiconductor die singulation |
Jan. 27, 2009 |
| 7470567 |
Semiconductor device and method of manufacturing the same |
Dec. 30, 2008 |
| 7468293 |
Method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing |
Dec. 23, 2008 |
| 7465609 |
Method of manufacturing semiconductor device |
Dec. 16, 2008 |
| 7459343 |
Method of manufacturing semiconductor device and support structure for semiconductor substrate |
Dec. 2, 2008 |
| 7452747 |
Semiconductor package with contact support layer and method to produce the package |
Nov. 18, 2008 |
| 7452752 |
Production method of semiconductor chip |
Nov. 18, 2008 |
| 7452753 |
Method of processing a semiconductor wafer for manufacture of semiconductor device |
Nov. 18, 2008 |
| 7442580 |
Manufacturing method of a package structure |
Oct. 28, 2008 |
| 7429522 |
Dicing die-bonding film |
Sep. 30, 2008 |
| 7427527 |
Method for aligning devices |
Sep. 23, 2008 |
| 7416920 |
Semiconductor device protective structure and method for fabricating the same |
Aug. 26, 2008 |
| 7416921 |
Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin |
Aug. 26, 2008 |
| 7413927 |
Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages |
Aug. 19, 2008 |
| 7413931 |
Semiconductor device manufacturing method |
Aug. 19, 2008 |
| 7410831 |
Method and device for dividing plate-like member |
Aug. 12, 2008 |
| 7405100 |
Packaging of a semiconductor device with a non-opaque cover |
Jul. 29, 2008 |
| 7399682 |
Wafer processing method |
Jul. 15, 2008 |
| 7399683 |
Manufacturing method of semiconductor device |
Jul. 15, 2008 |
| 7387911 |
Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking |
Jun. 17, 2008 |
| 7387950 |
Method for forming a metal structure |
Jun. 17, 2008 |
| 7378293 |
MEMS fabrication method |
May. 27, 2008 |
| 7374971 |
Semiconductor die edge reconditioning |
May. 20, 2008 |
| 7371613 |
Semiconductor device and method of manufacturing the same |
May. 13, 2008 |
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