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Class Information
Number: 438/113
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Substrate dicing
Description: Process wherein a semiconductive substrate is divided into discrete individual units.










Sub-classes under this class:

Class Number Class Name Patents
438/114 Utilizing a coating to perfect the dicing 492


Patents under this class:

Patent Number Title Of Patent Date Issued
8373265 Package substrate having a through hole and method of fabricating the same Feb. 12, 2013
8372729 Integrated circuit devices with ESD protection in scribe line, and methods for fabricating same Feb. 12, 2013
8372694 Semiconductor package fabrication process and semiconductor package Feb. 12, 2013
8372691 Method of manufacturing semiconductor device Feb. 12, 2013
8372689 Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof Feb. 12, 2013
8367523 Method for manufacturing semiconductor light-emitting device and semiconductor light emitting device Feb. 5, 2013
8367522 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads Feb. 5, 2013
8367480 Semiconductor device and method of forming dam material around periphery of die to reduce warpage Feb. 5, 2013
8367475 Chip scale package assembly in reconstitution panel process format Feb. 5, 2013
8367474 Method of manufacturing integrated circuit having stress tuning layer Feb. 5, 2013
8367473 Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof Feb. 5, 2013
8367471 Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices Feb. 5, 2013
8361841 Mold array process method to encapsulate substrate cut edges Jan. 29, 2013
8358015 Layered chip package and method of manufacturing same Jan. 22, 2013
8358001 Semiconductor device packages, redistribution structures, and manufacturing methods thereof Jan. 22, 2013
8354349 Semiconductor device having sealing film and manufacturing method thereof Jan. 15, 2013
8354302 Semiconductor device fabrication method including formation of columnar electrodes having protrusion sections Jan. 15, 2013
8350380 Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product Jan. 8, 2013
8349657 Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices Jan. 8, 2013
8344484 Semiconductor device Jan. 1, 2013
8344258 Electric device Jan. 1, 2013
8343809 Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die Jan. 1, 2013
8343805 Mems device and fabrication method Jan. 1, 2013
8341828 Thin foil semiconductor package Jan. 1, 2013
8338288 Method of manufacturing semiconductor device Dec. 25, 2012
8338235 Package process of stacked type semiconductor device package structure Dec. 25, 2012
8338232 Power semiconductor device package method Dec. 25, 2012
8338203 Method for forming compound semiconductor light-emitting device Dec. 25, 2012
8338193 Semiconductor device Dec. 25, 2012
8334759 Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus Dec. 18, 2012
8334172 Manufacturing method of semiconductor device Dec. 18, 2012
8330272 Microelectronic packages with dual or multiple-etched flip-chip connectors Dec. 11, 2012
8329509 Packaging process to create wettable lead flank during board assembly Dec. 11, 2012
8329496 Dithered scanned laser beam for scribing solar cell structures Dec. 11, 2012
8324636 Method and apparatus for manufacturing LED devices using laser scribing Dec. 4, 2012
8324081 Wafer level surface passivation of stackable integrated circuit chips Dec. 4, 2012
8323516 Etching processes used in MEMS production Dec. 4, 2012
8319347 Electronic device package and fabrication method thereof Nov. 27, 2012
8319322 Substrate for semiconductor element, method for manufacturing substrate for semiconductor element, and semiconductor device Nov. 27, 2012
8318541 Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die Nov. 27, 2012
8318540 Method of manufacturing a semiconductor structure Nov. 27, 2012
8318519 Method for handling a semiconductor wafer assembly Nov. 27, 2012
8318047 Method for providing RF powder and RF powder-containing liquid Nov. 27, 2012
8313982 Stacked die assemblies including TSV die Nov. 20, 2012
8309454 Structure for electrostatic discharge in embedded wafer level packages Nov. 13, 2012
8309433 Method of manufacturing optical sensor Nov. 13, 2012
8309398 Electronic device wafer level scale packages and fabrication methods thereof Nov. 13, 2012
8309378 Method of fabricating a light emitting diode chip having phosphor coating layer Nov. 13, 2012
8309219 Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the same Nov. 13, 2012
8304920 Energy ray-curable polymer, an energy ray-curable adhesive composition, an adhesive sheet and a processing method of a semiconductor wafer Nov. 6, 2012











 
 
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