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Class Information
Number: 438/113
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Substrate dicing
Description: Process wherein a semiconductive substrate is divided into discrete individual units.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8237278 |
Configurable interposer |
Aug. 7, 2012 |
| 8236612 |
Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
Aug. 7, 2012 |
| 8236611 |
Die singulation method and package formed thereby |
Aug. 7, 2012 |
| 8236610 |
Forming semiconductor chip connections |
Aug. 7, 2012 |
| 8236608 |
Stacking package structure with chip embedded inside and die having through silicon via and method of the same |
Aug. 7, 2012 |
| 8222088 |
Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method |
Jul. 17, 2012 |
| 8222084 |
Method and system for template assisted wafer bonding |
Jul. 17, 2012 |
| 8222083 |
Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same |
Jul. 17, 2012 |
| 8222080 |
Fabrication method of package structure |
Jul. 17, 2012 |
| 8222078 |
Chip scale surface mounted semiconductor device package and process of manufacture |
Jul. 17, 2012 |
| 8216882 |
Method of producing a microelectromechanical (MEMS) sensor device |
Jul. 10, 2012 |
| 8216881 |
Method for fabricating a semiconductor and semiconductor package |
Jul. 10, 2012 |
| 8211750 |
Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor |
Jul. 3, 2012 |
| 8211749 |
Integrated circuit package system with waferscale spacer |
Jul. 3, 2012 |
| 8211261 |
Semiconductor manufacturing method of die pick-up from wafer |
Jul. 3, 2012 |
| 8207018 |
Semiconductor package |
Jun. 26, 2012 |
| 8202786 |
Method for manufacturing semiconductor devices having a glass substrate |
Jun. 19, 2012 |
| 8198175 |
Processing method for package substrate |
Jun. 12, 2012 |
| 8193039 |
Semiconductor chip with reinforcing through-silicon-vias |
Jun. 5, 2012 |
| 8193038 |
Method for manufacturing semiconductor device, semiconductor chip, and semiconductor wafer |
Jun. 5, 2012 |
| 8188404 |
Laser processing method and laser processing apparatus |
May. 29, 2012 |
| 8183092 |
Method of fabricating stacked semiconductor structure |
May. 22, 2012 |
| 8183091 |
Semiconductor integrated circuit device and process for manufacturing the same |
May. 22, 2012 |
| 8178972 |
Semiconductor device and manufacturing method therefor |
May. 15, 2012 |
| 8178423 |
Laser beam machining method and laser beam machining apparatus |
May. 15, 2012 |
| 8178415 |
Method for manufacturing RF powder |
May. 15, 2012 |
| 8178393 |
Semiconductor package and manufacturing method thereof |
May. 15, 2012 |
| 8168474 |
Self-dicing chips using through silicon vias |
May. 1, 2012 |
| 8168472 |
Semiconductor device having a semiconductor chip, and method for the production thereof |
May. 1, 2012 |
| 8168458 |
Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices |
May. 1, 2012 |
| 8163601 |
Chip-exposed semiconductor device and its packaging method |
Apr. 24, 2012 |
| 8158505 |
Method for manufacturing a semiconductor device, semiconductor chip and semiconductor wafer |
Apr. 17, 2012 |
| 8153507 |
Method of manufacturing high power array type semiconductor laser device |
Apr. 10, 2012 |
| 8153476 |
Electronic component and method of manufacturing the same |
Apr. 10, 2012 |
| 8153475 |
Back-end processes for substrates re-use |
Apr. 10, 2012 |
| 8153464 |
Wafer singulation process |
Apr. 10, 2012 |
| 8148809 |
Semiconductor device, method for manufacturing the same, and multilayer substrate having the same |
Apr. 3, 2012 |
| 8143112 |
Method for removing semiconductor street material |
Mar. 27, 2012 |
| 8143105 |
Semiconductor seal ring and method of manufacture thereof |
Mar. 27, 2012 |
| 8143081 |
Method for dicing a diced optoelectronic semiconductor wafer |
Mar. 27, 2012 |
| 8143080 |
Method for manufacturing LED package and substrate thereof |
Mar. 27, 2012 |
| 8138596 |
Method for manufacturing an element having electrically conductive members for application in a microelectronic package |
Mar. 20, 2012 |
| 8138027 |
Optical semiconductor device having pre-molded leadframe with window and method therefor |
Mar. 20, 2012 |
| 8138020 |
Wafer level integrated interconnect decal and manufacturing method thereof |
Mar. 20, 2012 |
| 8138014 |
Method of forming thin profile WLCSP with vertical interconnect over package footprint |
Mar. 20, 2012 |
| 8133761 |
Packaged system of semiconductor chips having a semiconductor interposer |
Mar. 13, 2012 |
| 8129627 |
Circuit board having semiconductor chip |
Mar. 6, 2012 |
| 8129259 |
Manufacturing method of preparing a substrate with forming and removing the check patterns in scribing regions before dicing to form semiconductor device |
Mar. 6, 2012 |
| 8129225 |
Method of manufacturing an integrated circuit module |
Mar. 6, 2012 |
| 8129219 |
Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same |
Mar. 6, 2012 |
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