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Class Information
Number: 438/113
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Substrate dicing
Description: Process wherein a semiconductive substrate is divided into discrete individual units.










Sub-classes under this class:

Class Number Class Name Patents
438/114 Utilizing a coating to perfect the dicing 501


Patents under this class:

Patent Number Title Of Patent Date Issued
8420414 Method of manufacturing light-emitting device Apr. 16, 2013
8409927 Methods for fabricating integrated circuit systems including high reliability die under-fill Apr. 2, 2013
8409926 Semiconductor device and method of forming insulating layer around semiconductor die Apr. 2, 2013
8405210 Method for producing a plurality of chips and a chip produced accordingly Mar. 26, 2013
8404522 Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device Mar. 26, 2013
8404516 Method for producing a MEMS package Mar. 26, 2013
8404496 Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state Mar. 26, 2013
8399295 Semiconductor device and its manufacture method Mar. 19, 2013
8399294 Semiconductor package for discharging heat and method for fabricating the same Mar. 19, 2013
8395241 Through silicon via guard ring Mar. 12, 2013
8395239 Grounded seal ring structure in semiconductor devices Mar. 12, 2013
8394678 Semiconductor chip stacked body and method of manufacturing the same Mar. 12, 2013
8394677 Method of fabricating semiconductor device Mar. 12, 2013
8392011 Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processin Mar. 5, 2013
8389386 Stacked wafer manufacturing method Mar. 5, 2013
8389335 Chip Scale Package structure with can attachment Mar. 5, 2013
8389334 Foil-based method for packaging intergrated circuits Mar. 5, 2013
8384197 Semiconductor device and method for manufacturing same Feb. 26, 2013
8383457 Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect Feb. 26, 2013
8383436 Manufacturing method for semiconductor chips, and semiconductor chip Feb. 26, 2013
8382995 Piezoelectric devices and methods for manufacturing same Feb. 26, 2013
8373269 Jigs with controlled spacing for bonding dies onto package substrates Feb. 12, 2013
8373265 Package substrate having a through hole and method of fabricating the same Feb. 12, 2013
8372729 Integrated circuit devices with ESD protection in scribe line, and methods for fabricating same Feb. 12, 2013
8372694 Semiconductor package fabrication process and semiconductor package Feb. 12, 2013
8372691 Method of manufacturing semiconductor device Feb. 12, 2013
8372689 Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof Feb. 12, 2013
8367523 Method for manufacturing semiconductor light-emitting device and semiconductor light emitting device Feb. 5, 2013
8367522 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads Feb. 5, 2013
8367480 Semiconductor device and method of forming dam material around periphery of die to reduce warpage Feb. 5, 2013
8367475 Chip scale package assembly in reconstitution panel process format Feb. 5, 2013
8367474 Method of manufacturing integrated circuit having stress tuning layer Feb. 5, 2013
8367473 Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof Feb. 5, 2013
8367471 Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices Feb. 5, 2013
8361841 Mold array process method to encapsulate substrate cut edges Jan. 29, 2013
8358015 Layered chip package and method of manufacturing same Jan. 22, 2013
8358001 Semiconductor device packages, redistribution structures, and manufacturing methods thereof Jan. 22, 2013
8354349 Semiconductor device having sealing film and manufacturing method thereof Jan. 15, 2013
8354302 Semiconductor device fabrication method including formation of columnar electrodes having protrusion sections Jan. 15, 2013
8350380 Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product Jan. 8, 2013
8349657 Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices Jan. 8, 2013
8344484 Semiconductor device Jan. 1, 2013
8344258 Electric device Jan. 1, 2013
8343809 Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die Jan. 1, 2013
8343805 Mems device and fabrication method Jan. 1, 2013
8341828 Thin foil semiconductor package Jan. 1, 2013
8338288 Method of manufacturing semiconductor device Dec. 25, 2012
8338235 Package process of stacked type semiconductor device package structure Dec. 25, 2012
8338232 Power semiconductor device package method Dec. 25, 2012
8338203 Method for forming compound semiconductor light-emitting device Dec. 25, 2012











 
 
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