Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/113
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Substrate dicing
Description: Process wherein a semiconductive substrate is divided into discrete individual units.










Sub-classes under this class:

Class Number Class Name Patents
438/114 Utilizing a coating to perfect the dicing 503


Patents under this class:

Patent Number Title Of Patent Date Issued
8712575 Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder Apr. 29, 2014
8710635 Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die Apr. 29, 2014
8709878 Methods of packaging imager devices and optics modules, and resulting assemblies Apr. 29, 2014
8709874 Manufacturing method for semiconductor device carrier and semiconductor package using the same Apr. 29, 2014
8709868 Sensor packages and method of packaging dies of differing sizes Apr. 29, 2014
8704382 Film for flip chip type semiconductor back surface Apr. 22, 2014
8703513 Method for manufacturing light emitting apparatus, light emitting apparatus, and mounting base thereof Apr. 22, 2014
8693209 Wiring board and method for manufacturing the same Apr. 8, 2014
8685795 Flank wettable semiconductor device Apr. 1, 2014
8681133 Display driver integrated circuit which stores output mode of driving circuit control signal in non-volatile memory and method of outputting the driving circuit control signal Mar. 25, 2014
8679896 DC/DC converter power module package incorporating a stacked controller and construction methodology Mar. 25, 2014
8679895 Method of making thin-wafer current sensors Mar. 25, 2014
8673743 Wafer dividing method Mar. 18, 2014
8673690 Method for manufacturing a semiconductor device and a semiconductor device Mar. 18, 2014
8673662 Light-emitting diode cutting method and product thereof Mar. 18, 2014
8669646 Apparatus and method for grounding an IC package lid for EMI reduction Mar. 11, 2014
8669138 Semiconductor device and method for manufacturing the same Mar. 11, 2014
8664089 Semiconductor die singulation method Mar. 4, 2014
8664042 Method for fabrication of configurable systems Mar. 4, 2014
8664025 Substrate dicing technique for separating semiconductor dies with reduced area consumption Mar. 4, 2014
8659160 Die structure, manufacturing method and substrate thereof Feb. 25, 2014
8654537 Printed circuit board with integral radio-frequency shields Feb. 18, 2014
8653644 Packaged semiconductor chips with array Feb. 18, 2014
8653629 Semiconductor device and wafer Feb. 18, 2014
8652941 Wafer dicing employing edge region underfill removal Feb. 18, 2014
8652938 Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device Feb. 18, 2014
8648444 Wafer scribe line structure for improving IC reliability Feb. 11, 2014
8647966 Method and apparatus for dicing die attach film on a semiconductor wafer Feb. 11, 2014
8647963 Structure and method of wafer level chip molded packaging Feb. 11, 2014
8642397 Semiconductor wafer level package (WLP) and method of manufacture thereof Feb. 4, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8642387 Method of fabricating stacked packages using laser direct structuring Feb. 4, 2014
8642386 Heat spreader as mechanical reinforcement for ultra-thin die Feb. 4, 2014
8642385 Wafer level package structure and the fabrication method thereof Feb. 4, 2014
8642381 Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die Feb. 4, 2014
8637977 Semiconductor device and method of packaging a semiconductor device with a clip Jan. 28, 2014
8637969 Stacked chips in a semiconductor package Jan. 28, 2014
8637351 Methods for making micro needles and applications thereof Jan. 28, 2014
8637350 Method of manufacturing chip-stacked semiconductor package Jan. 28, 2014
8633091 Chip package and fabrication method thereof Jan. 21, 2014
8633089 Die bonding method utilizing rotary wafer table Jan. 21, 2014
8633037 Semiconductor device Jan. 21, 2014
8623703 Silicon device and silicon device manufacturing method Jan. 7, 2014
8623700 Inter-chip communication Jan. 7, 2014
8617964 Laser processing method Dec. 31, 2013
8617930 Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device Dec. 31, 2013
8617929 On-Chip RF shields with front side redistribution lines Dec. 31, 2013
8617928 Dicing/die bonding film Dec. 31, 2013
8617927 Method of mounting electronic chips Dec. 31, 2013
8610238 Crack stop trenches Dec. 17, 2013











 
 
  Recently Added Patents
Methods and systems for optimizing data accesses
Managing imaging of computing devices
Predicting performance of an integrated circuit
Image coding apparatus and image decoding apparatus
Economic filtering system for delivery of permission based, targeted, incentivized advertising
Wafer-level chip scale package
Generating a network map
  Randomly Featured Patents
Aqueous polymer mixture, process for its preparation and its use as substrate anchoring, blocking resistant one-coat sealing lacquer on sheet products
Automatic machine for applying a spacer tape made of flexible material to flat glass panes, particularly glass panes for manufacturing double-glazing units
Fluid responsive vent control valve with peel-away opening action
Using programmable latch to implement logic
Cap with shortened bill
Method for storing hydrogen, and related articles and systems
Chair
Composite carbon sheet, and electrochemical cells made therewith
Adjusting arrangement for a steering column tube of a steering system of a motor vehicle
Ready-to-use composition for the oxidation dyeing of keratin fibers comprising at least one fatty substance, at least one oxidation chosen from 4,5-diaminopyrazoles and acid addition salts the