| |
 |
|
Class Information
Number: 438/113
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Substrate dicing
Description: Process wherein a semiconductive substrate is divided into discrete individual units.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618846 |
Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device |
Nov. 17, 2009 |
| 7618847 |
Bonding method of semiconductor and laminated structure fabricated thereby |
Nov. 17, 2009 |
| 7618878 |
Wafer dividing method |
Nov. 17, 2009 |
| 7619158 |
Thermoelectric device having P-type and N-type materials |
Nov. 17, 2009 |
| 7615413 |
Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component |
Nov. 10, 2009 |
| 7615414 |
Dental intraoral radiological image sensor with a fiber-optic plate |
Nov. 10, 2009 |
| 7615410 |
Chip-sized flip-chip semiconductor package and method for making the same |
Nov. 10, 2009 |
| 7615407 |
Methods and systems for packaging integrated circuits with integrated passive components |
Nov. 10, 2009 |
| 7611925 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Nov. 3, 2009 |
| 7611927 |
Method of minimizing kerf width on a semiconductor substrate panel |
Nov. 3, 2009 |
| 7608483 |
Method of machining wafer |
Oct. 27, 2009 |
| 7608481 |
Method for producing semiconductor package |
Oct. 27, 2009 |
| 7608484 |
Non-pull back pad package with an additional solder standoff |
Oct. 27, 2009 |
| 7605021 |
Manufacturing method of electronic device |
Oct. 20, 2009 |
| 7605019 |
Semiconductor device with stacked chips and method for manufacturing thereof |
Oct. 20, 2009 |
| 7598120 |
Method for holding semiconductor wafer |
Oct. 6, 2009 |
| 7598154 |
Manufacturing method of semiconductor device |
Oct. 6, 2009 |
| 7595226 |
Method of packaging an integrated circuit die |
Sep. 29, 2009 |
| 7592636 |
Radiation-emitting semiconductor component and method for the production thereof |
Sep. 22, 2009 |
| 7592594 |
Method of construction of CTE matching structure with wafer processing and resulting structure |
Sep. 22, 2009 |
| 7592237 |
Laser processing method and object to be processed |
Sep. 22, 2009 |
| 7592236 |
Method for applying a structure of joining material to the back surfaces of semiconductor chips |
Sep. 22, 2009 |
| 7592203 |
Method of manufacturing an electronic protection device |
Sep. 22, 2009 |
| 7585689 |
Method for manufacturing semiconductor laser device and method for inspecting semiconductor laser bar |
Sep. 8, 2009 |
| 7582512 |
Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device |
Sep. 1, 2009 |
| 7579260 |
Method of dividing an adhesive film bonded to a wafer |
Aug. 25, 2009 |
| 7579215 |
Method for fabricating a low cost integrated circuit (IC) package |
Aug. 25, 2009 |
| 7579216 |
Method of manufacturing a semiconductor device |
Aug. 25, 2009 |
| 7575954 |
Ceramic substrate and method of breaking same |
Aug. 18, 2009 |
| 7572673 |
Wafer level package having a stress relief spacer and manufacturing method thereof |
Aug. 11, 2009 |
| 7572350 |
Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate |
Aug. 11, 2009 |
| 7569421 |
Through-hole via on saw streets |
Aug. 4, 2009 |
| 7569422 |
Chip package and method for fabricating the same |
Aug. 4, 2009 |
| 7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit |
Jul. 28, 2009 |
| 7567735 |
Optical device wafer, and optical device chip and method for manufacturing the same |
Jul. 28, 2009 |
| 7563694 |
Scribe based bond pads for integrated circuits |
Jul. 21, 2009 |
| 7563642 |
Manufacturing method of a semiconductor device |
Jul. 21, 2009 |
| 7563652 |
Method for encapsulating sensor chips |
Jul. 21, 2009 |
| 7560371 |
Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum |
Jul. 14, 2009 |
| 7560307 |
Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same |
Jul. 14, 2009 |
| 7560302 |
Semiconductor device fabricating method |
Jul. 14, 2009 |
| 7560801 |
Rewiring substrate strip with several semiconductor component positions |
Jul. 14, 2009 |
| 7556985 |
Method of fabricating semiconductor device |
Jul. 7, 2009 |
| 7557017 |
Method of manufacturing semiconductor device with two-step etching of layer |
Jul. 7, 2009 |
| 7553745 |
Integrated circuit package, panel and methods of manufacturing the same |
Jun. 30, 2009 |
| 7553700 |
Chemical-enhanced package singulation process |
Jun. 30, 2009 |
| 7553698 |
Semiconductor package having semiconductor constructing body and method of manufacturing the same |
Jun. 30, 2009 |
| 7552528 |
Wafer expanding device, component feeder, and expanding method for wafer sheet |
Jun. 30, 2009 |
| 7549560 |
Wafer dividing method |
Jun. 23, 2009 |
| 7547572 |
Method of protecting semiconductor chips from mechanical and ESD damage during handling |
Jun. 16, 2009 |
|
|
|
