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Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7413995 Etched interposer for integrated circuit devices Aug. 19, 2008
7414303 Lead on chip semiconductor package Aug. 19, 2008
7407832 Method for manufacturing semiconductor package Aug. 5, 2008
7405106 Quad flat no-lead chip carrier with stand-off Jul. 29, 2008
7399658 Pre-molded leadframe and method therefor Jul. 15, 2008
7391119 Temperature sustaining flip chip assembly process Jun. 24, 2008
7384805 Transfer mold semiconductor packaging processes Jun. 10, 2008
7378301 Method for molding a small form factor digital memory card May. 27, 2008
7374965 Manufacturing method of semiconductor device May. 20, 2008
7374969 Semiconductor package with conductive molding compound and manufacturing method thereof May. 20, 2008
7371606 Manufacturing method of a semiconductor device May. 13, 2008
7371610 Process for fabricating an integrated circuit package with reduced mold warping May. 13, 2008
7372170 Flip chip interconnection pad layout May. 13, 2008
7368320 Method of fabricating a two die semiconductor assembly May. 6, 2008
7364784 Thin semiconductor package having stackable lead frame and method of manufacturing the same Apr. 29, 2008
7364944 Method for fabricating thermally enhanced semiconductor package Apr. 29, 2008
7364948 Method for fabricating semiconductor package Apr. 29, 2008
7358115 Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides Apr. 15, 2008
7354796 Method for fabricating semiconductor package free of substrate Apr. 8, 2008
7352071 Method of fabricating anti-warp package Apr. 1, 2008
7351611 Method of making the mould for encapsulating a leadframe package Apr. 1, 2008
7338838 Resin-encapsulation semiconductor device and method for fabricating the same Mar. 4, 2008
7319042 Method and apparatus for manufacture and inspection of semiconductor device Jan. 15, 2008
7314778 Wafer-level processing of chip-packaging compositions including bis-maleimides Jan. 1, 2008
7312106 Method for encapsulating a chip having a sensitive surface Dec. 25, 2007
RE39957 Method of making semiconductor package with heat spreader Dec. 25, 2007
7306974 Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies Dec. 11, 2007
7306971 Semiconductor chip packaging method with individually placed film adhesive pieces Dec. 11, 2007
7303947 Source bridge for cooling and/or external connection Dec. 4, 2007
7294530 Method for encapsulating multiple integrated circuits Nov. 13, 2007
7288439 Leadless microelectronic package and a method to maximize the die size in the package Oct. 30, 2007
7285442 Stackable ceramic FBGA for high thermal applications Oct. 23, 2007
7285444 Method of manufacturing semiconductor device Oct. 23, 2007
7282396 Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body Oct. 16, 2007
7271032 Leadless plastic chip carrier with etch back pad singulation Sep. 18, 2007
7270867 Leadless plastic chip carrier Sep. 18, 2007
7262074 Methods of fabricating underfilled, encapsulated semiconductor die assemblies Aug. 28, 2007
7262082 Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture Aug. 28, 2007
7256066 Flip chip packaging process Aug. 14, 2007
7253026 Ultra-thin semiconductor package device and method for manufacturing the same Aug. 7, 2007
7253532 Electrical or electronic component and method of producing same Aug. 7, 2007
7250687 Systems for degating packaged semiconductor devices with tape substrates Jul. 31, 2007
7250328 Microelectronic component assemblies with recessed wire bonds and methods of making same Jul. 31, 2007
7247267 Mold and method of molding semiconductor devices Jul. 24, 2007
7247517 Method and apparatus for a dual substrate package Jul. 24, 2007
7247519 Method for making a semiconductor multi-package module having inverted bump chip carrier second package Jul. 24, 2007
7247521 Semiconductor assembly encapsulation mold and method for forming same Jul. 24, 2007
7245001 Multi-layer integrated circuit package Jul. 17, 2007
7238549 Surface-mounting semiconductor device and method of making the same Jul. 3, 2007
7238548 Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip- Jul. 3, 2007

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