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Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7611925 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument Nov. 3, 2009
7611981 Optimized circuit design layout for high performance ball grid array packages Nov. 3, 2009
7608930 Semiconductor device and method of manufacturing semiconductor device Oct. 27, 2009
7608482 Integrated circuit package with molded insulation Oct. 27, 2009
7598122 Die attach method and microarray leadframe structure Oct. 6, 2009
7598123 Semiconductor component and method of manufacture Oct. 6, 2009
7595225 Leadless plastic chip carrier with contact standoff Sep. 29, 2009
7592694 Chip package and method of manufacturing the same Sep. 22, 2009
7579219 Semiconductor device with a protected active die region and method therefor Aug. 25, 2009
7566648 Method of making solder pad Jul. 28, 2009
7563644 Optical device and method for fabricating the same Jul. 21, 2009
7563648 Semiconductor device package and method for manufacturing same Jul. 21, 2009
7556983 Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same Jul. 7, 2009
7556984 Package structure of chip and the package method thereof Jul. 7, 2009
7556986 Tape supported memory card leadframe structure Jul. 7, 2009
7552532 Method for hermetically encapsulating a component Jun. 30, 2009
7544541 Semiconductor package Jun. 9, 2009
7537967 Mold cleaning sheet and manufacturing method of a semiconductor device using the same May. 26, 2009
7531432 Block-molded semiconductor device singulation methods and systems May. 12, 2009
7528007 Methods for assembling semiconductor devices and interposers May. 5, 2009
7528014 Semiconductor device and method of manufacturing the same May. 5, 2009
7524698 Handling and positioning of metallic plated balls for socket application in ball grid array packages Apr. 28, 2009
7521290 Method of manufacturing circuit device Apr. 21, 2009
7517722 Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds Apr. 14, 2009
7514296 Method for manufacturing semiconductor device Apr. 7, 2009
7514293 Method of manufacturing a semiconductor device Apr. 7, 2009
7514292 Individualized low parasitic power distribution lines deposited over active integrated circuits Apr. 7, 2009
7510889 Light emitting chip package and manufacturing method thereof Mar. 31, 2009
7507606 Semiconductor device and method of manufacturing the same Mar. 24, 2009
7508054 Semiconductor device and a method of manufacturing the same Mar. 24, 2009
7504714 Chip package with asymmetric molding Mar. 17, 2009
7498678 Electronic assemblies and systems with filled no-flow underfill Mar. 3, 2009
7494843 Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding Feb. 24, 2009
7491570 Die package having an adhesive flow restriction area Feb. 17, 2009
7485493 Singulating surface-mountable semiconductor devices and fitting external contacts to said devices Feb. 3, 2009
7482193 Injection-molded package for MEMS inertial sensor Jan. 27, 2009
7482202 Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof Jan. 27, 2009
7479413 Method for fabricating semiconductor package with circuit side polymer layer Jan. 20, 2009
7473584 Method for fabricating a fan-in leadframe semiconductor package Jan. 6, 2009
7470978 Sawn power package and method of fabricating same Dec. 30, 2008
7468294 Semiconductor device and a method of manufacturing the same Dec. 23, 2008
7459345 Packaging method for an electronic element Dec. 2, 2008
7459348 Method for manufacturing a semiconductor device Dec. 2, 2008
7456049 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same Nov. 25, 2008
7456500 Light source module and method for production thereof Nov. 25, 2008
7451539 Method of making a conformal electromagnetic interference shield Nov. 18, 2008
7449362 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material Nov. 11, 2008
7445968 Methods for integrated circuit module packaging and integrated circuit module packages Nov. 4, 2008
7435625 Semiconductor device with reduced package cross-talk and loss Oct. 14, 2008
7429500 Method of manufacturing a semiconductor device Sep. 30, 2008

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