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Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7790509 Method for fine-pitch, low stress flip-chip interconnect Sep. 7, 2010
7791192 Circuit for and method of implementing a capacitor in an integrated circuit Sep. 7, 2010
7785928 Integrated circuit device and method of manufacturing thereof Aug. 31, 2010
7785929 Mountable integrated circuit package system with exposed external interconnects Aug. 31, 2010
7781262 Method for producing semiconductor device and semiconductor device Aug. 24, 2010
7781261 Integrated circuit package system with offset stacking and anti-flash structure Aug. 24, 2010
7781259 Method of manufacturing a semiconductor using a rigid substrate Aug. 24, 2010
7772036 Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing Aug. 10, 2010
7772026 MEMS device package and method for manufacturing the same Aug. 10, 2010
7768125 Multi-chip package system Aug. 3, 2010
7763494 Semiconductor device package with multi-chips and method of the same Jul. 27, 2010
7763498 Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package Jul. 27, 2010
7759167 Method for embedding dies Jul. 20, 2010
7759155 Optical data transceivers Jul. 20, 2010
7754531 Method for packaging microelectronic devices Jul. 13, 2010
7754527 LED and method of manufacturing the same Jul. 13, 2010
7750443 Semiconductor device package Jul. 6, 2010
7732259 Non-leaded semiconductor package and a method to assemble the same Jun. 8, 2010
7732258 Lead frame and method for fabricating semiconductor package employing the same Jun. 8, 2010
7723159 Package-on-package using through-hole via die on saw streets May. 25, 2010
7723129 Power semiconductor devices having integrated inductor May. 25, 2010
7719094 Semiconductor package and manufacturing method thereof May. 18, 2010
7713784 Thin quad flat package with no leads (QFN) fabrication methods May. 11, 2010
7713783 Electronic component package, electronic component using the package, and method for manufacturing electronic component package May. 11, 2010
7704794 Method of forming a semiconductor device Apr. 27, 2010
7704791 Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface Apr. 27, 2010
7700412 Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers Apr. 20, 2010
7696003 Microelectronic component assemblies with recessed wire bonds and methods of making same Apr. 13, 2010
7691681 Chip scale package having flip chip interconnect on die paddle Apr. 6, 2010
7691677 Method of manufacturing a semiconductor device Apr. 6, 2010
7691676 Mold array process for semiconductor packages Apr. 6, 2010
7691675 Encapsulating electrical connections Apr. 6, 2010
7691674 Integrated circuit packaging system with stacked device and method of manufacturing thereof Apr. 6, 2010
7687925 Alignment marks for polarized light lithography and method for use thereof Mar. 30, 2010
7682873 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages Mar. 23, 2010
7682874 Chip scale package (CSP) assembly apparatus and method Mar. 23, 2010
7682878 Encapsulation circuitry on a substrate Mar. 23, 2010
7678592 LED housing and fabrication method thereof Mar. 16, 2010
7670866 Multi-die molded substrate integrated circuit device Mar. 2, 2010
7671453 Semiconductor device and method for producing the same Mar. 2, 2010
7671463 Integrated circuit package system with ground ring Mar. 2, 2010
7662666 Method of processing wafer Feb. 16, 2010
7662667 Die rearrangement package structure using layout process to form a compliant configuration Feb. 16, 2010
7662672 Manufacturing process of leadframe-based BGA packages Feb. 16, 2010
7659146 Manufacturing method of semiconductor device Feb. 9, 2010
7655508 Overmolding encapsulation process and encapsulated article made therefrom Feb. 2, 2010
7648857 Process for precision placement of integrated circuit overcoat material Jan. 19, 2010
7642128 Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Jan. 5, 2010
7618845 Fabrication of an integrated circuit package Nov. 17, 2009
7614888 Flip chip package process Nov. 10, 2009

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