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Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8409918 Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting Apr. 2, 2013
8394673 Semiconductor device Mar. 12, 2013
8394676 Marking method for semiconductor device and semiconductor device provided with markings Mar. 12, 2013
8389330 Integrated circuit package system with package stand-off and method of manufacture thereof Mar. 5, 2013
8389333 Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die Mar. 5, 2013
8390105 Lead frame substrate, manufacturing method thereof, and semiconductor apparatus Mar. 5, 2013
8384203 Packaging structural member Feb. 26, 2013
8377749 Integrated circuit transmission line Feb. 19, 2013
8373258 Semiconductor device and production method thereof Feb. 12, 2013
8365385 Processing apparatus and method Feb. 5, 2013
8366982 Differential pressure underfill process and equipment Feb. 5, 2013
8361840 Thermal barrier layer for integrated circuit manufacture Jan. 29, 2013
8362598 Semiconductor device with electromagnetic interference shielding Jan. 29, 2013
8357566 Pre-encapsulated lead frames for microelectronic device packages, and associated methods Jan. 22, 2013
8354301 Packaged microdevices and methods for manufacturing packaged microdevices Jan. 15, 2013
8354304 Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant Jan. 15, 2013
8349656 Manufacturing method of leadframe and semiconductor device Jan. 8, 2013
8338235 Package process of stacked type semiconductor device package structure Dec. 25, 2012
8338935 Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same Dec. 25, 2012
8334601 Package-on-package system with through vias and method of manufacture thereof Dec. 18, 2012
8334174 Chip scale package and fabrication method thereof Dec. 18, 2012
8329509 Packaging process to create wettable lead flank during board assembly Dec. 11, 2012
8324026 Method for manufacturing a semiconductor component Dec. 4, 2012
8319246 Semiconductor device and method for manufacturing same Nov. 27, 2012
8313982 Stacked die assemblies including TSV die Nov. 20, 2012
RE43818 Fabrication of an integrated circuit package Nov. 20, 2012
8309400 Leadframe package structure and manufacturing method thereof Nov. 13, 2012
8309385 Inertial sensor, inertial sensor device and manufacturing method of the same Nov. 13, 2012
8304869 Fan-in interposer on lead frame for an integrated circuit package on package system Nov. 6, 2012
8304870 Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device Nov. 6, 2012
8304883 Semiconductor device having multiple semiconductor elements Nov. 6, 2012
8296941 Conformal shielding employing segment buildup Oct. 30, 2012
8293588 Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer Oct. 23, 2012
8293580 Method of forming package-on-package and device related thereto Oct. 23, 2012
8293576 Semiconductor device and method of manufacturing the same Oct. 23, 2012
8293572 Injection molding system and method of chip package Oct. 23, 2012
8288201 Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die Oct. 16, 2012
8288209 Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die Oct. 16, 2012
8283761 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Oct. 9, 2012
8278150 Stackable packages for three-dimensional packaging of semiconductor dice Oct. 2, 2012
8278149 Package with multiple dies Oct. 2, 2012
8278146 Manufacturing method of chip package with coplanarity controlling feature Oct. 2, 2012
8278141 Integrated circuit package system with internal stacking module Oct. 2, 2012
8273586 Light emitting device and manufacturing method thereof Sep. 25, 2012
8273587 Underfill process for flip-chip LEDs Sep. 25, 2012
8273603 Interposers, electronic modules, and methods for forming the same Sep. 25, 2012
8263876 Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same Sep. 11, 2012
8258018 Manufacturing method of semiconductor device Sep. 4, 2012
8252629 Method for making a stackable package Aug. 28, 2012
8247909 Semiconductor package device with cavity structure and the packaging method thereof Aug. 21, 2012

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