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Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8546190 Method for positioning chips during the production of a reconstituted wafer Oct. 1, 2013
8541260 Exposed die overmolded flip chip package and fabrication method Sep. 24, 2013
8536715 Semiconductor device and method of manufacturing the same Sep. 17, 2013
8535986 Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame Sep. 17, 2013
8535982 Providing an automatic optical inspection feature for solder joints on semiconductor packages Sep. 17, 2013
8535981 Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof Sep. 17, 2013
8528195 Layout method for electronic components of double-sided surface mount circuit board Sep. 10, 2013
8530279 Offset gravure printing process for improved mold compound and die attach adhesive adhesion on leadframe surface using selective adhesion promoter Sep. 10, 2013
8530280 Integrated circuit package system with contoured encapsulation and method for manufacturing thereof Sep. 10, 2013
8524535 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board Sep. 3, 2013
8519526 Semiconductor package and fabrication method thereof Aug. 27, 2013
8518747 Stackable semiconductor assemblies and methods of manufacturing such assemblies Aug. 27, 2013
8518746 Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die Aug. 27, 2013
8518722 Method for detecting the under-fill void in flip chip BGA Aug. 27, 2013
8513059 Pre-molded clip structure Aug. 20, 2013
8507319 Integrated circuit package system with shield Aug. 13, 2013
8501517 Method of assembling pressure sensor device Aug. 6, 2013
8501539 Semiconductor device package Aug. 6, 2013
8497575 Semiconductor packaging system with an aligned interconnect and method of manufacture thereof Jul. 30, 2013
8497158 Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component Jul. 30, 2013
8492181 Embedded wafer level optical package structure and manufacturing method Jul. 23, 2013
8492200 Method for fabricating a semiconductor and semiconductor package Jul. 23, 2013
8481367 Method of manufacturing circuit device Jul. 9, 2013
8481420 Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof Jul. 9, 2013
8482111 Stackable molded microelectronic packages Jul. 9, 2013
8476113 Method of manufacturing semiconductor device Jul. 2, 2013
8476748 Exposed die overmolded flip chip package and fabrication method Jul. 2, 2013
8470641 Exposed mold Jun. 25, 2013
8466009 Method of fabricating a semiconductor package with mold lock opening Jun. 18, 2013
8466539 MRAM device and method of assembling same Jun. 18, 2013
8460969 Method for encapsulating an electronic arrangement Jun. 11, 2013
8460970 Lead frame ball grid array with traces under die having interlocking features Jun. 11, 2013
8460972 Method of forming semiconductor package Jun. 11, 2013
8461676 Soldering relief method and semiconductor device employing same Jun. 11, 2013
8450153 Package manufacturing method and semiconductor device May. 28, 2013
8450151 Micro surface mount device packaging May. 28, 2013
8450149 Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology May. 28, 2013
8450148 Molding compound adhesion for map-molded flip-chip May. 28, 2013
8445321 Semiconductor device and method of manufacturing the same May. 21, 2013
8445934 Organic light emitting diode display and method for manufacturing the same May. 21, 2013
8441114 Electronic circuit composed of sub-circuits and method for producing May. 14, 2013
8435867 Method of manufacturing semiconductor device and method of manufacturing electronic device May. 7, 2013
8435837 Panel based lead frame packaging method and device May. 7, 2013
8435834 Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP May. 7, 2013
8431827 Circuit modules and method of managing the same Apr. 30, 2013
8431950 Light emitting device package structure and fabricating method thereof Apr. 30, 2013
8426249 Chip part manufacturing method and chip parts Apr. 23, 2013
8420451 Manufacturing method of semiconductor device Apr. 16, 2013
8420450 Method of molding semiconductor package Apr. 16, 2013
8420437 Method for forming an EMI shielding layer on all surfaces of a semiconductor package Apr. 16, 2013

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