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Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6130116 Method of encapsulating a microelectronic assembly utilizing a barrier Oct. 10, 2000
6130115 Plastic encapsulated semiconductor device and method of manufacturing the same Oct. 10, 2000
6127205 Process for manufacturing a molded electronic component having pre-plated lead terminals Oct. 3, 2000
6124151 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Sep. 26, 2000
6120301 Semiconductor device and method of manufacturing the same Sep. 19, 2000
6114189 Molded array integrated circuit package Sep. 5, 2000
6111303 Non-contact electronic card and its manufacturing process Aug. 29, 2000
6103554 Method for packaging integrated circuits with elastomer chip carriers Aug. 15, 2000
6101593 IBM PC compatible multi-chip module Aug. 8, 2000
6083768 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components Jul. 4, 2000
6081978 Resin-encapsulated semiconductor device producing apparatus and method Jul. 4, 2000
6080602 Method of producing a semiconductor device using a reduced mounting area Jun. 27, 2000
6077727 Method for manufacturing lead frame Jun. 20, 2000
6071758 Process for manufacturing a chip card micromodule with protection barriers Jun. 6, 2000
6066512 Semiconductor device, method of fabricating the same, and electronic apparatus May. 23, 2000
6063139 Apparatus for continuous assembly of a semiconductor lead frame package May. 16, 2000
6060341 Method of making an electronic package May. 9, 2000
6057179 Method and structure for packaging an integrated circuit with readily removed excess encapsulant on degating region May. 2, 2000
6048744 Integrated circuit package alignment feature Apr. 11, 2000
6043111 Small size semiconductor package Mar. 28, 2000
6033933 Method for attaching a removable tape to encapsulate a semiconductor package Mar. 7, 2000
6033934 Semiconductor chip fabrication method and apparatus therefor Mar. 7, 2000
6008074 Method of forming a synchronous-link dynamic random access memory edge-mounted device Dec. 28, 1999
6008073 Method of manufacturing a bus bar structure on lead frame of semiconductor device package Dec. 28, 1999
6001671 Methods for manufacturing a semiconductor package having a sacrificial layer Dec. 14, 1999
5985695 Method of making a molded flex circuit ball grid array Nov. 16, 1999
5981314 Near chip size integrated circuit package Nov. 9, 1999
5981312 Method for injection molded flip chip encapsulation Nov. 9, 1999
5972736 Integrated circuit package and method Oct. 26, 1999
5970323 Injection of encapsulating material on an optocomponent Oct. 19, 1999
5963782 Semiconductor component and method of manufacture Oct. 5, 1999
5963792 Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device Oct. 5, 1999
5937278 Method of manufacturing lead frame having inner lead connected to outer lead by metal etch stop layer Aug. 10, 1999
5920768 Manufacturing method for a resin sealed semiconductor device Jul. 6, 1999
5910010 Semiconductor integrated circuit device, and process and apparatus for manufacturing the same Jun. 8, 1999
5879965 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Mar. 9, 1999
5869355 Lead frame with increased strength and manufacture of semiconductor device Feb. 9, 1999
5858815 Semiconductor package and method for fabricating the same Jan. 12, 1999
5855954 Composite structure for manufacturing a microelectronic component and a process for manufacturing the composite structure Jan. 5, 1999
5842257 Apparatus for and method of fabricating semiconductor devices Dec. 1, 1998
5830781 Semiconductor device soldering process Nov. 3, 1998
5824568 Process of making an integrated circuit chip composite Oct. 20, 1998
5807762 Multi-chip module system and method of fabrication Sep. 15, 1998
5804467 Semiconductor device and method of producing the same Sep. 8, 1998
5792676 Method of fabricating power semiconductor device and lead frame Aug. 11, 1998
5789280 Leadframe having secured outer leads, semiconductor device using the leadframe and method of making them Aug. 4, 1998
5783464 Method of forming a hermetically sealed circuit lead-on package Jul. 21, 1998
5783463 Semiconductor device and method of producing said semiconductor device Jul. 21, 1998
5778520 Method of making an assembly package in an air tight cavity and a product made by the method Jul. 14, 1998
5776798 Semiconductor package and method thereof Jul. 7, 1998

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