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Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6544820 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication Apr. 8, 2003
6544816 Method of encapsulating thin semiconductor chip-scale packages Apr. 8, 2003
6541307 Multimedia chip package Apr. 1, 2003
6541306 Resin-sealed semiconductor device and method of manufacturing the device Apr. 1, 2003
6541301 Low RF loss direct die attach process and apparatus Apr. 1, 2003
6538317 Substrate for resin-encapsulated semiconductor device, resin-encapsulated semiconductor device and process for fabricating the same Mar. 25, 2003
6537859 Semiconductor device baking method Mar. 25, 2003
6537853 Overmolding encapsulation process Mar. 25, 2003
6537848 Super thin/super thermal ball grid array package Mar. 25, 2003
6534846 Lead frame for semiconductor device and semiconductor device using same Mar. 18, 2003
6534330 Light irradiating device manufacturing method Mar. 18, 2003
6534338 Method for molding semiconductor package having a ceramic substrate Mar. 18, 2003
6531335 Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods Mar. 11, 2003
6528408 Method for bumped die and wire bonded board-on-chip package Mar. 4, 2003
6528348 Semiconductor device having protruding electrodes higher than a sealed portion Mar. 4, 2003
6524886 Method of making leadless semiconductor package Feb. 25, 2003
6521468 Lead formation, assembly strip test and singulation method Feb. 18, 2003
6521484 Mold injection method for semiconductor device Feb. 18, 2003
6521480 Method for making a semiconductor chip package Feb. 18, 2003
6518662 Method of assembling a semiconductor chip package Feb. 11, 2003
6514798 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages Feb. 4, 2003
6509630 Flexible interconnecting substrate, film, carrier, tape-shaped semiconductor device, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment Jan. 21, 2003
6509210 Semiconductor device and method for fabricating the same Jan. 21, 2003
6506629 Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages Jan. 14, 2003
6503776 Method for fabricating stacked chip package Jan. 7, 2003
6500698 Method for fabricating a stacked semiconductor chip package Dec. 31, 2002
6500697 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes Dec. 31, 2002
6492071 Wafer scale encapsulation for integrated flip chip and surface mount technology assembly Dec. 10, 2002
6492203 Semiconductor device and method of fabrication thereof Dec. 10, 2002
6492199 Method of manufacturing a semiconductor package with improved cross talk and grounding Dec. 10, 2002
6489183 Method of manufacturing a taped semiconductor device Dec. 3, 2002
6486536 U-shape tape for BOC FBGA package to improve moldability Nov. 26, 2002
6483178 Semiconductor device package structure Nov. 19, 2002
6482664 Method for manufacturing white light-emitting diodes Nov. 19, 2002
6482675 Substrate strip for use in packaging semiconductor chips and method for making the substrate strip Nov. 19, 2002
6479886 Integrated circuit package with EMI shield Nov. 12, 2002
6476502 Semiconductor device and manufacturing method thereof Nov. 5, 2002
6475834 Method of manufacturing a semiconductor component and semiconductor component thereof Nov. 5, 2002
6472758 Semiconductor package including stacked semiconductor dies and bond wires Oct. 29, 2002
6472250 Method for producing a chip module Oct. 29, 2002
6472249 Semiconductor device having sealing film formed on the surface having columnar electrode formed thereon and method of manufacturing the same Oct. 29, 2002
6468832 Method to encapsulate bumped integrated circuit to create chip scale package Oct. 22, 2002
6469372 Matched thermal expansion carrier tape assemblage for semiconductor devices Oct. 22, 2002
6465277 Molding apparatus and molding method for flexible substrate based package Oct. 15, 2002
6465279 Lead frame and production method thereof, and semiconductor device and fabrication method thereof Oct. 15, 2002
6465276 Power semiconductor package and method for making the same Oct. 15, 2002
6462273 Semiconductor card and method of fabrication Oct. 8, 2002
6458629 High-frequency module, method of manufacturing thereof and method of molding resin Oct. 1, 2002
6458626 Fabricating method for semiconductor package Oct. 1, 2002
6455348 Lead frame, resin-molded semiconductor device, and method for manufacturing the same Sep. 24, 2002

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