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Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6660562 Method and apparatus for a lead-frame air-cavity package Dec. 9, 2003
6655022 Implementing micro BGA assembly techniques for small die Dec. 2, 2003
6656769 Method and apparatus for distributing mold material in a mold for packaging microelectronic devices Dec. 2, 2003
6653169 Packaged semiconductor and process for manufacturing the same Nov. 25, 2003
6649447 Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames Nov. 18, 2003
6645792 Lead frame and method for fabricating resin-encapsulated semiconductor device Nov. 11, 2003
6642082 Method for manufacturing a resin-sealed semiconductor device Nov. 4, 2003
6638792 Method for fabricating BOC semiconductor package Oct. 28, 2003
6630373 Ground plane for exposed package Oct. 7, 2003
6627481 Method of manufacturing a semiconductor package with a lead frame having a support structure Sep. 30, 2003
6627994 Semiconductor device and film carrier tape Sep. 30, 2003
6620646 Chip size image sensor wirebond package fabrication method Sep. 16, 2003
6617680 Chip carrier, semiconductor package and fabricating method thereof Sep. 9, 2003
6617200 System and method for fabricating a semiconductor device Sep. 9, 2003
6617197 Multi row leadless leadframe package Sep. 9, 2003
6613609 Method for producing a portable electronic device with an integrated circuit protected by a photosensitive resin Sep. 2, 2003
6613607 Method for manufacturing encapsulated electronic components, particularly integrated circuits Sep. 2, 2003
6610561 Method of fabricating a semiconductor device Aug. 26, 2003
6607940 Method of manufacturing semiconductor devices and semiconductor devices made according to the method Aug. 19, 2003
6602735 Method of fabricating a semiconductor chip package with a lead frame and multiple integrated circuit chips Aug. 5, 2003
6602734 Method of manufacturing a semiconductor device Aug. 5, 2003
6599774 Technique for underfilling stacked chips on a cavity MLC module Jul. 29, 2003
6593169 Method of making hybrid integrated circuit device Jul. 15, 2003
6593171 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages Jul. 15, 2003
6589820 Method and apparatus for packaging a microelectronic die Jul. 8, 2003
6589801 Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques Jul. 8, 2003
6589814 Lead frame chip scale package Jul. 8, 2003
6586274 Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument Jul. 1, 2003
6579748 Fabrication method of an electronic component Jun. 17, 2003
6579746 Method and apparatus for coupling a semiconductor die to die terminals Jun. 17, 2003
6576491 Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame Jun. 10, 2003
6576539 Semiconductor chip assembly with interlocked conductive trace Jun. 10, 2003
6573121 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame Jun. 3, 2003
6566165 Method for mounting a semiconductor chip to a semiconductor chip-mounting board May. 20, 2003
6566168 Semiconductor package having implantable conductive lands and method for manufacturing the same May. 20, 2003
6566240 Semiconductor device and method of forming a semiconductor device May. 20, 2003
6563203 Motor driving device May. 13, 2003
6562661 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same May. 13, 2003
6558982 Semiconductor device manufacturing method and mold die May. 6, 2003
6558966 Apparatus and methods of packaging and testing die May. 6, 2003
6558980 Plastic molded type semiconductor device and fabrication process thereof May. 6, 2003
6553657 Semiconductor device Apr. 29, 2003
6555898 Dam structure for center-bonded chip package Apr. 29, 2003
6555400 Method for substrate mapping Apr. 29, 2003
6555412 Packaged semiconductor chip and method of making same Apr. 29, 2003
6555924 Semiconductor package with flash preventing mechanism and fabrication method thereof Apr. 29, 2003
6551859 Chip scale and land grid array semiconductor packages Apr. 22, 2003
6548328 Circuit device and manufacturing method of circuit device Apr. 15, 2003
6548330 Semiconductor apparatus and method of fabricating semiconductor apparatus Apr. 15, 2003
6544821 Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed Apr. 8, 2003

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