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Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6808961 Locking of mold compound to conductive substrate panels Oct. 26, 2004
6800507 Semiconductor device and a method of manufacturing the same Oct. 5, 2004
6797537 Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers Sep. 28, 2004
6797539 Method of manufacturing a semiconductor device Sep. 28, 2004
6797540 Dap isolation process Sep. 28, 2004
6797542 Fabrication method of semiconductor integrated circuit device Sep. 28, 2004
6790711 Method of making semiconductor device Sep. 14, 2004
6790758 Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging Sep. 14, 2004
6787393 Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package Sep. 7, 2004
6787392 Structure and method of direct chip attach Sep. 7, 2004
6782610 Method for fabricating a wiring substrate by electroplating a wiring film on a metal base Aug. 31, 2004
6780679 Semiconductor device and method of manufacturing the same Aug. 24, 2004
6780671 Method of encapsulating conductive lines of semiconductor devices Aug. 24, 2004
6777262 Method of packaging a semiconductor device having gull-wing leads with thinner end portions Aug. 17, 2004
6777265 Partially patterned lead frames and methods of making and using the same in semiconductor packaging Aug. 17, 2004
6777266 Dual-chip integrated circuit package and method of manufacturing the same Aug. 17, 2004
6773961 Singulation method used in leadless packaging process Aug. 10, 2004
6770971 Semiconductor device and method of fabricating the same Aug. 3, 2004
6768660 Multi-chip memory devices and modules including independent control of memory chips Jul. 27, 2004
6764882 Two-stage transfer molding method to encapsulate MMC module Jul. 20, 2004
6762118 Package having array of metal pegs linked by printed circuit lines Jul. 13, 2004
6762077 Integrated sensor packages and methods of making the same Jul. 13, 2004
6759268 Semiconductor device and manufacturing method therefor Jul. 6, 2004
6746894 Ball grid array interposer, packages and methods Jun. 8, 2004
6740546 Packaged microelectronic devices and methods for assembling microelectronic devices May. 25, 2004
6740543 Method and apparatus for encapsulating articles by stencil printing May. 25, 2004
6737300 Chip scale package and manufacturing method May. 18, 2004
6730545 Method of performing back-end manufacturing of an integrated circuit device May. 4, 2004
6730544 Stackable semiconductor package and method for manufacturing same May. 4, 2004
6727114 Semiconductor device and a method of manufacturing the same Apr. 27, 2004
6723656 Method and apparatus for etching a semiconductor die Apr. 20, 2004
6716671 Methods of making microelectronic assemblies using compressed resilient layer Apr. 6, 2004
6717248 Semiconductor package and method for fabricating the same Apr. 6, 2004
6711666 IBM PC compatible multi-chip module Mar. 23, 2004
6709892 Electronic device fabrication method comprising twofold cutting of conductor member Mar. 23, 2004
6706560 Method of forming heat sink and semiconductor chip assemblies Mar. 16, 2004
6706553 Dispensing process for fabrication of microelectronic packages Mar. 16, 2004
6703260 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes Mar. 9, 2004
6699734 Method and apparatus for coupling a semiconductor die to die terminals Mar. 2, 2004
6692991 Resin-encapsulated semiconductor device and method for manufacturing the same Feb. 17, 2004
6692989 Plastic molded type semiconductor device and fabrication process thereof Feb. 17, 2004
6692988 Method of fabricating a substrate-based semiconductor package without mold flash Feb. 17, 2004
6689638 Substrate-on-chip packaging process Feb. 10, 2004
6680220 Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package Jan. 20, 2004
6677681 Carrier substrate and carrier assembly using residual organic compounds to facilitate gate break Jan. 13, 2004
6677181 Method for fabricating stacked chip package device Jan. 13, 2004
6670221 Semiconductor device having a built-in contact-type sensor and manufacturing method thereof Dec. 30, 2003
6670220 Semiconductor device and manufacture method of that Dec. 30, 2003
6670206 Method for fabricating surface acoustic wave filter packages Dec. 30, 2003
6664646 Chip-on-board assemblies, carrier assemblies and carrier substrates using residual organic compounds to facilitate gate break Dec. 16, 2003

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