Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
7087461 Process and lead frame for making leadless semiconductor packages Aug. 8, 2006
7084008 Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and el Aug. 1, 2006
7084511 Semiconductor device having resin-sealed area on circuit board thereof Aug. 1, 2006
7084009 Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate Aug. 1, 2006
7084003 Method for manufacturing semiconductor device packages Aug. 1, 2006
7081403 Thin leadless plastic chip carrier Jul. 25, 2006
7078264 Stacked semiconductor die Jul. 18, 2006
7076089 Fingerprint sensor having enhanced ESD protection and associated methods Jul. 11, 2006
7074651 Packaging method for integrated circuits Jul. 11, 2006
7064009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same Jun. 20, 2006
7060216 Tire pressure sensors and methods of making the same Jun. 13, 2006
7060530 Semiconductor package having a resin cap member Jun. 13, 2006
7056767 Method and apparatus for flip chip device assembly by radiant heating Jun. 6, 2006
7056768 Cutting method and method of manufacturing semiconductor device Jun. 6, 2006
7056772 Method for sealing semiconductor component Jun. 6, 2006
7049213 Method for producing a contact substrate and corresponding contact substrate May. 23, 2006
7045393 Method for manufacturing circuit devices May. 16, 2006
7042089 Group III nitride compound semiconductor device May. 9, 2006
7031791 Method and system for a reject management protocol within a back-end integrated circuit manufacturing process Apr. 18, 2006
7029947 Flip chip in leaded molded package with two dies Apr. 18, 2006
7029948 Electrical or electronic component and method of producing same Apr. 18, 2006
7026176 Mold making method for wafer scale caps Apr. 11, 2006
7026190 Method of manufacturing circuit device Apr. 11, 2006
7026720 Flip-chip mounted integrated circuit card element Apr. 11, 2006
7018844 Non-contact data carrier and method of fabricating the same Mar. 28, 2006
7015075 Die encapsulation using a porous carrier Mar. 21, 2006
7012321 Stacked semiconductor device including improved lead frame arrangement Mar. 14, 2006
7005316 Method for package reduction in stacked chip and board assemblies Feb. 28, 2006
6998296 Electronic component and method for its production Feb. 14, 2006
6995041 Semiconductor package with circuit side polymer layer and wafer level fabrication method Feb. 7, 2006
6989334 Manufacturing method of a semiconductor device Jan. 24, 2006
6989294 Leadless plastic chip carrier with etch back pad singulation Jan. 24, 2006
6984539 Method of manufacturing light-emitting diode device Jan. 10, 2006
6982192 High performance thermal interface curing process for organic flip chip packages Jan. 3, 2006
6971166 Method of manufacturing a nonreciprocal device Dec. 6, 2005
6969905 Leadframe for semiconductor chips and electronic devices and production methods for a leadframe and for electronic devices Nov. 29, 2005
6969641 Method and system for integrated circuit packaging Nov. 29, 2005
6967125 Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same Nov. 22, 2005
6967393 Semiconductor differential interconnect Nov. 22, 2005
6964881 Multi-chip wafer level system packages and methods of forming same Nov. 15, 2005
6960493 Semiconductor device package Nov. 1, 2005
6956252 Hybrid integrated circuit device Oct. 18, 2005
6951981 Asymmetric transfer molding method and an asymmetric encapsulation made therefrom Oct. 4, 2005
6946320 FBAR based duplexer device and manufacturing method thereof Sep. 20, 2005
6946325 Methods for packaging microelectronic devices Sep. 20, 2005
6943456 Plastic molded type semiconductor device and fabrication process thereof Sep. 13, 2005
6939737 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board Sep. 6, 2005
6939740 Method of fabricating an encapsulated semiconductor device with partly exposed leads Sep. 6, 2005
6928719 Method for fabricating surface acoustic wave filter package Aug. 16, 2005
6929981 Package design and method of manufacture for chip grid array Aug. 16, 2005

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20










 
 
  Recently Added Patents
Damage resistant antenna
(Meth)acrylic resin composition, imidized (meth)acrylic resin composition, and film obtained by molding them
Method for forming contact hole
System and method for seamlessly increasing download throughput
Automatic logical position adjustment of multiple screens
Fuel cell system with mechanical check valve
Radio frequency power delivery system
  Randomly Featured Patents
Wafer transfer apparatus
Magnetic printing process and apparatus
Apparatus having automatic calibration for determining hydrogen peroxide concentration
Wafer testing interposer for a conventional package
Full wave rectifier having an operational amplifier
Rate control method for hydraulic fracturing
System and method for automatically altering a theme associated with a room or similar space
Method of designing and manufacturing a pipe fitting, particularly for aircraft
Database management apparatuses for transmitting packets
Apparatus and method for data management