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Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618845 |
Fabrication of an integrated circuit package |
Nov. 17, 2009 |
| 7614888 |
Flip chip package process |
Nov. 10, 2009 |
| 7611925 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Nov. 3, 2009 |
| 7611981 |
Optimized circuit design layout for high performance ball grid array packages |
Nov. 3, 2009 |
| 7608930 |
Semiconductor device and method of manufacturing semiconductor device |
Oct. 27, 2009 |
| 7608482 |
Integrated circuit package with molded insulation |
Oct. 27, 2009 |
| 7598123 |
Semiconductor component and method of manufacture |
Oct. 6, 2009 |
| 7598122 |
Die attach method and microarray leadframe structure |
Oct. 6, 2009 |
| 7595225 |
Leadless plastic chip carrier with contact standoff |
Sep. 29, 2009 |
| 7592694 |
Chip package and method of manufacturing the same |
Sep. 22, 2009 |
| 7579219 |
Semiconductor device with a protected active die region and method therefor |
Aug. 25, 2009 |
| 7566648 |
Method of making solder pad |
Jul. 28, 2009 |
| 7563648 |
Semiconductor device package and method for manufacturing same |
Jul. 21, 2009 |
| 7563644 |
Optical device and method for fabricating the same |
Jul. 21, 2009 |
| 7556986 |
Tape supported memory card leadframe structure |
Jul. 7, 2009 |
| 7556984 |
Package structure of chip and the package method thereof |
Jul. 7, 2009 |
| 7556983 |
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same |
Jul. 7, 2009 |
| 7552532 |
Method for hermetically encapsulating a component |
Jun. 30, 2009 |
| 7544541 |
Semiconductor package |
Jun. 9, 2009 |
| 7537967 |
Mold cleaning sheet and manufacturing method of a semiconductor device using the same |
May. 26, 2009 |
| 7531432 |
Block-molded semiconductor device singulation methods and systems |
May. 12, 2009 |
| 7528014 |
Semiconductor device and method of manufacturing the same |
May. 5, 2009 |
| 7528007 |
Methods for assembling semiconductor devices and interposers |
May. 5, 2009 |
| 7524698 |
Handling and positioning of metallic plated balls for socket application in ball grid array packages |
Apr. 28, 2009 |
| 7521290 |
Method of manufacturing circuit device |
Apr. 21, 2009 |
| 7517722 |
Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds |
Apr. 14, 2009 |
| 7514293 |
Method of manufacturing a semiconductor device |
Apr. 7, 2009 |
| 7514296 |
Method for manufacturing semiconductor device |
Apr. 7, 2009 |
| 7514292 |
Individualized low parasitic power distribution lines deposited over active integrated circuits |
Apr. 7, 2009 |
| 7510889 |
Light emitting chip package and manufacturing method thereof |
Mar. 31, 2009 |
| 7507606 |
Semiconductor device and method of manufacturing the same |
Mar. 24, 2009 |
| 7508054 |
Semiconductor device and a method of manufacturing the same |
Mar. 24, 2009 |
| 7504714 |
Chip package with asymmetric molding |
Mar. 17, 2009 |
| 7498678 |
Electronic assemblies and systems with filled no-flow underfill |
Mar. 3, 2009 |
| 7494843 |
Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding |
Feb. 24, 2009 |
| 7491570 |
Die package having an adhesive flow restriction area |
Feb. 17, 2009 |
| 7485493 |
Singulating surface-mountable semiconductor devices and fitting external contacts to said devices |
Feb. 3, 2009 |
| 7482202 |
Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof |
Jan. 27, 2009 |
| 7482193 |
Injection-molded package for MEMS inertial sensor |
Jan. 27, 2009 |
| 7479413 |
Method for fabricating semiconductor package with circuit side polymer layer |
Jan. 20, 2009 |
| 7473584 |
Method for fabricating a fan-in leadframe semiconductor package |
Jan. 6, 2009 |
| 7470978 |
Sawn power package and method of fabricating same |
Dec. 30, 2008 |
| 7468294 |
Semiconductor device and a method of manufacturing the same |
Dec. 23, 2008 |
| 7459348 |
Method for manufacturing a semiconductor device |
Dec. 2, 2008 |
| 7459345 |
Packaging method for an electronic element |
Dec. 2, 2008 |
| 7456049 |
Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same |
Nov. 25, 2008 |
| 7456500 |
Light source module and method for production thereof |
Nov. 25, 2008 |
| 7451539 |
Method of making a conformal electromagnetic interference shield |
Nov. 18, 2008 |
| 7449362 |
One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
Nov. 11, 2008 |
| 7445968 |
Methods for integrated circuit module packaging and integrated circuit module packages |
Nov. 4, 2008 |
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