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Class Information
Number: 438/112
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame > And encapsulating
Description: Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710510 High power insulated gate bipolar transistors Apr. 29, 2014
8710640 Integrated circuit packaging system with heat slug and method of manufacture thereof Apr. 29, 2014
8703539 Multiple die packaging interposer structure and method Apr. 22, 2014
8703545 Aluminum alloy lead-frame and its use in fabrication of power semiconductor package Apr. 22, 2014
8691626 Semiconductor chip device with underfill Apr. 8, 2014
8691629 Packaging jig and process for semiconductor packaging Apr. 8, 2014
8691630 Semiconductor package structure and manufacturing method thereof Apr. 8, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8685794 Lead frame land grid array with routing connector trace under unit Apr. 1, 2014
8671560 In system reflow of low temperature eutectic bond balls Mar. 18, 2014
8673687 Etched hybrid die package Mar. 18, 2014
RE44811 High power light emitting diode package Mar. 18, 2014
8669138 Semiconductor device and method for manufacturing the same Mar. 11, 2014
8669140 Method of forming stacked die package using redistributed chip packaging Mar. 11, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8659050 Slim LED package Feb. 25, 2014
8650748 Universal chip carrier and method Feb. 18, 2014
8652879 Lead frame ball grid array with traces under die Feb. 18, 2014
8652882 Chip package structure and chip packaging method Feb. 18, 2014
8648456 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Feb. 11, 2014
8642397 Semiconductor wafer level package (WLP) and method of manufacture thereof Feb. 4, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8637341 Semiconductor module Jan. 28, 2014
8637352 Ball grid array to pin grid array conversion Jan. 28, 2014
8633061 Method of fabricating package structure Jan. 21, 2014
8623702 Semiconductor device and method of forming conductive THV and RDL on opposite sides of semiconductor die for RDL-to-RDL bonding Jan. 7, 2014
8624366 Semiconductor package structure and method of fabricating the same Jan. 7, 2014
8617927 Method of mounting electronic chips Dec. 31, 2013
8617413 Method and device for encapsulating microstructures Dec. 31, 2013
8618653 Integrated circuit package system with wafer scale heat slug Dec. 31, 2013
8614899 Field barrier structures within a conformal shield Dec. 24, 2013
8603859 Integrated circuit packaging system with dual side mold and method of manufacture thereof Dec. 10, 2013
8597988 System for flash-free overmolding of led array substrates Dec. 3, 2013
8598034 Package-on-package system with through vias and method of manufacture thereof Dec. 3, 2013
8592853 Semiconductor light emitting element Nov. 26, 2013
8592960 Leadframe package with integrated partial waveguide interface Nov. 26, 2013
8592973 Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof Nov. 26, 2013
8586414 Top exposed package and assembly method Nov. 19, 2013
8586422 Optical semiconductor device having pre-molded leadframe with window and method therefor Nov. 19, 2013
8580608 Fabrication method of package structure having embedded semiconductor component Nov. 12, 2013
8574961 Method of marking a low profile packaged semiconductor device Nov. 5, 2013
8574967 Method for fabricating array-molded package-on-package Nov. 5, 2013
8575749 Semiconductor device and method for fabricating the same Nov. 5, 2013
8569080 Method for packaging light emitting diode Oct. 29, 2013
8569111 Manufacturing method for semiconductor devices Oct. 29, 2013
8563361 Packaging method of molded wafer level chip scale package (WLCSP) Oct. 22, 2013
8564012 Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatuses Oct. 22, 2013
8557674 High voltage semiconductor device including field shaping layer and method of fabricating the same Oct. 15, 2013
8551812 Manufacturing method of rigid and flexible composite printed circuit board Oct. 8, 2013
8546160 Method for packaging light emitting diodes Oct. 1, 2013

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