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Class Information
Number: 438/111
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame
Description: Process for making plural separate semiconductor devices utilizing a plurality of support structures or positions arranged on an elongated continuum prior to separation.










Sub-classes under this class:

Class Number Class Name Patents
438/112 And encapsulating 957


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
8709873 Leadless integrated circuit packaging system and method of manufacture thereof Apr. 29, 2014
8703545 Aluminum alloy lead-frame and its use in fabrication of power semiconductor package Apr. 22, 2014
8691629 Packaging jig and process for semiconductor packaging Apr. 8, 2014
8664045 LED lamp strip and manufacturing process thereof Mar. 4, 2014
8664046 Manufacturing method thereof and a semiconductor device Mar. 4, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8664776 Interconnection tape providing a serial electrode pad connection in a semiconductor device Mar. 4, 2014
8652882 Chip package structure and chip packaging method Feb. 18, 2014
8647964 Temporary wafer bonding method for semiconductor processing Feb. 11, 2014
8642394 Method of manufacturing electronic device on leadframe Feb. 4, 2014
8643156 Lead frame for assembling semiconductor device Feb. 4, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8629562 Techniques for modular chip fabrication Jan. 14, 2014
8609468 Semiconductor device and method of manufacturing the same Dec. 17, 2013
8592962 Semiconductor device packages with protective layer and related methods Nov. 26, 2013
8581416 Method of forming a semiconductor device and leadframe therefor Nov. 12, 2013
8564107 Lead frame and method for manufacturing the same Oct. 22, 2013
8563360 Power semiconductor device package and fabrication method Oct. 22, 2013
8551812 Manufacturing method of rigid and flexible composite printed circuit board Oct. 8, 2013
8551815 Stack packages using reconstituted wafers Oct. 8, 2013
8530279 Offset gravure printing process for improved mold compound and die attach adhesive adhesion on leadframe surface using selective adhesion promoter Sep. 10, 2013
8524541 Processes for manufacturing an LED package with top and bottom electrodes Sep. 3, 2013
8507319 Integrated circuit package system with shield Aug. 13, 2013
8501539 Semiconductor device package Aug. 6, 2013
8501540 Method for manufacture of inline integrated circuit system Aug. 6, 2013
8486762 Leadless array plastic package with various IC packaging configurations Jul. 16, 2013
8486761 Hybrid combination of substrate and carrier mounted light emitting devices Jul. 16, 2013
8479384 Methods for integrated circuit fabrication with protective coating for planarization Jul. 9, 2013
8482114 Impedance optimized chip system Jul. 9, 2013
8470644 Exposed die package for direct surface mounting Jun. 25, 2013
8450152 Double-side exposed semiconductor device and its manufacturing method May. 28, 2013
8441114 Electronic circuit composed of sub-circuits and method for producing May. 14, 2013
8440507 Lead frame sulfur removal May. 14, 2013
8435867 Method of manufacturing semiconductor device and method of manufacturing electronic device May. 7, 2013
8431439 Thin film laminated body manufacturing apparatus and method Apr. 30, 2013
8424195 Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same Apr. 23, 2013
8399997 Power package including multiple semiconductor devices Mar. 19, 2013
8394675 Manufacturing light emitting diode (LED) packages Mar. 12, 2013
8389332 Integrated circuit packaging system with isolated pads and method of manufacture thereof Mar. 5, 2013
8390105 Lead frame substrate, manufacturing method thereof, and semiconductor apparatus Mar. 5, 2013
8377747 Interleaf for leadframe identification Feb. 19, 2013
8373262 Source driver, method for manufacturing same, and liquid crystal module Feb. 12, 2013
8361839 Structure and method for power field effect transistor Jan. 29, 2013
8354739 Thin semiconductor package and method for manufacturing same Jan. 15, 2013
8349655 Method of fabricating a two-sided die in a four-sided leadframe based package Jan. 8, 2013
8344499 Chip-exposed semiconductor device Jan. 1, 2013
8338234 Hybrid integrated circuit device and manufacturing method thereof Dec. 25, 2012
8324025 Power semiconductor device packaging Dec. 4, 2012
8324721 Integrated shunt resistor with external contact in a semiconductor package Dec. 4, 2012
8318548 Method for manufacturing semiconductor device Nov. 27, 2012

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