| |
 |
|
Class Information
Number: 438/111
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices > Using strip lead frame
Description: Process for making plural separate semiconductor devices utilizing a plurality of support structures or positions arranged on an elongated continuum prior to separation.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615605 |
Monomer solution for producing polycarbonate |
Nov. 10, 2009 |
| 7608484 |
Non-pull back pad package with an additional solder standoff |
Oct. 27, 2009 |
| 7608930 |
Semiconductor device and method of manufacturing semiconductor device |
Oct. 27, 2009 |
| 7601562 |
Microelectronic component assemblies having lead frames adapted to reduce package bow |
Oct. 13, 2009 |
| 7602054 |
Method of forming a molded array package device having an exposed tab and structure |
Oct. 13, 2009 |
| 7598101 |
LED of side view type and the method for manufacturing the same |
Oct. 6, 2009 |
| 7595225 |
Leadless plastic chip carrier with contact standoff |
Sep. 29, 2009 |
| 7563648 |
Semiconductor device package and method for manufacturing same |
Jul. 21, 2009 |
| 7554183 |
Semiconductor device |
Jun. 30, 2009 |
| 7535086 |
Integrated circuit package-on-package stacking system |
May. 19, 2009 |
| 7528014 |
Semiconductor device and method of manufacturing the same |
May. 5, 2009 |
| 7524698 |
Handling and positioning of metallic plated balls for socket application in ball grid array packages |
Apr. 28, 2009 |
| 7521290 |
Method of manufacturing circuit device |
Apr. 21, 2009 |
| 7521295 |
Leadframe and method of manufacturing the same |
Apr. 21, 2009 |
| 7514292 |
Individualized low parasitic power distribution lines deposited over active integrated circuits |
Apr. 7, 2009 |
| 7514296 |
Method for manufacturing semiconductor device |
Apr. 7, 2009 |
| 7510889 |
Light emitting chip package and manufacturing method thereof |
Mar. 31, 2009 |
| 7507603 |
Etch singulated semiconductor package |
Mar. 24, 2009 |
| 7507605 |
Low cost lead-free preplated leadframe having improved adhesion and solderability |
Mar. 24, 2009 |
| 7508054 |
Semiconductor device and a method of manufacturing the same |
Mar. 24, 2009 |
| 7498195 |
Multi-chip semiconductor connector assembly method |
Mar. 3, 2009 |
| 7485498 |
Space-efficient package for laterally conducting device |
Feb. 3, 2009 |
| 7470978 |
Sawn power package and method of fabricating same |
Dec. 30, 2008 |
| 7465606 |
Resistance welded solder crimp for joining stranded wire to a copper lead-frame |
Dec. 16, 2008 |
| 7462926 |
Leadframe comprising tin plating or an intermetallic layer formed therefrom |
Dec. 9, 2008 |
| 7459345 |
Packaging method for an electronic element |
Dec. 2, 2008 |
| 7459347 |
Manufacturing method of a semiconductor device |
Dec. 2, 2008 |
| 7449368 |
Technique for attaching die to leads |
Nov. 11, 2008 |
| 7435624 |
Method of reducing mechanical stress on a semiconductor die during fabrication |
Oct. 14, 2008 |
| 7413930 |
Lead frame and method of manufacturing the lead frame |
Aug. 19, 2008 |
| 7414303 |
Lead on chip semiconductor package |
Aug. 19, 2008 |
| 7410830 |
Leadless plastic chip carrier and method of fabricating same |
Aug. 12, 2008 |
| 7411280 |
Chip support of a leadframe for an integrated circuit package |
Aug. 12, 2008 |
| 7407834 |
Manufacturing method of a semiconductor device |
Aug. 5, 2008 |
| 7408242 |
Carrier with reinforced leads that are to be connected to a chip |
Aug. 5, 2008 |
| 7405106 |
Quad flat no-lead chip carrier with stand-off |
Jul. 29, 2008 |
| 7387916 |
Sharp corner lead frame |
Jun. 17, 2008 |
| 7372170 |
Flip chip interconnection pad layout |
May. 13, 2008 |
| 7371616 |
Clipless and wireless semiconductor die package and method for making the same |
May. 13, 2008 |
| 7368320 |
Method of fabricating a two die semiconductor assembly |
May. 6, 2008 |
| 7364947 |
Method for cutting lead terminal of package type electronic component |
Apr. 29, 2008 |
| 7361531 |
Methods and apparatus for Flip-Chip-On-Lead semiconductor package |
Apr. 22, 2008 |
| 7344918 |
Electronic assembly with integrated IO and power contacts |
Mar. 18, 2008 |
| 7341889 |
Lead frame for semiconductor package and method of fabricating semiconductor package |
Mar. 11, 2008 |
| 7338838 |
Resin-encapsulation semiconductor device and method for fabricating the same |
Mar. 4, 2008 |
| 7326594 |
Connecting a plurality of bond pads and/or inner leads with a single bond wire |
Feb. 5, 2008 |
| 7323365 |
Semiconductor device manufacturing method and manufacturing apparatus |
Jan. 29, 2008 |
| 7323366 |
Manufacturing method of a semiconductor device |
Jan. 29, 2008 |
| 7316939 |
Semiconductor device manufacturing method and manufacturing apparatus |
Jan. 8, 2008 |
| 7314781 |
Device packages having stable wirebonds |
Jan. 1, 2008 |
|
|
|
