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Class Information
Number: 438/110
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices
Description: Process for making a semiconductor device wherein a multiplicity of separate semiconductive devices are obtained.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615408 |
Method of manufacturing semiconductor device |
Nov. 10, 2009 |
| 7615412 |
System in package (SIP) integrated circuit and packaging method thereof |
Nov. 10, 2009 |
| 7611967 |
Wafer sawing method |
Nov. 3, 2009 |
| 7608525 |
Method for manufacturing nitride semiconductor substrate |
Oct. 27, 2009 |
| 7604833 |
Electronic part manufacturing method |
Oct. 20, 2009 |
| 7605019 |
Semiconductor device with stacked chips and method for manufacturing thereof |
Oct. 20, 2009 |
| 7595224 |
Method for manufacturing integrated circuit |
Sep. 29, 2009 |
| 7589407 |
Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package |
Sep. 15, 2009 |
| 7589009 |
Method for fabricating a top conductive layer in a semiconductor die and related structure |
Sep. 15, 2009 |
| 7585699 |
Semiconductor package board using a metal base |
Sep. 8, 2009 |
| 7585700 |
Ball grid array package stack |
Sep. 8, 2009 |
| 7586193 |
Mm-wave antenna using conventional IC packaging |
Sep. 8, 2009 |
| 7582511 |
Method for wafer level chip scale packaging with passive components integrated into packaging structure |
Sep. 1, 2009 |
| 7582917 |
Monolithically integrated light-activated thyristor and method |
Sep. 1, 2009 |
| 7579689 |
Integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for |
Aug. 25, 2009 |
| 7579260 |
Method of dividing an adhesive film bonded to a wafer |
Aug. 25, 2009 |
| 7579214 |
Semiconductor device and a method of manufacturing the same |
Aug. 25, 2009 |
| 7575953 |
Stacked die with a recess in a die BGA package |
Aug. 18, 2009 |
| 7569422 |
Chip package and method for fabricating the same |
Aug. 4, 2009 |
| 7566587 |
Method and apparatus for packaging electronic components |
Jul. 28, 2009 |
| 7553699 |
Method of fabricating microelectronic devices |
Jun. 30, 2009 |
| 7553698 |
Semiconductor package having semiconductor constructing body and method of manufacturing the same |
Jun. 30, 2009 |
| 7552532 |
Method for hermetically encapsulating a component |
Jun. 30, 2009 |
| 7537963 |
Device and method for manufacturing the same |
May. 26, 2009 |
| 7534654 |
Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
May. 19, 2009 |
| 7534702 |
Method for manufacturing a semiconductor device |
May. 19, 2009 |
| 7528014 |
Semiconductor device and method of manufacturing the same |
May. 5, 2009 |
| 7528006 |
Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion |
May. 5, 2009 |
| 7524763 |
Fabrication method of wafer level chip scale packages |
Apr. 28, 2009 |
| 7521289 |
Package having dummy package substrate and method of fabricating the same |
Apr. 21, 2009 |
| 7521290 |
Method of manufacturing circuit device |
Apr. 21, 2009 |
| 7517726 |
Wire bonded chip scale package fabrication methods |
Apr. 14, 2009 |
| 7514291 |
Methods relating to singulating semiconductor wafers and wafer scale assemblies |
Apr. 7, 2009 |
| 7514289 |
Methods and structures for facilitating proximity communication |
Apr. 7, 2009 |
| 7510907 |
Through-wafer vias and surface metallization for coupling thereto |
Mar. 31, 2009 |
| 7508052 |
Crack protection for silicon die |
Mar. 24, 2009 |
| 7504285 |
Carrierless chip package for integrated circuit devices, and methods of making same |
Mar. 17, 2009 |
| 7504315 |
Method of transporting semiconductor device and method of manufacturing semiconductor device |
Mar. 17, 2009 |
| 7504722 |
Semiconductor device with slanting side surface for external connection |
Mar. 17, 2009 |
| 7501310 |
Structure of image sensor module and method for manufacturing of wafer level package |
Mar. 10, 2009 |
| 7498192 |
Methods of providing a family of related integrated circuits of different sizes |
Mar. 3, 2009 |
| 7491580 |
Method of manufacturing electro-optical device |
Feb. 17, 2009 |
| 7488621 |
Package-integrated thin film LED |
Feb. 10, 2009 |
| 7488903 |
Method for manufacturing circuit modules and circuit module |
Feb. 10, 2009 |
| 7489248 |
RFID tags and processes for producing RFID tags |
Feb. 10, 2009 |
| 7485548 |
Die loss estimation using universal in-line metric (UILM) |
Feb. 3, 2009 |
| 7482199 |
Self alignment features for an electronic assembly |
Jan. 27, 2009 |
| 7482701 |
Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device |
Jan. 27, 2009 |
| 7476963 |
Three-dimensional stack manufacture for integrated circuit devices and method of manufacture |
Jan. 13, 2009 |
| 7476567 |
Midair semiconductor device and manufacturing method of the same |
Jan. 13, 2009 |
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