Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/110
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Making plural separate devices
Description: Process for making a semiconductor device wherein a multiplicity of separate semiconductive devices are obtained.










Sub-classes under this class:

Class Number Class Name Patents
438/113 Substrate dicing 1,642
438/111 Using strip lead frame 589


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
8709880 Method for fabrication of a semiconductor device and structure Apr. 29, 2014
8703532 Semiconductor device and manufacturing method thereof Apr. 22, 2014
8691607 Hermetically sealed MEMS device and method of fabrication Apr. 8, 2014
8691626 Semiconductor chip device with underfill Apr. 8, 2014
8685795 Flank wettable semiconductor device Apr. 1, 2014
8673686 Chip package structure and manufacturing method thereof Mar. 18, 2014
8673691 Method for manufacturing a semiconductor device Mar. 18, 2014
8673690 Method for manufacturing a semiconductor device and a semiconductor device Mar. 18, 2014
8669646 Apparatus and method for grounding an IC package lid for EMI reduction Mar. 11, 2014
8669657 Stackable semiconductor assemblies and methods of manufacturing such assemblies Mar. 11, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8664044 Method of fabricating land grid array semiconductor package Mar. 4, 2014
8664043 Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts Mar. 4, 2014
8664041 Method for designing a package and substrate layout Mar. 4, 2014
8658468 Method for fabricating a semiconductor and semiconductor package Feb. 25, 2014
8653654 Integrated circuit packaging system with a stackable package and method of manufacture thereof Feb. 18, 2014
8653655 Semiconductor device and manufacturing method thereof Feb. 18, 2014
8654537 Printed circuit board with integral radio-frequency shields Feb. 18, 2014
8648444 Wafer scribe line structure for improving IC reliability Feb. 11, 2014
8647924 Semiconductor package and method of packaging semiconductor devices Feb. 11, 2014
8642384 Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability Feb. 4, 2014
8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section Feb. 4, 2014
8637876 Light emitting device and light emitting device package having the same Jan. 28, 2014
8637897 Semiconductor light emitting device having multi-cell array and method for manufacturing the same Jan. 28, 2014
8637977 Semiconductor device and method of packaging a semiconductor device with a clip Jan. 28, 2014
8633089 Die bonding method utilizing rotary wafer table Jan. 21, 2014
8633058 Integrated circuit packaging system with step mold and method of manufacture thereof Jan. 21, 2014
8629043 Methods for de-bonding carriers Jan. 14, 2014
8623700 Inter-chip communication Jan. 7, 2014
8617926 Semiconductor chip device with polymeric filler trench Dec. 31, 2013
8609446 Method and apparatus for accurate die-to-wafer bonding Dec. 17, 2013
8609470 Semiconducting sheet Dec. 17, 2013
8609464 Method for shielding semiconductor device Dec. 17, 2013
8598690 Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground Dec. 3, 2013
8598631 Semiconductor integrated circuit chip and layout method for the same Dec. 3, 2013
8598619 Semiconductor light emitting device having multi-cell array and method for manufacturing the same Dec. 3, 2013
8597985 MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads Dec. 3, 2013
8597981 Microelectronic devices and methods for manufacturing microelectronic devices Dec. 3, 2013
8592993 Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads Nov. 26, 2013
8593914 Method and system for optically coupling a laser with a transducer in an energy assisted magnetic recording disk drive Nov. 26, 2013
8586413 Multi-chip module having a support structure and method of manufacture Nov. 19, 2013
8580614 Embedded wafer-level bonding approaches Nov. 12, 2013
8569881 Semiconductor device Oct. 29, 2013
8569882 Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof Oct. 29, 2013
8563357 Method of packaging a die Oct. 22, 2013
8563359 Method for manufacturing semiconductor device, and semiconductor substrate Oct. 22, 2013
8563405 Method for manufacturing semiconductor device Oct. 22, 2013
8564012 Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatuses Oct. 22, 2013
8557636 Stacked semiconductor substrates Oct. 15, 2013
8552498 Semiconductor device and method for manufacturing the same Oct. 8, 2013

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18










 
 
  Recently Added Patents
Coreference resolution in an ambiguity-sensitive natural language processing system
Systems and methods for generating a user profile based customized media guide with user-generated content and non-user-generated content
Satellite mounting pole
Distributive data capture
Vibration disturbance estimation and control
Method and apparatus for prioritizing data transfer
Method of fabricating solid electrolytic capacitor and solid electrolytic capacitor
  Randomly Featured Patents
Data aggregation module supporting dynamic query responsive aggregation during the servicing of database query requests provided by one or more client machines
Automotive latch debug and diagnostic user interface
Accessing data during the transition between program releases
CysS
Liquid purification system
Over-mold lever
Handset telephone mouthpiece cover
Adaptive modulation and coding
Method of grafting a metal reinforcing member in a structure of composite fibre-resin material
IC with enhanced low voltage start-up