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Class Information
Number: 438/109
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Assembly of plural semiconductive substrates each possessing electrical device > Stacked array (e.g., rectifier, etc.)
Description: Process for making a semiconductor device wherein a multiplicity of semiconductive substrates are juxtaposed in face-to-face orientation.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615409 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages |
Nov. 10, 2009 |
| 7615411 |
Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof |
Nov. 10, 2009 |
| 7615462 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
Nov. 10, 2009 |
| 7615856 |
Integrated antenna type circuit apparatus |
Nov. 10, 2009 |
| 7611981 |
Optimized circuit design layout for high performance ball grid array packages |
Nov. 3, 2009 |
| 7608469 |
Method of fabricating a chip |
Oct. 27, 2009 |
| 7608481 |
Method for producing semiconductor package |
Oct. 27, 2009 |
| 7605020 |
Semiconductor chip package |
Oct. 20, 2009 |
| 7605019 |
Semiconductor device with stacked chips and method for manufacturing thereof |
Oct. 20, 2009 |
| 7601561 |
Heat-radiating tape carrier package and method for manufacturing the same |
Oct. 13, 2009 |
| 7602630 |
Configurable inputs and outputs for memory stacking system and method |
Oct. 13, 2009 |
| 7598121 |
Method of manufacturing a semiconductor device |
Oct. 6, 2009 |
| 7598123 |
Semiconductor component and method of manufacture |
Oct. 6, 2009 |
| 7598606 |
Integrated circuit package system with die and package combination |
Oct. 6, 2009 |
| 7598619 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
Oct. 6, 2009 |
| 7592707 |
Method and apparatus for facilitating proximity communication and power delivery |
Sep. 22, 2009 |
| 7589409 |
Stacked packages and microelectronic assemblies incorporating the same |
Sep. 15, 2009 |
| 7588964 |
Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same |
Sep. 15, 2009 |
| 7588963 |
Method of forming overhang support for a stacked semiconductor device |
Sep. 15, 2009 |
| 7585700 |
Ball grid array package stack |
Sep. 8, 2009 |
| 7582963 |
Vertically integrated system-in-a-package |
Sep. 1, 2009 |
| 7579214 |
Semiconductor device and a method of manufacturing the same |
Aug. 25, 2009 |
| 7576004 |
Semiconductor chip and method of manufacturing semiconductor chip |
Aug. 18, 2009 |
| 7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Aug. 18, 2009 |
| 7572659 |
Semiconductor dynamic sensor and method of manufacturing the same |
Aug. 11, 2009 |
| 7572671 |
Stacked module systems and methods |
Aug. 11, 2009 |
| 7569940 |
Method and device for connecting chips |
Aug. 4, 2009 |
| 7569921 |
Semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7566961 |
Multi-stacked package and method of manufacturing the same |
Jul. 28, 2009 |
| 7563640 |
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, an |
Jul. 21, 2009 |
| 7564127 |
Memory module that is capable of controlling input/output in accordance with type of memory chip |
Jul. 21, 2009 |
| 7564137 |
Stackable integrated circuit structures and systems devices and methods related thereto |
Jul. 21, 2009 |
| 7560306 |
Manufacturing process for chip package without core |
Jul. 14, 2009 |
| 7560305 |
Apparatus and method for high density multi-chip structures |
Jul. 14, 2009 |
| 7560304 |
Method of making a semiconductor device having multiple die redistribution layer |
Jul. 14, 2009 |
| 7560302 |
Semiconductor device fabricating method |
Jul. 14, 2009 |
| 7556983 |
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same |
Jul. 7, 2009 |
| 7553696 |
Method for implementing component placement suspended within grid array packages for enhanced electrical performance |
Jun. 30, 2009 |
| 7553698 |
Semiconductor package having semiconductor constructing body and method of manufacturing the same |
Jun. 30, 2009 |
| 7553743 |
Wafer bonding method of system in package |
Jun. 30, 2009 |
| 7544539 |
Forced heat transfer apparatus for heating stacked dice |
Jun. 9, 2009 |
| 7545029 |
Stack microelectronic assemblies |
Jun. 9, 2009 |
| 7541217 |
Stacked chip structure and fabrication method thereof |
Jun. 2, 2009 |
| 7537962 |
Method of fabricating a shielded stacked integrated circuit package system |
May. 26, 2009 |
| 7537965 |
Manufacturing method for a leadless multi-chip electronic module |
May. 26, 2009 |
| 7538413 |
Semiconductor components having through interconnects |
May. 26, 2009 |
| 7534659 |
Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device |
May. 19, 2009 |
| 7535086 |
Integrated circuit package-on-package stacking system |
May. 19, 2009 |
| 7535091 |
Multichip stacking structure |
May. 19, 2009 |
| 7531383 |
Array quad flat no-lead package and method of forming same |
May. 12, 2009 |
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