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Class Information
Number: 438/109
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Assembly of plural semiconductive substrates each possessing electrical device > Stacked array (e.g., rectifier, etc.)
Description: Process for making a semiconductor device wherein a multiplicity of semiconductive substrates are juxtaposed in face-to-face orientation.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710654 Semiconductor device and manufacturing method thereof Apr. 29, 2014
8710642 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus Apr. 29, 2014
8709872 Integrated circuit with electromagnetic intrachip communication and methods for use therewith Apr. 29, 2014
8709871 Stacked type semiconductor memory device and chip selection circuit Apr. 29, 2014
8709870 Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages Apr. 29, 2014
8709869 Method of manufacturing a plurality of electronic assemblies Apr. 29, 2014
8704354 Package on package structures and methods for forming the same Apr. 22, 2014
8704353 Thermal management of stacked semiconductor chips with electrically non-functional interconnects Apr. 22, 2014
8704352 Semiconductor device having a liquid cooling module Apr. 22, 2014
8704351 Stacked microelectronic assemblies Apr. 22, 2014
8704349 Integrated circuit package system with exposed interconnects Apr. 22, 2014
8692134 Brace for long wire bond Apr. 8, 2014
8691628 Method of manufacturing semiconductor device, manufacturing program, and manufacturing apparatus Apr. 8, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8686547 Stack die structure for stress reduction and facilitation of electromagnetic shielding Apr. 1, 2014
8686313 System and methods for forming apertures in microfeature workpieces Apr. 1, 2014
8685793 Chip assembly having via interconnects joined by plating Apr. 1, 2014
8685792 Integrated circuit package system with interposer Apr. 1, 2014
8685790 Semiconductor device package having backside contact and method for manufacturing Apr. 1, 2014
8680686 Method and system for thin multi chip stack package with film on wire and copper wire Mar. 25, 2014
8679861 Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip Mar. 25, 2014
8674516 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Mar. 18, 2014
8673688 Semiconductor package and method of manufacturing the same Mar. 18, 2014
8669664 Stacked die package for MEMS resonator system Mar. 11, 2014
8669653 Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor Mar. 11, 2014
8669140 Method of forming stacked die package using redistributed chip packaging Mar. 11, 2014
8669139 Leadless multi-chip module structure Mar. 11, 2014
8664755 Power module package and method for manufacturing the same Mar. 4, 2014
8664540 Interposer testing using dummy connections Mar. 4, 2014
8664042 Method for fabrication of configurable systems Mar. 4, 2014
8659175 Integrated circuit package system with offset stack Feb. 25, 2014
8658467 Method of manufacturing stacked wafer level package Feb. 25, 2014
8653644 Packaged semiconductor chips with array Feb. 18, 2014
8653642 Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems Feb. 18, 2014
8653640 Semiconductor package apparatus Feb. 18, 2014
8653638 Integrated circuit package with multiple dies and bundling of control signals Feb. 18, 2014
8652878 Stress-engineered interconnect packages with activator-assisted molds Feb. 18, 2014
8652877 Method of manufacturing layered chip package Feb. 18, 2014
8648463 Assembly of multi-chip modules with proximity connectors using reflowable features Feb. 11, 2014
8648453 Semiconductor device and method for manufacturing the same Feb. 11, 2014
8648448 Semiconductor device and method of shielding semiconductor die from inter-device interference Feb. 11, 2014
8647926 Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip Feb. 11, 2014
8647925 Surface modification for handling wafer thinning process Feb. 11, 2014
8647924 Semiconductor package and method of packaging semiconductor devices Feb. 11, 2014
8643163 Integrated circuit package-on-package stacking system and method of manufacture thereof Feb. 4, 2014
8642393 Package on package devices and methods of forming same Feb. 4, 2014
8642386 Heat spreader as mechanical reinforcement for ultra-thin die Feb. 4, 2014
8642383 Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires Feb. 4, 2014
8637997 Semiconductor device and method of manufacturing the same Jan. 28, 2014
8637984 Multi-chip package with pillar connection Jan. 28, 2014











 
 
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