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Class Information
Number: 438/108
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Assembly of plural semiconductive substrates each possessing electrical device > Flip-chip-type assembly
Description: Process wherein a semiconductive substrate which has electric contacts on the top side thereof is flipped to juxtapose the contacts in face-to-face orientation with a substrate which has matching electrical contacts prior to bonding.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8013453 Leadless alignment of a semiconductor chip Sep. 6, 2011
8012867 Wafer level chip scale package system Sep. 6, 2011
8012801 Flip chip mounting process and flip chip assembly Sep. 6, 2011
8012800 Method of fabricating a stacked type chip package structure and a stacked type package structure Sep. 6, 2011
8008786 Dynamic pad size to reduce solder fatigue Aug. 30, 2011
8008132 Etched surface mount islands in a leadframe package Aug. 30, 2011
8008124 Adhesive film for semiconductor and semiconductor device using the adhesive film Aug. 30, 2011
8008123 Manufacturing method of semiconductor device Aug. 30, 2011
8008122 Pressurized underfill cure Aug. 30, 2011
8008121 Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate Aug. 30, 2011
8008120 Method for producing electronic part package Aug. 30, 2011
8004848 Stack module, card including the stack module, and system including the stack module Aug. 23, 2011
8003448 Semiconductor package and method for producing the same Aug. 23, 2011
8003439 Board on chip package and manufacturing method thereof Aug. 23, 2011
8003437 Semiconductor device fabricating method and fabricating apparatus Aug. 23, 2011
8000564 Photoelectric conversion module for direct optical interconnection and method of manufacturing the same Aug. 16, 2011
7998796 Semiconductor device and manufacturing method thereof Aug. 16, 2011
7998792 Semiconductor device assemblies, electronic devices including the same and assembly methods Aug. 16, 2011
7994608 Magnetically alignable integrated circuit device Aug. 9, 2011
7993970 Semiconductor device and fabrication method thereof Aug. 9, 2011
7993969 Method for producing a module with components stacked one above another Aug. 9, 2011
7993968 Assembling substrates that can form 3-D structures Aug. 9, 2011
7993967 Semiconductor package fabrication method Aug. 9, 2011
7989959 Method of forming stacked-die integrated circuit Aug. 2, 2011
7989269 Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof Aug. 2, 2011
7989264 Warpage resistant semiconductor package and method for manufacturing the same Aug. 2, 2011
7989263 Method for manufacturing a micromechanical chip and a component having a chip of this type Aug. 2, 2011
7986043 Integrated circuit package on package system Jul. 26, 2011
7985663 Method for manufacturing a semiconductor device Jul. 26, 2011
7985629 Resin sealing method of semiconductor device Jul. 26, 2011
7985621 Method and apparatus for making semiconductor packages Jul. 26, 2011
7982317 Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module Jul. 19, 2011
7982279 Method of manufacturing stacked-type semiconductor device Jul. 19, 2011
7981725 Fabricating process of a chip package structure Jul. 19, 2011
7977802 Integrated circuit packaging system with stacked die and method of manufacture thereof Jul. 12, 2011
7977767 Spiral planar inductor and manufacturing method thereof Jul. 12, 2011
7977160 Semiconductor devices having stress relief layers and methods for fabricating the same Jul. 12, 2011
7977159 Memory chip and semiconductor device using the memory chip and manufacturing method of those Jul. 12, 2011
7977157 Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages Jul. 12, 2011
7977155 Wafer-level flip-chip assembly methods Jul. 12, 2011
7973406 Bump-on-lead flip chip interconnection Jul. 5, 2011
7972903 Semiconductor device having wiring line and manufacturing method thereof Jul. 5, 2011
7968999 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive Jun. 28, 2011
7968377 Integrated circuit protruding pad package system Jun. 28, 2011
7968372 Method of joining chips utilizing copper pillar Jun. 28, 2011
7964446 Semiconductor device and method of manufacturing the same Jun. 21, 2011
7964106 Method for fabricating a packaging substrate Jun. 21, 2011
7960210 Ultra-thin chip packaging Jun. 14, 2011
7956457 System and apparatus for venting electronic packages and method of making same Jun. 7, 2011
7955954 Method of making semiconductor devices employing first and second carriers Jun. 7, 2011

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