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Class Information
Number: 438/108
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Assembly of plural semiconductive substrates each possessing electrical device > Flip-chip-type assembly
Description: Process wherein a semiconductive substrate which has electric contacts on the top side thereof is flipped to juxtapose the contacts in face-to-face orientation with a substrate which has matching electrical contacts prior to bonding.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7625778 |
Method of manufacturing a substrate-free flip chip light emitting diode |
Dec. 1, 2009 |
| 7622326 |
Manufacturing process of a chip package structure |
Nov. 24, 2009 |
| 7622313 |
Fabrication of three dimensional integrated circuit employing multiple die panels |
Nov. 24, 2009 |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7618844 |
Method of packaging and interconnection of integrated circuits |
Nov. 17, 2009 |
| 7615856 |
Integrated antenna type circuit apparatus |
Nov. 10, 2009 |
| 7615462 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
Nov. 10, 2009 |
| 7615410 |
Chip-sized flip-chip semiconductor package and method for making the same |
Nov. 10, 2009 |
| 7611925 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Nov. 3, 2009 |
| 7608480 |
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion |
Oct. 27, 2009 |
| 7608469 |
Method of fabricating a chip |
Oct. 27, 2009 |
| 7605020 |
Semiconductor chip package |
Oct. 20, 2009 |
| 7603769 |
Method of coupling a surface mount device |
Oct. 20, 2009 |
| 7601612 |
Method for forming solder joints for a flip chip assembly |
Oct. 13, 2009 |
| 7601560 |
Method for producing an electronic circuit |
Oct. 13, 2009 |
| 7598619 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
Oct. 6, 2009 |
| 7598613 |
Flip chip bonding structure |
Oct. 6, 2009 |
| 7598123 |
Semiconductor component and method of manufacture |
Oct. 6, 2009 |
| 7598121 |
Method of manufacturing a semiconductor device |
Oct. 6, 2009 |
| 7598117 |
Method for manufacturing semiconductor module using interconnection structure |
Oct. 6, 2009 |
| 7595223 |
Process for bonding and electrically connecting microsystems integrated in several distinct substrates |
Sep. 29, 2009 |
| 7592707 |
Method and apparatus for facilitating proximity communication and power delivery |
Sep. 22, 2009 |
| 7592202 |
Embedding device in substrate cavity |
Sep. 22, 2009 |
| 7588968 |
Linked chip attach and underfill |
Sep. 15, 2009 |
| 7585702 |
Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate |
Sep. 8, 2009 |
| 7582510 |
Electronic packaging materials for use with low-k dielectric-containing semiconductor devices |
Sep. 1, 2009 |
| 7579211 |
Flip-chip semiconductor device utilizing an elongated tip bump |
Aug. 25, 2009 |
| 7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Aug. 18, 2009 |
| 7575999 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
Aug. 18, 2009 |
| 7575955 |
Method for making electronic packages |
Aug. 18, 2009 |
| 7573136 |
Semiconductor device assemblies and packages including multiple semiconductor device components |
Aug. 11, 2009 |
| 7572725 |
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
Aug. 11, 2009 |
| 7572659 |
Semiconductor dynamic sensor and method of manufacturing the same |
Aug. 11, 2009 |
| 7569940 |
Method and device for connecting chips |
Aug. 4, 2009 |
| 7569420 |
Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer |
Aug. 4, 2009 |
| 7569419 |
Method for manufacturing semiconductor device that includes mounting chip on board and sealing with two resins |
Aug. 4, 2009 |
| 7566977 |
Semiconductor device and method for manufacturing the same |
Jul. 28, 2009 |
| 7566961 |
Multi-stacked package and method of manufacturing the same |
Jul. 28, 2009 |
| 7566649 |
Compressible films surrounding solder connectors |
Jul. 28, 2009 |
| 7566591 |
Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features |
Jul. 28, 2009 |
| 7566586 |
Method of manufacturing a semiconductor device |
Jul. 28, 2009 |
| 7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit |
Jul. 28, 2009 |
| 7563703 |
Microelectronic interconnect device comprising localised conductive pins |
Jul. 21, 2009 |
| 7563641 |
Laminated light-emitting diode display device and manufacturing method thereof |
Jul. 21, 2009 |
| 7560371 |
Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum |
Jul. 14, 2009 |
| 7560306 |
Manufacturing process for chip package without core |
Jul. 14, 2009 |
| 7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same |
Jul. 7, 2009 |
| 7556983 |
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same |
Jul. 7, 2009 |
| 7553743 |
Wafer bonding method of system in package |
Jun. 30, 2009 |
| 7553697 |
Multiple chip semiconductor package |
Jun. 30, 2009 |
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