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Class Information
Number: 438/108
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Assembly of plural semiconductive substrates each possessing electrical device > Flip-chip-type assembly
Description: Process wherein a semiconductive substrate which has electric contacts on the top side thereof is flipped to juxtapose the contacts in face-to-face orientation with a substrate which has matching electrical contacts prior to bonding.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710643 Electronic package with fluid flow barriers Apr. 29, 2014
8709940 Structure of circuit board and method for fabricating the same Apr. 29, 2014
8709935 Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties Apr. 29, 2014
8709869 Method of manufacturing a plurality of electronic assemblies Apr. 29, 2014
8709867 Dual-leadframe multi-chip package and method of manufacture Apr. 29, 2014
8709866 Methods of forming integrated circuit packages Apr. 29, 2014
8703600 Electronic component and method of connecting with multi-profile bumps Apr. 22, 2014
8703541 Electronic system with expansion feature Apr. 22, 2014
8703540 Chip-scale semiconductor die packaging method Apr. 22, 2014
8703539 Multiple die packaging interposer structure and method Apr. 22, 2014
8703537 System and method to manufacture an implantable electrode Apr. 22, 2014
8703534 Semiconductor packages and methods of packaging semiconductor devices Apr. 22, 2014
8703533 Semiconductor package and method for manufacturing the same Apr. 22, 2014
8692386 Semiconductor device, method of manufacturing semiconductor device, and electronic device Apr. 8, 2014
8691627 Wafer level packaged GaN power device and manufacturing method thereof Apr. 8, 2014
8691626 Semiconductor chip device with underfill Apr. 8, 2014
8691625 Method for making a chip package Apr. 8, 2014
8691624 Die fixing method and apparatus Apr. 8, 2014
8679931 Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device Mar. 25, 2014
8679861 Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip Mar. 25, 2014
8674496 System and method for fine pitch PoP structure Mar. 18, 2014
8673688 Semiconductor package and method of manufacturing the same Mar. 18, 2014
8673685 Electronic component mounting line and electronic component mounting method Mar. 18, 2014
8673684 Semiconductor device and manufacturing method thereof Mar. 18, 2014
8671565 Blind via capture pad structure fabrication method Mar. 18, 2014
8671560 In system reflow of low temperature eutectic bond balls Mar. 18, 2014
8669664 Stacked die package for MEMS resonator system Mar. 11, 2014
8669174 Multi-die stacking using bumps with different sizes Mar. 11, 2014
8669138 Semiconductor device and method for manufacturing the same Mar. 11, 2014
8669137 Copper post solder bumps on substrate Mar. 11, 2014
8664540 Interposer testing using dummy connections Mar. 4, 2014
8664039 Methods and apparatus for alignment in flip chip bonding Mar. 4, 2014
8658472 Semiconductor device Feb. 25, 2014
8658467 Method of manufacturing stacked wafer level package Feb. 25, 2014
8658466 Semiconductor package structure and method for making the same Feb. 25, 2014
8658465 System and method to manufacture an implantable electrode Feb. 25, 2014
8658437 Package method for electronic components by thin substrate Feb. 25, 2014
8654540 Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with Feb. 18, 2014
8647926 Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip Feb. 11, 2014
8647923 Method of manufacturing semiconductor device Feb. 11, 2014
8647922 Method of forming an interconnect on a semiconductor substrate Feb. 11, 2014
8643161 Semiconductor device having double side electrode structure Feb. 4, 2014
8643150 Wafer-level package device having solder bump assemblies that include an inner pillar structure Feb. 4, 2014
8637984 Multi-chip package with pillar connection Jan. 28, 2014
8637349 Method and apparatus for integrated-circuit battery devices Jan. 28, 2014
8633601 Interconnect assemblies and methods of making and using same Jan. 21, 2014
8633597 Thermal vias in an integrated circuit package with an embedded die Jan. 21, 2014
8633061 Method of fabricating package structure Jan. 21, 2014
8633059 Integrated circuit packaging system with interconnect and method of manufacture thereof Jan. 21, 2014
8629565 Thin wafer protection device Jan. 14, 2014











 
 
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