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Class Information
Number: 438/107
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Assembly of plural semiconductive substrates each possessing electrical device
Description: Process wherein plural semiconductive substrates are combined into a hybrid construction or secured onto a common support.










Sub-classes under this class:

Class Number Class Name Patents
438/108 Flip-chip-type assembly 2,412
438/109 Stacked array (e.g., rectifier, etc.) 1,722


Patents under this class:

Patent Number Title Of Patent Date Issued
8712568 Substrate processing apparatus and display method of substrate processing apparatus Apr. 29, 2014
8710634 Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof Apr. 29, 2014
8710630 Mechanisms for marking the orientation of a sawed die Apr. 29, 2014
8709913 Simultaneous wafer bonding and interconnect joining Apr. 29, 2014
8709880 Method for fabrication of a semiconductor device and structure Apr. 29, 2014
8709878 Methods of packaging imager devices and optics modules, and resulting assemblies Apr. 29, 2014
8709871 Stacked type semiconductor memory device and chip selection circuit Apr. 29, 2014
8709869 Method of manufacturing a plurality of electronic assemblies Apr. 29, 2014
8709868 Sensor packages and method of packaging dies of differing sizes Apr. 29, 2014
8709867 Dual-leadframe multi-chip package and method of manufacture Apr. 29, 2014
8709866 Methods of forming integrated circuit packages Apr. 29, 2014
8704359 Method for manufacturing an electronic module and an electronic module Apr. 22, 2014
8704352 Semiconductor device having a liquid cooling module Apr. 22, 2014
8704349 Integrated circuit package system with exposed interconnects Apr. 22, 2014
8703540 Chip-scale semiconductor die packaging method Apr. 22, 2014
8703539 Multiple die packaging interposer structure and method Apr. 22, 2014
8703538 Integrated circuit packaging system with external wire connection and method of manufacture thereof Apr. 22, 2014
8703532 Semiconductor device and manufacturing method thereof Apr. 22, 2014
8693210 Product packaging Apr. 8, 2014
8693209 Wiring board and method for manufacturing the same Apr. 8, 2014
8693203 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices Apr. 8, 2014
8691624 Die fixing method and apparatus Apr. 8, 2014
8691607 Hermetically sealed MEMS device and method of fabrication Apr. 8, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8680687 Electrical interconnect for die stacked in zig-zag configuration Mar. 25, 2014
8680684 Stackable microelectronic package structures Mar. 25, 2014
8674517 Method of assembling two integrated circuits and corresponding structure Mar. 18, 2014
8674516 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Mar. 18, 2014
8674500 Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask Mar. 18, 2014
8674446 Electronic device including electrically conductive body for ESD protection and related methods Mar. 18, 2014
8673773 Method for producing a nanoporous layer Mar. 18, 2014
8669657 Stackable semiconductor assemblies and methods of manufacturing such assemblies Mar. 11, 2014
8669140 Method of forming stacked die package using redistributed chip packaging Mar. 11, 2014
8664776 Interconnection tape providing a serial electrode pad connection in a semiconductor device Mar. 4, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8664540 Interposer testing using dummy connections Mar. 4, 2014
8664106 Method of manufacturing semiconductor device Mar. 4, 2014
8664041 Method for designing a package and substrate layout Mar. 4, 2014
8658467 Method of manufacturing stacked wafer level package Feb. 25, 2014
8653673 Method for packaging semiconductors at a wafer level Feb. 18, 2014
8653637 Stack type semiconductor package apparatus Feb. 18, 2014
8651359 Flip chip bonder head for forming a uniform fillet Feb. 18, 2014
8648463 Assembly of multi-chip modules with proximity connectors using reflowable features Feb. 11, 2014
8644125 Seek scan probe (SSP) cantilever to mover wafer bond stop Feb. 4, 2014
8643181 Integrated circuit packaging system with encapsulation and method of manufacture thereof Feb. 4, 2014
8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus Feb. 4, 2014
8642382 Integrated circuit packaging system with support structure and method of manufacture thereof Feb. 4, 2014
8642381 Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die Feb. 4, 2014
8637961 MEMS actuator device Jan. 28, 2014
8637349 Method and apparatus for integrated-circuit battery devices Jan. 28, 2014











 
 
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