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Class Information
Number: 438/107
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor > Assembly of plural semiconductive substrates each possessing electrical device
Description: Process wherein plural semiconductive substrates are combined into a hybrid construction or secured onto a common support.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618875 |
Marking method for product information |
Nov. 17, 2009 |
| 7618847 |
Bonding method of semiconductor and laminated structure fabricated thereby |
Nov. 17, 2009 |
| 7618843 |
Method of fabricating multilayer ceramic substrate |
Nov. 17, 2009 |
| 7615479 |
Assembly comprising functional block deposited therein |
Nov. 10, 2009 |
| 7615409 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages |
Nov. 10, 2009 |
| 7615408 |
Method of manufacturing semiconductor device |
Nov. 10, 2009 |
| 7611924 |
Integrated circuit package with chip-side signal connections |
Nov. 3, 2009 |
| 7608480 |
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion |
Oct. 27, 2009 |
| 7608477 |
Process for substrate incorporating component |
Oct. 27, 2009 |
| 7608469 |
Method of fabricating a chip |
Oct. 27, 2009 |
| 7605478 |
Semiconductor package and method of manufacturing the same |
Oct. 20, 2009 |
| 7605466 |
Sealed wafer packaging of microelectromechanical systems |
Oct. 20, 2009 |
| 7601612 |
Method for forming solder joints for a flip chip assembly |
Oct. 13, 2009 |
| 7601559 |
Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor |
Oct. 13, 2009 |
| 7598619 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
Oct. 6, 2009 |
| 7598100 |
Manufacturing method of semiconductor integrated circuit device |
Oct. 6, 2009 |
| 7595222 |
Semiconductor device and manufacturing method thereof |
Sep. 29, 2009 |
| 7595221 |
Method of fabricating a patterned device using sacrificial spacer layer |
Sep. 29, 2009 |
| 7592707 |
Method and apparatus for facilitating proximity communication and power delivery |
Sep. 22, 2009 |
| 7589412 |
Semiconductor device |
Sep. 15, 2009 |
| 7588966 |
Chip mounting with flowable layer |
Sep. 15, 2009 |
| 7586183 |
Multilevel semiconductor module and method for fabricating the same |
Sep. 8, 2009 |
| 7585699 |
Semiconductor package board using a metal base |
Sep. 8, 2009 |
| 7582963 |
Vertically integrated system-in-a-package |
Sep. 1, 2009 |
| 7579214 |
Semiconductor device and a method of manufacturing the same |
Aug. 25, 2009 |
| 7575999 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
Aug. 18, 2009 |
| 7575955 |
Method for making electronic packages |
Aug. 18, 2009 |
| 7569918 |
Semiconductor package-on-package system including integrated passive components |
Aug. 4, 2009 |
| 7566977 |
Semiconductor device and method for manufacturing the same |
Jul. 28, 2009 |
| 7566648 |
Method of making solder pad |
Jul. 28, 2009 |
| 7566632 |
Lock and key structure for three-dimensional chip connection and process thereof |
Jul. 28, 2009 |
| 7566591 |
Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features |
Jul. 28, 2009 |
| 7564137 |
Stackable integrated circuit structures and systems devices and methods related thereto |
Jul. 21, 2009 |
| 7563640 |
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, an |
Jul. 21, 2009 |
| 7561221 |
Apparatuses and methods for forming assemblies |
Jul. 14, 2009 |
| 7560304 |
Method of making a semiconductor device having multiple die redistribution layer |
Jul. 14, 2009 |
| 7560303 |
Method and apparatus for linear die transfer |
Jul. 14, 2009 |
| 7557451 |
Electro-optical device and electronic apparatus |
Jul. 7, 2009 |
| 7554177 |
Attachment system incorporating a recess in a structure |
Jun. 30, 2009 |
| 7553698 |
Semiconductor package having semiconductor constructing body and method of manufacturing the same |
Jun. 30, 2009 |
| 7553696 |
Method for implementing component placement suspended within grid array packages for enhanced electrical performance |
Jun. 30, 2009 |
| 7553695 |
Method of fabricating a package for a micro component |
Jun. 30, 2009 |
| 7547577 |
Method of making circuitized substrate with solder paste connections |
Jun. 16, 2009 |
| 7547575 |
Two-stage die-bonding method for simultaneous die-bonding of multiple dies |
Jun. 16, 2009 |
| 7545029 |
Stack microelectronic assemblies |
Jun. 9, 2009 |
| 7544539 |
Forced heat transfer apparatus for heating stacked dice |
Jun. 9, 2009 |
| 7544529 |
Image sensor packaging structure and method of manufacturing the same |
Jun. 9, 2009 |
| 7543374 |
Method of manufacturing wiring substrate |
Jun. 9, 2009 |
| 7537963 |
Device and method for manufacturing the same |
May. 26, 2009 |
| 7537960 |
Method of making multi-chip package with high-speed serial communications between semiconductor dice |
May. 26, 2009 |
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