Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/106
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process provided including (a) multiple










Sub-classes under this class:

Class Number Class Name Patents
438/107 Assembly of plural semiconductive substrates each possessing electrical device 1,865
438/127 Encapsulating 2,076
438/116 Having light transmissive window 327
438/118 Including adhesive bonding step 2,110
438/115 Including contaminant removal or mitigation 212
438/117 Incorporating resilient component (e.g., spring, etc.) 302
438/125 Insulative housing or support 1,293
438/110 Making plural separate devices 896
438/121 Metallic housing or support 832
438/120 With vibration step 93


Patents under this class:

Patent Number Title Of Patent Date Issued
8710640 Integrated circuit packaging system with heat slug and method of manufacture thereof Apr. 29, 2014
8710630 Mechanisms for marking the orientation of a sawed die Apr. 29, 2014
8709934 Electronic system with vertical intermetallic compound Apr. 29, 2014
8709932 Integrated circuit packaging system with interconnects and method of manufacture thereof Apr. 29, 2014
8709873 Leadless integrated circuit packaging system and method of manufacture thereof Apr. 29, 2014
8709871 Stacked type semiconductor memory device and chip selection circuit Apr. 29, 2014
8709870 Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages Apr. 29, 2014
8709866 Methods of forming integrated circuit packages Apr. 29, 2014
8709865 Fabrication method of packaging substrate having through-holed interposer embedded therein Apr. 29, 2014
8704377 Compliant conductive nano-particle electrical interconnect Apr. 22, 2014
8704365 Integrated circuit packaging system having a cavity Apr. 22, 2014
8703539 Multiple die packaging interposer structure and method Apr. 22, 2014
8703537 System and method to manufacture an implantable electrode Apr. 22, 2014
8703536 In-situ foam material as integrated heat spreader (IHS) sealant Apr. 22, 2014
8703535 Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof Apr. 22, 2014
8703534 Semiconductor packages and methods of packaging semiconductor devices Apr. 22, 2014
8703533 Semiconductor package and method for manufacturing the same Apr. 22, 2014
8703532 Semiconductor device and manufacturing method thereof Apr. 22, 2014
8693811 High data-rate SOI optical modulator including a modified structure for reducing the capacitive effect between doped areas and a substrate Apr. 8, 2014
8692368 Integrated voltage regulator method with embedded passive device(s) Apr. 8, 2014
8692367 Wafer-level packaged device having self-assembled resilient leads Apr. 8, 2014
8692265 Lighting device Apr. 8, 2014
8691631 Device including two mounting surfaces Apr. 8, 2014
8691629 Packaging jig and process for semiconductor packaging Apr. 8, 2014
8691624 Die fixing method and apparatus Apr. 8, 2014
8687030 Exposing device, method of manufacturing the same, and image forming apparatus Apr. 1, 2014
8686313 System and methods for forming apertures in microfeature workpieces Apr. 1, 2014
8685797 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof Apr. 1, 2014
8685796 Electronic device and method of manufacturing the same Apr. 1, 2014
8685795 Flank wettable semiconductor device Apr. 1, 2014
8685791 Ribbon bonding in an electronic package Apr. 1, 2014
8685790 Semiconductor device package having backside contact and method for manufacturing Apr. 1, 2014
8685789 Ribbon bonding in an electronic package Apr. 1, 2014
8680662 Wafer level edge stacking Mar. 25, 2014
8680582 Circuit and method for interconnecting stacked integrated circuit dies Mar. 25, 2014
8679898 Semiconductor device and production method therefor Mar. 25, 2014
8673688 Semiconductor package and method of manufacturing the same Mar. 18, 2014
8673684 Semiconductor device and manufacturing method thereof Mar. 18, 2014
8671565 Blind via capture pad structure fabrication method Mar. 18, 2014
8671560 In system reflow of low temperature eutectic bond balls Mar. 18, 2014
8669581 Light emitting device package including UV light emitting diode Mar. 11, 2014
8669187 Porous lift-off layer for selective removal of deposited films Mar. 11, 2014
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8664752 Semiconductor die package and method for making the same Mar. 4, 2014
8664699 Methods and devices for fabricating and assembling printable semiconductor elements Mar. 4, 2014
8664683 Carrier and optical semiconductor device based on such a carrier Mar. 4, 2014
8664540 Interposer testing using dummy connections Mar. 4, 2014
8664043 Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts Mar. 4, 2014
8664040 Exposing connectors in packages through selective treatment Mar. 4, 2014
8664039 Methods and apparatus for alignment in flip chip bonding Mar. 4, 2014











 
 
  Recently Added Patents
Measuring device and measuring method that use pulsed electromagnetic wave
Device for data routing in networks
Process and apparatus for producing composite material that includes carbon nanotubes
High density molecular memory storage with read and write capabilities
Stool
Prevention and reduction of blood loss
MEMS structure and method for making the same
  Randomly Featured Patents
Semiconductor memory device
Method for creating a whitelist for processing e-mails
Configurable data processing device with bit reordering on inputs and outputs of configurable logic function blocks
Reactive armour effective against normal and skew attack
On chip dynamic read for non-volatile storage
Identification of uninformative function names in call-stack traces
Non-reversible valve assembly
Keratometric illumination system
Method and system for a player-selectable high-denomination bonus game
Aircraft propeller servicing unit