 |
|
 |
| |
 |
|
Class Information
Number: 438/106
Name: Semiconductor device manufacturing: process > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process provided including (a) multiple
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7618875 |
Marking method for product information |
Nov. 17, 2009 |
| 7618842 |
Method of applying encapsulant to wire bonds |
Nov. 17, 2009 |
| 7615492 |
Preparing method of CNT-based semiconductor sensitized solar cell |
Nov. 10, 2009 |
| 7615479 |
Assembly comprising functional block deposited therein |
Nov. 10, 2009 |
| 7615414 |
Dental intraoral radiological image sensor with a fiber-optic plate |
Nov. 10, 2009 |
| 7615412 |
System in package (SIP) integrated circuit and packaging method thereof |
Nov. 10, 2009 |
| 7615411 |
Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof |
Nov. 10, 2009 |
| 7615408 |
Method of manufacturing semiconductor device |
Nov. 10, 2009 |
| 7615407 |
Methods and systems for packaging integrated circuits with integrated passive components |
Nov. 10, 2009 |
| 7615406 |
Electronic device package manufacturing method and electronic device package |
Nov. 10, 2009 |
| 7615405 |
Method for precision assembly of integrated circuit chip packages |
Nov. 10, 2009 |
| 7615404 |
High-contrast laser mark on substrate surfaces |
Nov. 10, 2009 |
| 7612992 |
Cooling device for memory chips |
Nov. 3, 2009 |
| 7611924 |
Integrated circuit package with chip-side signal connections |
Nov. 3, 2009 |
| 7611923 |
Method and apparatus for forming stacked die and substrate structures for increased packing density |
Nov. 3, 2009 |
| 7608480 |
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion |
Oct. 27, 2009 |
| 7608479 |
Method of manufacturing semiconductor device and method of treating electrical connection section |
Oct. 27, 2009 |
| 7608478 |
On-chip igniter and method of manufacture |
Oct. 27, 2009 |
| 7608477 |
Process for substrate incorporating component |
Oct. 27, 2009 |
| 7607222 |
Method of manufacturing an electronic component package |
Oct. 27, 2009 |
| 7606033 |
Mounting a heat sink in thermal contact with an electronic component |
Oct. 20, 2009 |
| 7605092 |
Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same |
Oct. 20, 2009 |
| 7605021 |
Manufacturing method of electronic device |
Oct. 20, 2009 |
| 7605018 |
Method for forming a die-attach layer during semiconductor packaging processes |
Oct. 20, 2009 |
| 7601612 |
Method for forming solder joints for a flip chip assembly |
Oct. 13, 2009 |
| 7601563 |
Small form factor molded memory card and a method thereof |
Oct. 13, 2009 |
| 7601559 |
Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor |
Oct. 13, 2009 |
| 7598125 |
Method for wafer level packaging and fabricating cap structures |
Oct. 6, 2009 |
| 7598121 |
Method of manufacturing a semiconductor device |
Oct. 6, 2009 |
| 7598120 |
Method for holding semiconductor wafer |
Oct. 6, 2009 |
| 7598119 |
System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices |
Oct. 6, 2009 |
| 7598118 |
Method of manufacturing semiconductor sensor |
Oct. 6, 2009 |
| 7598117 |
Method for manufacturing semiconductor module using interconnection structure |
Oct. 6, 2009 |
| 7595221 |
Method of fabricating a patterned device using sacrificial spacer layer |
Sep. 29, 2009 |
| 7595220 |
Image sensor package and fabrication method thereof |
Sep. 29, 2009 |
| 7595219 |
IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the s |
Sep. 29, 2009 |
| 7588962 |
Method of making semiconductor device |
Sep. 15, 2009 |
| 7586193 |
Mm-wave antenna using conventional IC packaging |
Sep. 8, 2009 |
| 7585700 |
Ball grid array package stack |
Sep. 8, 2009 |
| 7584537 |
Method for making a microcircuit card |
Sep. 8, 2009 |
| 7582510 |
Electronic packaging materials for use with low-k dielectric-containing semiconductor devices |
Sep. 1, 2009 |
| 7579679 |
Chipcard with contact areas and method for producing contact areas |
Aug. 25, 2009 |
| 7579628 |
Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave |
Aug. 25, 2009 |
| 7579213 |
Modified chip attach process |
Aug. 25, 2009 |
| 7579212 |
Semiconductor device having tin-based solder layer and method for manufacturing the same |
Aug. 25, 2009 |
| 7579211 |
Flip-chip semiconductor device utilizing an elongated tip bump |
Aug. 25, 2009 |
| 7578858 |
Making capacitor structure in a semiconductor device |
Aug. 25, 2009 |
| 7576427 |
Cold weld hermetic MEMS package and method of manufacture |
Aug. 18, 2009 |
| 7573142 |
Alignment key structure in a semiconductor device and method of forming the same |
Aug. 11, 2009 |
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
