| |
 |
|
Class Information
Number: 428/901
Name: Stock material or miscellaneous articles > Printed circuit
Description: Stock material product which is an electric circuit formed by applying conductive material in a predetermined pattern onto an insulating sheet as printing with electrically conductive ink, by electroplating, by etching, coating, etc.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615277 |
Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
Nov. 10, 2009 |
| RE40947 |
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
Oct. 27, 2009 |
| 7579070 |
Multiple layer deposition for improving adhesion |
Aug. 25, 2009 |
| 7572503 |
Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same |
Aug. 11, 2009 |
| 7524388 |
Composites, method of manufacture thereof, and articles formed therefrom |
Apr. 28, 2009 |
| 7494635 |
Boron nitride agglomerated powder |
Feb. 24, 2009 |
| 7488532 |
Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
Feb. 10, 2009 |
| 7485362 |
Nanoporous laminates |
Feb. 3, 2009 |
| 7470461 |
Printed circuit board and method of manufacturing the same |
Dec. 30, 2008 |
| 7438969 |
Filling material, multilayer wiring board, and process of producing multilayer wiring board |
Oct. 21, 2008 |
| 7396588 |
Curable composition, varnish and laminate |
Jul. 8, 2008 |
| 7390571 |
Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg |
Jun. 24, 2008 |
| 7383629 |
Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof |
Jun. 10, 2008 |
| 7356916 |
Circuit-formed substrate and method of manufacturing circuit-formed substrate |
Apr. 15, 2008 |
| 7348080 |
Low temperature polyimide adhesive compositions and methods relating thereto |
Mar. 25, 2008 |
| 7348069 |
Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate |
Mar. 25, 2008 |
| 7332231 |
Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same |
Feb. 19, 2008 |
| 7332212 |
Circuitized substrate with conductive polymer and seed material adhesion layer |
Feb. 19, 2008 |
| 7311966 |
Porous insulating film and its laminates |
Dec. 25, 2007 |
| 7304392 |
Die for forming an optical element, and production method as well as regeneration method of the same |
Dec. 4, 2007 |
| 7303811 |
Porous insulating film and its laminates |
Dec. 4, 2007 |
| 7301228 |
Semiconductor device, method for manufacturing same and thin plate interconnect line member |
Nov. 27, 2007 |
| 7294389 |
Microstructure array and a microlens array |
Nov. 13, 2007 |
| 7291380 |
Laser enhanced plating for forming wiring patterns |
Nov. 6, 2007 |
| 7282255 |
Flexible printed circuit board and process for producing the same |
Oct. 16, 2007 |
| 7279216 |
Identifiable flexible printed circuit board and method of fabricating the same |
Oct. 9, 2007 |
| 7273654 |
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame |
Sep. 25, 2007 |
| 7263766 |
Insulating substrate, manufacturing method thereof, and module semiconductor device with insulating substrate |
Sep. 4, 2007 |
| 7258819 |
Voltage variable substrate material |
Aug. 21, 2007 |
| 7255925 |
Thermosetting resin composition for high speed transmission circuit board |
Aug. 14, 2007 |
| 7252891 |
Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same |
Aug. 7, 2007 |
| 7224046 |
Multilayer wiring board incorporating carbon fibers and glass fibers |
May. 29, 2007 |
| 7217463 |
Machine direction oriented polymeric films and methods of making the same |
May. 15, 2007 |
| 7217462 |
Metal foil-clad laminate |
May. 15, 2007 |
| 7214424 |
Heat-peelable pressure-sensitive adhesive sheet |
May. 8, 2007 |
| 7213334 |
Method for manufacturing double-sided flexible printed board |
May. 8, 2007 |
| RE39615 |
Adhesive compositions and copper foils and copper clad laminates using same |
May. 8, 2007 |
| 7211735 |
Processes for manufacturing multilayer flexible wiring boards |
May. 1, 2007 |
| 7208539 |
Thermosetting resin composition, and prepreg and laminated board using the same |
Apr. 24, 2007 |
| 7208062 |
Method of producing multilayer printed wiring board |
Apr. 24, 2007 |
| 7192651 |
Resin composition and prepreg for laminate and metal-clad laminate |
Mar. 20, 2007 |
| 7180006 |
Tape substrate and method for fabricating the same |
Feb. 20, 2007 |
| 7179552 |
Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
Feb. 20, 2007 |
| 7179520 |
Circuit substrate, electro-optic device and electronic equipment |
Feb. 20, 2007 |
| 7172805 |
Method for manufacturing a sequential backplane |
Feb. 6, 2007 |
| 7169331 |
Conductive paste and ceramic multilayer substrate |
Jan. 30, 2007 |
| 7166361 |
Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered |
Jan. 23, 2007 |
| 7160609 |
Curable composition, varnish, and layered product |
Jan. 9, 2007 |
| 7157134 |
Layered structure, sensor and method of producing and use of the same |
Jan. 2, 2007 |
| 7140101 |
Method for fabricating anisotropic conductive substrate |
Nov. 28, 2006 |
|
|
|
