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Class Information
Number: 428/901
Name: Stock material or miscellaneous articles > Printed circuit
Description: Stock material product which is an electric circuit formed by applying conductive material in a predetermined pattern onto an insulating sheet as printing with electrically conductive ink, by electroplating, by etching, coating, etc.

Patents under this class:

Patent Number Title Of Patent Date Issued
8709587 Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board and semiconductor device Apr. 29, 2014
8663803 Varnish composition, and pre-impregnated manufacture thereof Mar. 4, 2014
8637151 Interlayer dielectric film with carrier material and multilayer printed circuit board therewith Jan. 28, 2014
8632874 Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith Jan. 21, 2014
8580331 Digital manufacture of an electrical circuit Nov. 12, 2013
8551628 Composite material, high-frequency circuit substrate made therefrom and making method thereof Oct. 8, 2013
8541096 Printed circuit board and method of manufacturing the same Sep. 24, 2013
8516690 Anisotropic conductive joint package Aug. 27, 2013
8512466 Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board Aug. 20, 2013
8501299 Conductive paste, multilayer ceramic substrate and its production method Aug. 6, 2013
8475891 Embossed release paper and process for producing the same Jul. 2, 2013
8465837 Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board Jun. 18, 2013
8445094 Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers May. 21, 2013
8440313 Crosslinkable thermoset monomer, composition for producing printed circuit board comprising the thermoset monomer and printed circuit board using the composition May. 14, 2013
8440292 Multi-layer article for flexible printed circuits May. 14, 2013
8440285 Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof May. 14, 2013
8431224 Resin composition for forming insulating layer of printed wiring board Apr. 30, 2013
8394731 Composite woven fabric and printed wiring board Mar. 12, 2013
8383533 Low-temperature sintering ceramic material and ceramic substrate Feb. 26, 2013
8361918 Ceramic composition, method for producing the same, ceramic substrate and method for producing ceramic green layer Jan. 29, 2013
8361598 Substrate anchor structure and method Jan. 29, 2013
8349460 Organosilicon copolymer composites, method of manufacture, and articles formed therefrom Jan. 8, 2013
8323769 Methods of treating a surface to promote metal plating and devices formed Dec. 4, 2012
8318313 Method for supporting metal nanoparticles and metal nanoparticles-carrying substrate Nov. 27, 2012
8309636 Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the same Nov. 13, 2012
8294268 Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device Oct. 23, 2012
8288003 Method for producing phosphorus-containing phenolic compound, novel phosphorus-containing phenol, curable resin composition, cured product of the same, printed wiring board, and semiconductor Oct. 16, 2012
8263177 Organic polymer coating for protection against creep corrosion Sep. 11, 2012
8252406 Carrier foil Aug. 28, 2012
8221880 Adhesive composition Jul. 17, 2012
8221875 Varnish, prepreg, and substrate thereof Jul. 17, 2012
8211538 Microelectronic security coatings Jul. 3, 2012
8206819 Varnish, prepreg, and substrate thereof Jun. 26, 2012
8187706 Adhesive composition May. 29, 2012
8182904 Laminated ceramic package May. 22, 2012
8178191 Multilayer wiring board and method of making the same May. 15, 2012
8173040 Composition including benzoxazine-based compound for forming board and board fabricated using the same May. 8, 2012
8147903 Circuit pattern forming method, circuit pattern forming device and printed circuit board Apr. 3, 2012
8142878 Heat resistant halogen free substrate core material Mar. 27, 2012
8142840 Adhesion promotion in printed circuit boards Mar. 27, 2012
8124226 Flexible circuits Feb. 28, 2012
8110254 Flexible circuit chemistry Feb. 7, 2012
8110247 Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials Feb. 7, 2012
8105663 Composition for forming substrate, and prepreg and substrate using the same Jan. 31, 2012
8101266 Multilayer printed circuit board Jan. 24, 2012
8101248 Composition for forming substrate, and prepreg and substrate using the same Jan. 24, 2012
8097545 Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition Jan. 17, 2012
8092900 Solution, component for plating, insulating sheet, laminate, and printed circuit board Jan. 10, 2012
8088490 Varnish, prepreg, and substrate thereof Jan. 3, 2012
8053378 Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition Nov. 8, 2011

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