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Class Information
Number: 428/675
Name: Stock material or miscellaneous articles > All metal or with adjacent metals > Composite; i.e., plural, adjacent, spatially distinct metal components (e.g., layers, joint, etc.) > Transition metal-base component > Group viii or ib metal-base component > Cu-base component > Next to co-, cu-, or ni-base component
Description: Subject matter in which the copper-base component is adjacent a component which contains 40 percent or more of cobalt, copper, or nickel.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615255 |
Metal duplex method |
Nov. 10, 2009 |
| 7604872 |
Corrosion resisting joining area and method between materials of copper and stainless steel or titanium, which are the constituents of permanent cathodes for electrolytic processes and cathode |
Oct. 20, 2009 |
| 7575814 |
Laminated composite material, production and use thereof |
Aug. 18, 2009 |
| 7569282 |
Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
Aug. 4, 2009 |
| 7491449 |
Copper-silver alloy wire and method for manufacturing the same |
Feb. 17, 2009 |
| 7476449 |
Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
Jan. 13, 2009 |
| 7472650 |
Nickel alloy plated structure |
Jan. 6, 2009 |
| 7393594 |
Laminated metal thin plate formed by electrodeposition and method of producing the same |
Jul. 1, 2008 |
| 7381475 |
Treated copper foil and circuit board |
Jun. 3, 2008 |
| 7344785 |
Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same |
Mar. 18, 2008 |
| 7341796 |
Copper foil having blackened surface or layer |
Mar. 11, 2008 |
| 7335428 |
Cooking vessel comprising a base made of a multilayer material and a side wall, and article of multilayer material |
Feb. 26, 2008 |
| 7296370 |
Electroplated metals with silvery-white appearance and method of making |
Nov. 20, 2007 |
| 7287468 |
Nickel alloy plated structure |
Oct. 30, 2007 |
| 7282255 |
Flexible printed circuit board and process for producing the same |
Oct. 16, 2007 |
| 7279231 |
Electroless plating structure |
Oct. 9, 2007 |
| 7267861 |
Solder joints for copper metallization having reduced interfacial voids |
Sep. 11, 2007 |
| 7268021 |
Lead frame and method of manufacturing the same |
Sep. 11, 2007 |
| 7247396 |
Highly oriented perpendicular magnetic recording media |
Jul. 24, 2007 |
| 7220494 |
Metal dusting resistant product |
May. 22, 2007 |
| 7217464 |
Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resista |
May. 15, 2007 |
| 7211340 |
Thin film structures providing strong basal plane growth orientation and magnetic recording media comprising same |
May. 1, 2007 |
| 7172818 |
Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board |
Feb. 6, 2007 |
| 7169486 |
Highly oriented perpendicular magnetic recording media |
Jan. 30, 2007 |
| 7163753 |
Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile |
Jan. 16, 2007 |
| 7132158 |
Support layer for thin copper foil |
Nov. 7, 2006 |
| 7108923 |
Copper foil for printed circuit board with taking environmental conservation into consideration |
Sep. 19, 2006 |
| 7097915 |
Separator plate for manufacturing printed circuit board components |
Aug. 29, 2006 |
| 7087315 |
Method for forming plating film |
Aug. 8, 2006 |
| 7052779 |
Copper foil for fine pattern printed circuits and method of production of same |
May. 30, 2006 |
| 7052781 |
Flexible copper foil structure and fabrication method thereof |
May. 30, 2006 |
| 7029761 |
Bonding layer for bonding resin on copper surface |
Apr. 18, 2006 |
| 7022419 |
Composite plating film and a process for forming the same |
Apr. 4, 2006 |
| 6994917 |
Composite material and method for manufacturing the same |
Feb. 7, 2006 |
| 6989199 |
Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board |
Jan. 24, 2006 |
| 6939621 |
Plated copper alloy material and process for production thereof |
Sep. 6, 2005 |
| 6939622 |
Chip-on-film use copper foil |
Sep. 6, 2005 |
| 6940721 |
Thermal interface structure for placement between a microelectronic component package and heat sink |
Sep. 6, 2005 |
| 6911269 |
Lead-free chemical nickel alloy |
Jun. 28, 2005 |
| 6905779 |
Sliding material made of copper alloy, method of producing same, sliding bearing material, and method of producing same |
Jun. 14, 2005 |
| 6902824 |
Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same |
Jun. 7, 2005 |
| 6893740 |
CPP type magnetoresistive sensor including pinned magnetic layer provided with hard magnetic region |
May. 17, 2005 |
| 6893742 |
Copper foil with low profile bond enhancement |
May. 17, 2005 |
| 6893738 |
Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil |
May. 17, 2005 |
| 6884520 |
Perpendicular magnetic recording medium and method of manufacturing the same and product thereof |
Apr. 26, 2005 |
| 6878461 |
Surface treatment structure, contact, sliding, fitting-in and ornamental members, and method for manufacturing the same |
Apr. 12, 2005 |
| 6872465 |
Solder |
Mar. 29, 2005 |
| 6866765 |
Electrolytic copper-plated R-T-B magnet and plating method thereof |
Mar. 15, 2005 |
| 6863991 |
Coated biperiodic metallic mesh arrays with molecular monolayers and lipid bilayers thereon |
Mar. 8, 2005 |
| 6855437 |
Decorative coatings having resistance to corrosion and wear |
Feb. 15, 2005 |
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