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Class Information
Number: 428/674
Name: Stock material or miscellaneous articles > All metal or with adjacent metals > Composite; i.e., plural, adjacent, spatially distinct metal components (e.g., layers, joint, etc.) > Transition metal-base component > Group viii or ib metal-base component > Cu-base component
Description: Subject matter in which a component contains 40 percent or more of copper.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7588835 |
Method of treating the surface of copper and copper |
Sep. 15, 2009 |
| 7582362 |
Thermal spray compositions for abradable seals |
Sep. 1, 2009 |
| 7462926 |
Leadframe comprising tin plating or an intermetallic layer formed therefrom |
Dec. 9, 2008 |
| 7449249 |
Spray powder |
Nov. 11, 2008 |
| 7435484 |
Ruthenium thin film-formed structure |
Oct. 14, 2008 |
| 7422792 |
Metallized polymide film |
Sep. 9, 2008 |
| 7416789 |
Refractory metal substrate with improved thermal conductivity |
Aug. 26, 2008 |
| 7413974 |
Copper-metallized integrated circuits having electroless thick copper bond pads |
Aug. 19, 2008 |
| 7396596 |
Article with a coating of electrically conductive polymer |
Jul. 8, 2008 |
| 7378160 |
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same |
May. 27, 2008 |
| 7357883 |
Conductive adhesive, method of producing the same, and bonding method |
Apr. 15, 2008 |
| 7341796 |
Copper foil having blackened surface or layer |
Mar. 11, 2008 |
| 7297413 |
Plating substrate, electroless plating method, and circuit forming method using the same |
Nov. 20, 2007 |
| 7291401 |
Non-hexavalent-chromium type corrosion resistant coating film structure having a resin layer and a metal layer that is superior in terms of adhesion to the resin layer |
Nov. 6, 2007 |
| 7279231 |
Electroless plating structure |
Oct. 9, 2007 |
| 7268021 |
Lead frame and method of manufacturing the same |
Sep. 11, 2007 |
| 7261951 |
Copper based sintered contact material and double-layered sintered contact member |
Aug. 28, 2007 |
| 7255933 |
Multi-layer sliding part and a method for its manufacture |
Aug. 14, 2007 |
| 7247396 |
Highly oriented perpendicular magnetic recording media |
Jul. 24, 2007 |
| 7217464 |
Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resista |
May. 15, 2007 |
| 7211340 |
Thin film structures providing strong basal plane growth orientation and magnetic recording media comprising same |
May. 1, 2007 |
| 7211332 |
Laminate |
May. 1, 2007 |
| 7195825 |
Multi-layer sliding part and a method for its manufacture |
Mar. 27, 2007 |
| 7169486 |
Highly oriented perpendicular magnetic recording media |
Jan. 30, 2007 |
| 7163753 |
Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile |
Jan. 16, 2007 |
| 7160632 |
Material for sliding contacts, clad composite material and small-sized DC motor using the same |
Jan. 9, 2007 |
| 7157152 |
Copper-tin-oxygen alloy plating |
Jan. 2, 2007 |
| 7153590 |
Composite copper foil and manufacturing method thereof |
Dec. 26, 2006 |
| 7138190 |
Composite containing reinforcing fibers comprising carbon |
Nov. 21, 2006 |
| 7132158 |
Support layer for thin copper foil |
Nov. 7, 2006 |
| 7128980 |
Composite component for fusion reactors |
Oct. 31, 2006 |
| 7108923 |
Copper foil for printed circuit board with taking environmental conservation into consideration |
Sep. 19, 2006 |
| 7094474 |
Composite powder and gall-resistant coating |
Aug. 22, 2006 |
| 7087315 |
Method for forming plating film |
Aug. 8, 2006 |
| 7087318 |
Copper based sintered contact material and double-layered sintered contact member |
Aug. 8, 2006 |
| 7083859 |
Conductive powder and method for preparing the same |
Aug. 1, 2006 |
| 7078110 |
Slide bearing |
Jul. 18, 2006 |
| 7056598 |
Copper based sintered contact material and double-layered sintered contact member |
Jun. 6, 2006 |
| 7052781 |
Flexible copper foil structure and fabrication method thereof |
May. 30, 2006 |
| 7052779 |
Copper foil for fine pattern printed circuits and method of production of same |
May. 30, 2006 |
| 7049007 |
Composite foil and its manufacturing process |
May. 23, 2006 |
| 7037597 |
Copper foil for printed-wiring board |
May. 2, 2006 |
| 7037594 |
Electromagnetic wave shielding member and process for producing the same |
May. 2, 2006 |
| 7029761 |
Bonding layer for bonding resin on copper surface |
Apr. 18, 2006 |
| 7018721 |
Structure for interconnecting conductors and connecting method |
Mar. 28, 2006 |
| 7005189 |
Laminate and its production method |
Feb. 28, 2006 |
| 7001671 |
Kinetic sprayed electrical contacts on conductive substrates |
Feb. 21, 2006 |
| 6991856 |
Methods of making and using freestanding reactive multilayer foils |
Jan. 31, 2006 |
| 6986950 |
Partition or method for producing a partition for a multilayer pressed packet |
Jan. 17, 2006 |
| 6984454 |
Wear-resistant member having a hard composite comprising hard constituents held in an infiltrant matrix |
Jan. 10, 2006 |
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