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Class Information
Number: 428/645
Name: Stock material or miscellaneous articles > All metal or with adjacent metals > Composite; i.e., plural, adjacent, spatially distinct metal components (e.g., layers, joint, etc.) > Pb-base component
Description: Subject matter in which a component has 40 percent or more of lead.


Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
7294394 Phase change material containing fusible particles as thermally conductive filler Nov. 13, 2007
7229699 Bearing having embedded hard particle layer and overlay and method of manufacture Jun. 12, 2007
7169533 Optical information recording medium, method for manufacturing the same and recording/reproduction method Jan. 30, 2007
7083894 Optical recording medium Aug. 1, 2006
6926955 Phase change material containing fusible particles as thermally conductive filler Aug. 9, 2005
6878465 Under bump metallurgy for Lead-Tin bump over copper pad Apr. 12, 2005
6866765 Electrolytic copper-plated R-T-B magnet and plating method thereof Mar. 15, 2005
6852210 Plating method and plating bath precursor used therefor Feb. 8, 2005
6846611 Phase-change optical recording medium Jan. 25, 2005
6813153 Polymer solder hybrid Nov. 2, 2004
6800377 Multilayer sliding material Oct. 5, 2004
6760396 Coated metal articles and method of making Jul. 6, 2004
6740427 Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same May. 25, 2004
6740426 Sliding member with composite plating film May. 25, 2004
6630251 Leach-resistant solder alloys for silver-based thick-film conductors Oct. 7, 2003
6616857 C-axis oriented lead germanate film Sep. 9, 2003
6475675 Method of making clad materials using lead alloys and composite strips made by such method Nov. 5, 2002
6358630 Soldering member for printed wiring boards Mar. 19, 2002
6337145 Multilayer material for sliding elements and process for the production thereof Jan. 8, 2002
6326088 Diffusion-soldered joint and method for making diffusion-soldered joints Dec. 4, 2001
6306526 Semiconductor packaging metal lid Oct. 23, 2001
6265085 Bonding material and bump Jul. 24, 2001
6235405 Electrodeposited alloy layer, in particular an overlay of a plain bearing May. 22, 2001
6221503 Electrode modification using an unzippable polymer paste Apr. 24, 2001
6210547 Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties Apr. 3, 2001
6197435 Substrate Mar. 6, 2001
6143427 Laminated material Nov. 7, 2000
6127050 Archival imaging medium and method therefor Oct. 3, 2000
6095404 Method for assembling high temperature electronics Aug. 1, 2000
6068931 Self-lubricating bearing material and plain bearing of such a bearing material May. 30, 2000
6066402 High temperature electronics assembly using lead-antimony-tin alloys May. 23, 2000
6037065 Spheres useful in a detachable connective medium for ball grid array assemblies Mar. 14, 2000
6027822 Coated elongated core material Feb. 22, 2000
5976712 Multilayer material for sliding elements and process and means for the production thereof Nov. 2, 1999
5939215 Laminated material and process for producing the same Aug. 17, 1999
5925470 Coated elongated core material Jul. 20, 1999
5910377 Clad steel plate Jun. 8, 1999
5882587 Lead alloy used for sliding bearing Mar. 16, 1999
5840391 Decorative glass sheet with simulated beveled pane and method for forming the same Nov. 24, 1998
5770323 Bearings Jun. 23, 1998
5727727 Flowing solder in a gap Mar. 17, 1998
5718983 Thin film composite having ferromagnetic and piezoelectric properties comprising a layer of Pb-Cd-Fe and a layer of Cr-Zn-(Te or Tl) Feb. 17, 1998
5665480 Copper-lead alloy bearing Sep. 9, 1997
5545489 Multi-layer sliding bearing having excellent fretting property Aug. 13, 1996
5543236 Multi-layered slide bearing material Aug. 6, 1996
5468567 Slide member Nov. 21, 1995
5453244 Aluminum alloy bearing Sep. 26, 1995
5434012 Multilayer slide bearing and bearing assembly Jul. 18, 1995
5432013 Sliding bearing for light alloy housing Jul. 11, 1995
5414300 Lid for semiconductor package and package having the lid May. 9, 1995

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