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Class Information
Number: 428/620
Name: Stock material or miscellaneous articles > All metal or with adjacent metals > Composite; i.e., plural, adjacent, spatially distinct metal components (e.g., layers, joint, etc.) > Semiconductor component
Description: Subject matter in which one of the components is described as being an electrical semiconductor, that is, a material with an electrical conductivity between that of a conductor and an insulator.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7560172 |
Low voltage CMOS structure with dynamic threshold voltage |
Jul. 14, 2009 |
| 7547412 |
Composite material, method for producing same and member using same |
Jun. 16, 2009 |
| RE40725 |
Magnetic body formed by quantum dot array using non-magnetic semiconductor |
Jun. 9, 2009 |
| 7534488 |
Graded core/shell semiconductor nanorods and nanorod barcodes |
May. 19, 2009 |
| 7521122 |
Laminated sheet |
Apr. 21, 2009 |
| 7416789 |
Refractory metal substrate with improved thermal conductivity |
Aug. 26, 2008 |
| 7413974 |
Copper-metallized integrated circuits having electroless thick copper bond pads |
Aug. 19, 2008 |
| 7390568 |
Semiconductor nanocrystal heterostructures having specific charge carrier confinement |
Jun. 24, 2008 |
| 7361963 |
Optical film |
Apr. 22, 2008 |
| 7354649 |
Semiconductor workpiece |
Apr. 8, 2008 |
| 7329896 |
Polymerizable charge transport compounds |
Feb. 12, 2008 |
| 7276292 |
Insulating substrate boards for semiconductor and power modules |
Oct. 2, 2007 |
| 7276296 |
Immersion plating and plated structures |
Oct. 2, 2007 |
| 7268021 |
Lead frame and method of manufacturing the same |
Sep. 11, 2007 |
| 7189795 |
Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives |
Mar. 13, 2007 |
| 7141310 |
Metal matrix composite structure and method |
Nov. 28, 2006 |
| 7095125 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Aug. 22, 2006 |
| 7087316 |
Low-expansion unit, method of manufacturing the same and semiconductor provided with the same |
Aug. 8, 2006 |
| 7078109 |
Heat spreading thermal interface structure |
Jul. 18, 2006 |
| 7074480 |
Porous body and method of manufacturing the same |
Jul. 11, 2006 |
| 7070855 |
Porous material and production process thereof |
Jul. 4, 2006 |
| 7067200 |
Joined bodies and a method of producing the same |
Jun. 27, 2006 |
| 7049004 |
Index tunable thin film interference coatings |
May. 23, 2006 |
| 7037559 |
Immersion plating and plated structures |
May. 2, 2006 |
| 7037597 |
Copper foil for printed-wiring board |
May. 2, 2006 |
| 7037399 |
Underfill encapsulant for wafer packaging and method for its application |
May. 2, 2006 |
| 7037581 |
Conductive silicon composite, preparation thereof, and negative electrode material for non-aqueous electrolyte secondary cell |
May. 2, 2006 |
| 7006354 |
Heat radiating structure for electronic device |
Feb. 28, 2006 |
| 6998180 |
Package with a substrate of high thermal conductivity |
Feb. 14, 2006 |
| 6974531 |
Method for electroplating on resistive substrates |
Dec. 13, 2005 |
| 6958194 |
Imager with improved sensitivity |
Oct. 25, 2005 |
| 6935554 |
Metal/ceramic bonding article and method for producing same |
Aug. 30, 2005 |
| 6919420 |
Acid-cleavable acetal and ketal based epoxy oligomers |
Jul. 19, 2005 |
| 6916522 |
Charge-giving body, and pattern-formed body using the same |
Jul. 12, 2005 |
| 6903338 |
Method and apparatus for reducing substrate edge effects in electron lenses |
Jun. 7, 2005 |
| 6899960 |
Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material |
May. 31, 2005 |
| 6893736 |
Thermosetting resin compositions useful as underfill sealants |
May. 17, 2005 |
| 6884522 |
Metal matrix composite structure and method |
Apr. 26, 2005 |
| 6869702 |
Substrate for epitaxial growth |
Mar. 22, 2005 |
| 6869671 |
Enabling nanostructured materials via multilayer thin film precursor and applications to biosensors |
Mar. 22, 2005 |
| 6861672 |
Semiconductor light emitting element and method for fabricating the same |
Mar. 1, 2005 |
| 6855952 |
Semiconductor device and semiconductor package |
Feb. 15, 2005 |
| 6844084 |
Spinel substrate and heteroepitaxial growth of III-V materials thereon |
Jan. 18, 2005 |
| 6841273 |
Silicon/silicon carbide composite and process for manufacturing the same |
Jan. 11, 2005 |
| 6835246 |
Nanostructures for hetero-expitaxial growth on silicon substrates |
Dec. 28, 2004 |
| 6833570 |
Structure comprising an insulated part in a solid substrate and method for producing same |
Dec. 21, 2004 |
| 6830825 |
Epoxy resin composition and semiconductor device |
Dec. 14, 2004 |
| 6818318 |
Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex |
Nov. 16, 2004 |
| 6818319 |
Diffusion barrier multi-layer structure for thin film transistor liquid crystal displays and process for fabricating thereof |
Nov. 16, 2004 |
| 6815084 |
Discontinuous high-modulus fiber metal matrix composite for thermal management applications |
Nov. 9, 2004 |
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