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Class Information
Number: 428/618
Name: Stock material or miscellaneous articles > All metal or with adjacent metals > Composite; i.e., plural, adjacent, spatially distinct metal components (e.g., layers, joint, etc.) > Deflectable by temperature change (e.g., thermostat element) > One component cu-based
Description: Subject matter in which one component of the composite is copper or an alloy containing more than 40% copper.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7547479 |
Tin-coated printed circuit boards with low tendency to whisker formation |
Jun. 16, 2009 |
| 7455915 |
Selective application of conductive material to substrates by pick and place of compliant contact arrays |
Nov. 25, 2008 |
| 7223481 |
Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circ |
May. 29, 2007 |
| 7175920 |
Copper foil for high-density ultra-fine printed wiring board |
Feb. 13, 2007 |
| 7026059 |
Copper foil for high-density ultrafine printed wiring boad |
Apr. 11, 2006 |
| 7005195 |
Metallic-based adhesion materials |
Feb. 28, 2006 |
| 6994918 |
Selective application of conductive material to circuit boards by pick and place |
Feb. 7, 2006 |
| 6984456 |
Flexible printed wiring board for chip-on flexibles |
Jan. 10, 2006 |
| 6924043 |
Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier |
Aug. 2, 2005 |
| 6919137 |
High-strength solder joint |
Jul. 19, 2005 |
| 6831024 |
Gold layer-laminated fabric and method for fabricating the same |
Dec. 14, 2004 |
| 6805964 |
Protective coatings for improved tarnish resistance in metal foils |
Oct. 19, 2004 |
| 6746785 |
Device for setting a defined electric potential on a ferrite core of an inductive component and/or for reducing damping of the inductive component by losses induced by its magnetic field |
Jun. 8, 2004 |
| 6737153 |
Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
May. 18, 2004 |
| 6645606 |
Electrical device having metal pad bonded with metal wiring and manufacturing method thereof |
Nov. 11, 2003 |
| 6605369 |
Surface-treated copper foil and method for producing the same |
Aug. 12, 2003 |
| 6579591 |
Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
Jun. 17, 2003 |
| 6537675 |
Protective coatings for improved tarnish resistance in metal foils |
Mar. 25, 2003 |
| 6485843 |
Apparatus and method for mounting BGA devices |
Nov. 26, 2002 |
| 6475629 |
Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device |
Nov. 5, 2002 |
| 6455177 |
Stabilization of GMR devices |
Sep. 24, 2002 |
| 6329072 |
Microporous copper film and electroless copper plating solution for obtaining the same |
Dec. 11, 2001 |
| 6329074 |
Copper foil for printed wiring board having excellent chemical resistance and heat resistance |
Dec. 11, 2001 |
| 6326685 |
Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix |
Dec. 4, 2001 |
| 6218030 |
Soldered product |
Apr. 17, 2001 |
| 6171714 |
Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
Jan. 9, 2001 |
| 6153320 |
Magnetic devices with laminated ferromagnetic structures formed with improved antiferromagnetically coupling films |
Nov. 28, 2000 |
| 6114048 |
Functionally graded metal substrates and process for making same |
Sep. 5, 2000 |
| 5895533 |
Beryllium-copper bonding material |
Apr. 20, 1999 |
| 5627079 |
Refunctionalized oxyfluorinated surfaces |
May. 6, 1997 |
| 5573860 |
Bimetal |
Nov. 12, 1996 |
| 5562973 |
Ceramic multi-layer wiring board |
Oct. 8, 1996 |
| 5441818 |
Electro-deposition coated member, process for producing electro-deposition coated member, and electro-deposition coating use therefor |
Aug. 15, 1995 |
| 5439732 |
Ceramic multi-layer wiring board |
Aug. 8, 1995 |
| 5257733 |
Process for thermodynamically treating a region joining two members and product thereof |
Nov. 2, 1993 |
| 5151308 |
High density thermal spray coating |
Sep. 29, 1992 |
| 5145733 |
Electro-deposition coated member |
Sep. 8, 1992 |
| RE32942 |
Low thermal expansivity and high thermal conductivity substrate |
Jun. 6, 1989 |
| 4808246 |
Composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties and process for its production |
Feb. 28, 1989 |
| 4795670 |
Multilayer ceramic substrate with circuit patterns |
Jan. 3, 1989 |
| 4740666 |
Electrical discharge machining electrode |
Apr. 26, 1988 |
| 4637962 |
Composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties and process for its production |
Jan. 20, 1987 |
| 4569692 |
Low thermal expansivity and high thermal conductivity substrate |
Feb. 11, 1986 |
| 4537810 |
Metallic endless press band having an embossed surface for use in double band presses in the manufacture of laminates |
Aug. 27, 1985 |
| 4518444 |
Material which is at least partially made from a constituent having a one-way shape memory effect and process to produce said material |
May. 21, 1985 |
| 4480013 |
Substrate for use in semiconductor apparatus |
Oct. 30, 1984 |
| 4444848 |
Adherent metal coatings on rubber-modified epoxy resin surfaces |
Apr. 24, 1984 |
| 4207380 |
Aluminum thermostat metal |
Jun. 10, 1980 |
| 4207361 |
Corrosion inhibited manganese alloys in thermal metals |
Jun. 10, 1980 |
| 4115624 |
Thermostat metal compositions |
Sep. 19, 1978 |
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