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Browse by Category: Main > Material Science
Class Information
Number: 428/210
Name: Stock material or miscellaneous articles > Structurally defined web or sheet (e.g., overall dimension, etc.) > Discontinuous or differential coating, impregnation or bond (e.g., artwork, printing, retouched photograph, etc.) > Including ceramic, glass, porcelain or quartz layer
Description: Subject matter for product in which one of the layers contains fused clay* (ceramic*), a fine, white, translucent hard earthenware (porcelain*), or the fused mixture of the silicates of the alkali and alkaline earth or heavy metals (glass*).










Patents under this class:
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Patent Number Title Of Patent Date Issued
4835593 Multilayer thin film metallurgy for pin brazing May. 30, 1989
4832996 Semiconductor die for plastic encapsulation having an adhesion promoter May. 23, 1989
4833004 Structure of copper conductor and method of forming same May. 23, 1989
4830988 Dielectric inks for multilayer copper circuits May. 16, 1989
4818583 Use of a fibrous web incorporating microspheres for preparing reinforced objects Apr. 4, 1989
4816323 Multilayer wiring substrate Mar. 28, 1989
4812349 Sheet of roofcovering material Mar. 14, 1989
4806334 Glazed ceramic substrate Feb. 21, 1989
4801488 Sealing glass composite Jan. 31, 1989
4799958 Metallizing paste Jan. 24, 1989
4799983 Multilayer ceramic substrate and process for forming therefor Jan. 24, 1989
4795667 Vehicle window assembly having a retention shield and method and apparatus for producing same Jan. 3, 1989
4795670 Multilayer ceramic substrate with circuit patterns Jan. 3, 1989
4783358 Ceramic wiring substrate Nov. 8, 1988
4781968 Micro-electronics devices and methods of manufacturing same Nov. 1, 1988
4781970 Strengthening a ceramic by post sinter coating with a compressive surface layer Nov. 1, 1988
4777020 Sheetlike object such as microscope slide Oct. 11, 1988
4777206 Article of manufacture composed of gel Oct. 11, 1988
4775596 Composite substrate for integrated circuits Oct. 4, 1988
4772574 Ceramic filled glass dielectrics Sep. 20, 1988
4770953 Aluminum nitride sintered body having conductive metallized layer Sep. 13, 1988
4769269 Article containing conductive through-holes Sep. 6, 1988
4769272 Ceramic lid hermetic seal package structure Sep. 6, 1988
4766027 Method for making a ceramic multilayer structure having internal copper conductors Aug. 23, 1988
4764432 Photo-mask with regions having a differing optical transmissivities Aug. 16, 1988
4761325 Multilayer ceramic circuit board Aug. 2, 1988
4759965 Ceramic, preparation thereof and electronic circuit substrate by use thereof Jul. 26, 1988
4752521 Sealing glass composite Jun. 21, 1988
4749600 Liquid absorbing and immobilizing packet Jun. 7, 1988
4748071 Decal for decoration with bright noble metal May. 31, 1988
4746560 Decorative composite panel May. 24, 1988
4743489 Multilayer wiring substrate May. 10, 1988
4743741 Electrically heated, glass vision unit May. 10, 1988
4740414 Ceramic/organic multilayer interconnection board Apr. 26, 1988
4734233 Ceramic wiring substrate and process for producing the same Mar. 29, 1988
4734316 Enamellings with heterogeneous structure Mar. 29, 1988
4732794 Porcelain enamel composition and substrates coated therewith Mar. 22, 1988
4732801 Graded oxide/nitride via structure and method of fabrication therefor Mar. 22, 1988
4732802 Cermet resistive element for variable resistor Mar. 22, 1988
4728562 Dielectric composition Mar. 1, 1988
4728781 Heated backlights Mar. 1, 1988
4725465 Water-soluble packet for containing chemical spills Feb. 16, 1988
4725480 Hermetically sealed electronic component Feb. 16, 1988
4724182 Thin film circuit substrate Feb. 9, 1988
4720418 Pre-reacted resistor paint, and resistors made therefrom Jan. 19, 1988
4714645 Electronic parts and process for the manufacture of the same Dec. 22, 1987
4713284 Ceramic coated laminate and process for producing the same Dec. 15, 1987
4711804 Circuit board construction Dec. 8, 1987
4710418 Optical recording medium Dec. 1, 1987
4710419 In-mold process for fabrication of molded plastic printed circuit boards Dec. 1, 1987

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