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Class Information
Number: 427/98.8
Name: Coating processes > Electrical product produced > Integrated circuit, printed circuit, or circuit board > With pretreatment of substrate > Etching or roughening
Description: Process in which surface texture of a substrate is altered by selectively removing or reconfiguring material therefrom or thereon (e.g., creating surface topography to increase substrate surface area for perfecting adhesion of a subsequently applied coating, etc.).










Patents under this class:
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Patent Number Title Of Patent Date Issued
8663752 Manufacturing method of carbon coated aluminum foil as cathode of solid aluminum electrolytic capacitor Mar. 4, 2014
8637113 Methods of forming a non-volatile resistive oxide memory array Jan. 28, 2014
8617993 Method of reducing pattern collapse in high aspect ratio nanostructures Dec. 31, 2013
8574663 Surface pairs Nov. 5, 2013
8563095 Silicon nitride passivation layer for covering high aspect ratio features Oct. 22, 2013
8231766 Method for producing printed wiring board Jul. 31, 2012
8114468 Methods of forming a non-volatile resistive oxide memory array Feb. 14, 2012
8003160 Wiring substrate Aug. 23, 2011
7968141 Method for producing contact terminal with textured surface and use thereof Jun. 28, 2011
7968468 Substrate treatment apparatus and substrate treatment method Jun. 28, 2011
7704565 Method of making a layered component with vector discrimination in a variable deposition rate process Apr. 27, 2010
7678409 Deposition of layers on substrates Mar. 16, 2010
7563315 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates Jul. 21, 2009
7344847 Nanoscale patterning and immobilization of bio-molecules Mar. 18, 2008
7329366 Method of polishing implantable medical devices to lower thrombogenecity and increase mechanical stability Feb. 12, 2008
7297360 Insulation film Nov. 20, 2007
7201022 Systems and methods for filling voids and improving properties of porous thin films Apr. 10, 2007
7147795 Method for surface treatment Dec. 12, 2006
7118665 Surface treatment process for enhancing a release rate of metal ions from a sacrificial electrode and a related sacrificial electrode Oct. 10, 2006
7108795 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates Sep. 19, 2006
7045198 Prepreg and circuit board and method for manufacturing the same May. 16, 2006
6974775 Method and apparatus for making an imprinted conductive circuit using semi-additive plating Dec. 13, 2005
6589593 Method for metal coating of substrates Jul. 8, 2003
6582757 Method for tungsten deposition without fluorine-contaminated silicon substrate Jun. 24, 2003
6544584 Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate Apr. 8, 2003
6537608 Protection of a plated through hole from chemical attack Mar. 25, 2003
6521285 Method for printing a catalyst on substrates for electroless deposition Feb. 18, 2003
6521069 Green sheet and manufacturing method thereof, manufacturing method of multi-layer wiring board, and manufacturing method of double-sided wiring board Feb. 18, 2003
6506314 Adhesion of polymeric materials to metal surfaces Jan. 14, 2003
6468582 Method of solder pre-coating and solder pre-coated circuit board Oct. 22, 2002
6403221 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same Jun. 11, 2002
6395329 Printed circuit board manufacture May. 28, 2002
6378201 Method for making a printed circuit board Apr. 30, 2002
6376049 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole Apr. 23, 2002
6344125 Pattern-sensitive electrolytic metal plating Feb. 5, 2002
6329072 Microporous copper film and electroless copper plating solution for obtaining the same Dec. 11, 2001
6316059 Method of providing a metal pattern on glass in an electroless process Nov. 13, 2001
6284309 Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom Sep. 4, 2001
6265020 Fluid delivery systems for electronic device manufacture Jul. 24, 2001
6212769 Process for manufacturing a printed wiring board Apr. 10, 2001
6204454 Wiring board and process for the production thereof Mar. 20, 2001
6174561 Composition and method for priming substrate materials Jan. 16, 2001
6141870 Method for making electrical device Nov. 7, 2000
6045866 Method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof Apr. 4, 2000
6023842 Process for the manufacture of printed circuit boards Feb. 15, 2000
5955141 Process for silver plating in printed circuit board manufacture Sep. 21, 1999
5922397 Metal-plating of cured and sintered transient liquid phase sintering pastes Jul. 13, 1999
5891528 Printed circuit board process using plasma spraying of conductive metal Apr. 6, 1999
5861076 Method for making multi-layer circuit boards Jan. 19, 1999
5800858 Method for conditioning halogenated polymeric materials and structures fabricated therewith Sep. 1, 1998

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