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Class Information
Number: 427/97.7
Name: Coating processes > Electrical product produced > Integrated circuit, printed circuit, or circuit board > Coating hole wall
Description: Process in which a coating is applied to a side of a hole in a substrate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7597929 |
Method of manufacturing a wiring substrate |
Oct. 6, 2009 |
| 7585541 |
Printed wiring board and method for manufacturing the same |
Sep. 8, 2009 |
| 7575776 |
Reflowing of a phase changeable memory element to close voids therein |
Aug. 18, 2009 |
| 7575778 |
Method of applying a polymer thick-film resistive paste for making polymer thick-film resistor having improved tolerances |
Aug. 18, 2009 |
| 7552531 |
Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit |
Jun. 30, 2009 |
| 7498064 |
Laser reflowing of phase changeable memory element to close a void therein |
Mar. 3, 2009 |
| 7455893 |
Staggered in-situ deposition and etching of a dielectric layer for HDP-CVD |
Nov. 25, 2008 |
| 7438945 |
Method of producing multilayer interconnection board |
Oct. 21, 2008 |
| 7425347 |
Composition for forming anti-reflective coating for use in lithography |
Sep. 16, 2008 |
| 7410666 |
Metal nitride carbide deposition by ALD |
Aug. 12, 2008 |
| 7328506 |
Method for forming a plated microvia interconnect |
Feb. 12, 2008 |
| 7313858 |
Method for manufacturing a magnetic head coil structure and/or pole tip structure |
Jan. 1, 2008 |
| 7281328 |
Method of fabricating rigid-flexible printed circuit board |
Oct. 16, 2007 |
| 7273811 |
Method for chemical vapor deposition in high aspect ratio spaces |
Sep. 25, 2007 |
| 7240431 |
Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device |
Jul. 10, 2007 |
| 7213334 |
Method for manufacturing double-sided flexible printed board |
May. 8, 2007 |
| 7211289 |
Method of making multilayered printed circuit board with filled conductive holes |
May. 1, 2007 |
| 7178234 |
Method of manufacturing multi-layer printed circuit board |
Feb. 20, 2007 |
| 7141269 |
Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer |
Nov. 28, 2006 |
| 7132134 |
Staggered in-situ deposition and etching of a dielectric layer for HDP CVD |
Nov. 7, 2006 |
| 7100267 |
Magnetic head, method for producing same, and magnetic recording and/or reproducing system |
Sep. 5, 2006 |
| 7093356 |
Method for producing wiring substrate |
Aug. 22, 2006 |
| 7062850 |
Method of forming electrical interconnects having electromigration-inhibiting segments to a critical length |
Jun. 20, 2006 |
| 7036222 |
Method for forming a multi-layer circuit assembly |
May. 2, 2006 |
| 7018672 |
Circuit board producing method and circuit board producing device |
Mar. 28, 2006 |
| 6959471 |
Method of manufacturing a droplet deposition apparatus |
Nov. 1, 2005 |
| 6935023 |
Method of forming electrical connection for fluid ejection device |
Aug. 30, 2005 |
| 6926922 |
PWB manufacture |
Aug. 9, 2005 |
| 6921505 |
Hole filling using an etched hole-fill stand-off |
Jul. 26, 2005 |
| 6911229 |
Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof |
Jun. 28, 2005 |
| 6886248 |
Conductive material and method for filling via-hole |
May. 3, 2005 |
| 6849294 |
Method for fabricating circuit pattern of printed circuit board |
Feb. 1, 2005 |
| 6506332 |
Filling method |
Jan. 14, 2003 |
| 6472023 |
Seed layer of copper interconnection via displacement |
Oct. 29, 2002 |
| 6348233 |
Method of forming conductive line features for enhanced reliability of multi-layer ceramic substrates |
Feb. 19, 2002 |
| 6312621 |
Via fill formulations which are electrically and/or thermally conductive, or non-conductive |
Nov. 6, 2001 |
| 6265017 |
Method and control system for applying solder flux to a printed circuit |
Jul. 24, 2001 |
| 6231333 |
Apparatus and method for vacuum injection molding |
May. 15, 2001 |
| 6214259 |
Dispersion containing Cu ultrafine particles individually dispersed therein |
Apr. 10, 2001 |
| 6134772 |
Via fill compositions for direct attach of devices and methods of applying same |
Oct. 24, 2000 |
| 6068879 |
Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishing |
May. 30, 2000 |
| 5882720 |
Monitoring deposited pads |
Mar. 16, 1999 |
| 5879738 |
Method for fluid transport for the surface treatment of planar substrates |
Mar. 9, 1999 |
| 5863598 |
Method of forming doped silicon in high aspect ratio openings |
Jan. 26, 1999 |
| 5711806 |
Printed circuit board processing apparatus |
Jan. 27, 1998 |
| 5690805 |
Direct metallization process |
Nov. 25, 1997 |
| 5622752 |
Methods and system for applying a uniform coating to a moving workpiece using an ultrasonic spray head |
Apr. 22, 1997 |
| 5595943 |
Method for formation of conductor using electroless plating |
Jan. 21, 1997 |
| 5516545 |
Coating processes and apparatus |
May. 14, 1996 |
| 5480675 |
Method of and apparatus for plating printed circuit board |
Jan. 2, 1996 |
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