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Class Information
Number: 427/579
Name: Coating processes > Direct application of electrical, magnetic, wave, or particulate energy > Plasma (e.g., corona, glow discharge, cold plasma, etc.) > Silicon containing coating material > Silicon oxides or nitrides
Description: Processes wherein the silicon utilized in the coating material is silicon oxide or silicon nitride.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7625609 |
Formation of silicon nitride film |
Dec. 1, 2009 |
| 7622396 |
Method of producing a semiconductor device |
Nov. 24, 2009 |
| 7622162 |
UV treatment of STI films for increasing tensile stress |
Nov. 24, 2009 |
| 7595096 |
Method of manufacturing vacuum plasma treated workpieces |
Sep. 29, 2009 |
| 7595010 |
Method for producing a doped nitride film, doped oxide film and other doped films |
Sep. 29, 2009 |
| 7578889 |
Methodology for cleaning of surface metal contamination from electrode assemblies |
Aug. 25, 2009 |
| 7569256 |
Plasma CVD apparatus and dry cleaning method of the same |
Aug. 4, 2009 |
| 7560144 |
Method of stabilizing film quality of low-dielectric constant film |
Jul. 14, 2009 |
| 7517818 |
Method for forming a nitrided germanium-containing layer using plasma processing |
Apr. 14, 2009 |
| 7514374 |
Method for manufacturing flat substrates |
Apr. 7, 2009 |
| 7497963 |
Etching method |
Mar. 3, 2009 |
| 7485349 |
Thin film forming method |
Feb. 3, 2009 |
| 7482035 |
Method of coating a substrate by a thermal application of the coating material |
Jan. 27, 2009 |
| 7474376 |
Display device |
Jan. 6, 2009 |
| 7455893 |
Staggered in-situ deposition and etching of a dielectric layer for HDP-CVD |
Nov. 25, 2008 |
| 7422776 |
Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD) |
Sep. 9, 2008 |
| 7422774 |
Method for forming ultra low k films using electron beam |
Sep. 9, 2008 |
| 7390537 |
Methods for producing low-k CDO films with low residual stress |
Jun. 24, 2008 |
| 7381451 |
Strain engineering--HDP thin film with tensile stress for FEOL and other applications |
Jun. 3, 2008 |
| 7341761 |
Methods for producing low-k CDO films |
Mar. 11, 2008 |
| 7326444 |
Methods for improving integration performance of low stress CDO films |
Feb. 5, 2008 |
| 7288292 |
Ultra low k (ULK) SiCOH film and method |
Oct. 30, 2007 |
| 7273638 |
High density plasma oxidation |
Sep. 25, 2007 |
| 7244474 |
Chemical vapor deposition plasma process using an ion shower grid |
Jul. 17, 2007 |
| 7223446 |
Plasma CVD apparatus and dry cleaning method of the same |
May. 29, 2007 |
| 7220687 |
Method to improve water-barrier performance by changing film surface morphology |
May. 22, 2007 |
| 7214600 |
Method to improve transmittance of an encapsulating film |
May. 8, 2007 |
| 7192626 |
Methods for producing silicon nitride films and silicon oxynitride films by thermal chemical vapor deposition |
Mar. 20, 2007 |
| 7163721 |
Method to plasma deposit on organic polymer dielectric film |
Jan. 16, 2007 |
| 7147900 |
Method for forming silicon-containing insulation film having low dielectric constant treated with electron beam radiation |
Dec. 12, 2006 |
| 7144521 |
High aspect ratio etch using modulation of RF powers of various frequencies |
Dec. 5, 2006 |
| 7141278 |
Thin film forming method |
Nov. 28, 2006 |
| 7141277 |
Self-generating inorganic passivation layers for polymer-layered silicate nanocomposites |
Nov. 28, 2006 |
| 7132134 |
Staggered in-situ deposition and etching of a dielectric layer for HDP CVD |
Nov. 7, 2006 |
| 7125583 |
Chemical vapor deposition chamber pre-deposition treatment for improved carbon doped oxide thickness uniformity and throughput |
Oct. 24, 2006 |
| 7101815 |
Method for improving thickness uniformity of deposited ozone-TEOS silicate glass layers |
Sep. 5, 2006 |
| 7087271 |
Method for preparing low dielectric films |
Aug. 8, 2006 |
| 7081271 |
Cyclical deposition of refractory metal silicon nitride |
Jul. 25, 2006 |
| 7060323 |
Method of forming interlayer insulating film |
Jun. 13, 2006 |
| 7052552 |
Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVD |
May. 30, 2006 |
| 7031600 |
Method and apparatus for silicon oxide deposition on large area substrates |
Apr. 18, 2006 |
| 6984595 |
Layer member forming method |
Jan. 10, 2006 |
| 6962732 |
Process for controlling thin film uniformity and products produced thereby |
Nov. 8, 2005 |
| 6955836 |
Silicon oxide film formation method |
Oct. 18, 2005 |
| 6953609 |
High-density plasma process for depositing a layer of silicon nitride |
Oct. 11, 2005 |
| 6936309 |
Hardness improvement of silicon carboxy films |
Aug. 30, 2005 |
| 6929830 |
Plasma treatment method and method of manufacturing optical parts using the same |
Aug. 16, 2005 |
| 6929831 |
Methods of forming nitride films |
Aug. 16, 2005 |
| 6919107 |
Method and device for treating surfaces using a glow discharge plasma |
Jul. 19, 2005 |
| 6911233 |
Method for depositing thin film using plasma chemical vapor deposition |
Jun. 28, 2005 |
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