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Class Information
Number: 427/578
Name: Coating processes > Direct application of electrical, magnetic, wave, or particulate energy > Plasma (e.g., corona, glow discharge, cold plasma, etc.) > Silicon containing coating material
Description: Processes wherein a coating material applied contains silicon.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7601402 |
Method for forming insulation film and apparatus for forming insulation film |
Oct. 13, 2009 |
| 7595097 |
Expanding thermal plasma deposition system |
Sep. 29, 2009 |
| 7578889 |
Methodology for cleaning of surface metal contamination from electrode assemblies |
Aug. 25, 2009 |
| 7569256 |
Plasma CVD apparatus and dry cleaning method of the same |
Aug. 4, 2009 |
| 7560144 |
Method of stabilizing film quality of low-dielectric constant film |
Jul. 14, 2009 |
| 7514342 |
Method and apparatus for forming deposited film |
Apr. 7, 2009 |
| 7473443 |
Composition for forming silicon film and method for forming silicon film |
Jan. 6, 2009 |
| 7465478 |
Plasma immersion ion implantation process |
Dec. 16, 2008 |
| 7462569 |
Method of manufacturing semiconductor device |
Dec. 9, 2008 |
| 7455892 |
Method and apparatus for forming a coating |
Nov. 25, 2008 |
| 7435454 |
Plasma enhanced atomic layer deposition system and method |
Oct. 14, 2008 |
| 7429410 |
Diffuser gravity support |
Sep. 30, 2008 |
| 7422776 |
Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD) |
Sep. 9, 2008 |
| 7396570 |
Plasma enhanced chemical vapor deposition method of forming titanium silicide comprising layers |
Jul. 8, 2008 |
| 7390537 |
Methods for producing low-k CDO films with low residual stress |
Jun. 24, 2008 |
| 7371427 |
Reduction of hillocks prior to dielectric barrier deposition in Cu damascene |
May. 13, 2008 |
| 7361302 |
Oxidation and fatigue resistant metallic coating |
Apr. 22, 2008 |
| 7348041 |
Antireflection film made of a CVD SiO.sub.2 film containing a fluoro and/or alkyl modifier |
Mar. 25, 2008 |
| 7344996 |
Helium-based etch process in deposition-etch-deposition gap fill |
Mar. 18, 2008 |
| 7297376 |
Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layers |
Nov. 20, 2007 |
| 7288284 |
Post-cleaning chamber seasoning method |
Oct. 30, 2007 |
| 7264849 |
Roll-vortex plasma chemical vapor deposition method |
Sep. 4, 2007 |
| 7238393 |
Method of forming silicon carbide films |
Jul. 3, 2007 |
| 7229935 |
Method of forming a thin film by plasma CVD of a silicon-containing source gas |
Jun. 12, 2007 |
| 7223446 |
Plasma CVD apparatus and dry cleaning method of the same |
May. 29, 2007 |
| 7166335 |
Layer formation method, and substrate with a layer formed by the method |
Jan. 23, 2007 |
| 7147900 |
Method for forming silicon-containing insulation film having low dielectric constant treated with electron beam radiation |
Dec. 12, 2006 |
| 7144606 |
Plasma treatment to enhance adhesion and to minimize oxidation of carbon-containing layers |
Dec. 5, 2006 |
| 7112453 |
Retentate chromatography and protein chip arrays with applications in biology and medicine |
Sep. 26, 2006 |
| 7087271 |
Method for preparing low dielectric films |
Aug. 8, 2006 |
| 7078356 |
Low K interlevel dielectric layer fabrication methods |
Jul. 18, 2006 |
| 7074461 |
Method for fabricating hydrogenated silicon oxycarbide thin film |
Jul. 11, 2006 |
| 7052552 |
Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVD |
May. 30, 2006 |
| 7022864 |
Ethyleneoxide-silane and bridged silane precursors for forming low k films |
Apr. 4, 2006 |
| 6962732 |
Process for controlling thin film uniformity and products produced thereby |
Nov. 8, 2005 |
| 6953608 |
Solution for FSG induced metal corrosion & metal peeling defects with extra bias liner and smooth RF bias ramp up |
Oct. 11, 2005 |
| 6936310 |
Plasma processing method |
Aug. 30, 2005 |
| 6926932 |
Method for forming silicon oxide layer |
Aug. 9, 2005 |
| 6926926 |
Silicon carbide deposited by high density plasma chemical-vapor deposition with bias |
Aug. 9, 2005 |
| 6919107 |
Method and device for treating surfaces using a glow discharge plasma |
Jul. 19, 2005 |
| 6916511 |
Method of hardening a nano-imprinting stamp |
Jul. 12, 2005 |
| 6911233 |
Method for depositing thin film using plasma chemical vapor deposition |
Jun. 28, 2005 |
| 6887514 |
Method of depositing optical films |
May. 3, 2005 |
| 6855484 |
Method of depositing low dielectric constant silicon carbide layers |
Feb. 15, 2005 |
| 6846515 |
Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants |
Jan. 25, 2005 |
| 6838127 |
Method and apparatus for forming an HSG-Si layer on a wafer |
Jan. 4, 2005 |
| 6827987 |
Method of reducing an electrostatic charge on a substrate during a PECVD process |
Dec. 7, 2004 |
| 6815014 |
Corona-generated chemical vapor deposition on a substrate |
Nov. 9, 2004 |
| 6811831 |
Method for depositing silicon nitride |
Nov. 2, 2004 |
| 6802944 |
High density plasma CVD process for gapfill into high aspect ratio features |
Oct. 12, 2004 |
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