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Class Information
Number: 425/DIG.228
Name: Plastic article or earthenware shaping or treating: apparatus > Injection plunger or ram: transfer molding type
Description:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7029257 |
Apparatus and method for molding simultaneously a plurality of semiconductor devices |
Apr. 18, 2006 |
| 6652254 |
Molding apparatus including screw for molded articles of thermoplastic gas impregnated resin |
Nov. 25, 2003 |
| 6382945 |
Resin plunging apparatus for molding resin to seal an electronic device |
May. 7, 2002 |
| 5882692 |
Resin molding apparatus |
Mar. 16, 1999 |
| 5871782 |
Transfer molding apparatus having laminated chase block |
Feb. 16, 1999 |
| 5851559 |
Transfer molding press |
Dec. 22, 1998 |
| 5834035 |
Method of and apparatus for molding resin to seal electronic parts |
Nov. 10, 1998 |
| 5776512 |
Apparatus for encapsulating electronic packages |
Jul. 7, 1998 |
| 5766649 |
Resin sealing mold die set with less resin remainder for semiconductor device |
Jun. 16, 1998 |
| 5759589 |
Apparatus for encapsulating field windings of rotary electric machines |
Jun. 2, 1998 |
| 5753164 |
Automated thermoset molding method |
May. 19, 1998 |
| 5750154 |
Resin sealing/molding apparatus for electronic parts |
May. 12, 1998 |
| 5690885 |
Method for forming encapsulated semicondcutor chips |
Nov. 25, 1997 |
| 5650177 |
Resin molding apparatus |
Jul. 22, 1997 |
| 5635220 |
Molding die for sealing semiconductor device with reduced resin burrs |
Jun. 3, 1997 |
| 5626887 |
Air exhaust mold plunger |
May. 6, 1997 |
| 5609889 |
Apparatus for encapsulating electronic packages |
Mar. 11, 1997 |
| 5522713 |
Direct drive electro-mechanical press for encapsulating semiconductor devices |
Jun. 4, 1996 |
| 5520874 |
Compressible mold plunger |
May. 28, 1996 |
| 5516271 |
Apparatus for resin transfer molding |
May. 14, 1996 |
| 5501588 |
Mold for a semiconductor package |
Mar. 26, 1996 |
| 5480296 |
Transfer molding apparatus for encapsulating an electrical element in resin |
Jan. 2, 1996 |
| 5464338 |
Food pump |
Nov. 7, 1995 |
| 5460502 |
Plunger apparatus used in a resin molding device for encapsulating electronic components |
Oct. 24, 1995 |
| 5451154 |
Scraping plunger |
Sep. 19, 1995 |
| 5431854 |
Method for pressing a plastic, which cures by means of a reaction, into a mould cavity, a pressing auxiliary in pill form to be used in this method and a holder composed of such material |
Jul. 11, 1995 |
| 5429488 |
Encapsulating molding equipment and method |
Jul. 4, 1995 |
| 5425629 |
Apparatus for molding mini-compact disk cartridge shells |
Jun. 20, 1995 |
| 5413471 |
Resin-sealing apparatus including a gas spring |
May. 9, 1995 |
| 5409362 |
Encapsulation molding equipment |
Apr. 25, 1995 |
| 5395226 |
Molding machine and method |
Mar. 7, 1995 |
| 5378136 |
Apparatus for pre-shaping plasticated plastics material |
Jan. 3, 1995 |
| 5370517 |
Apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device |
Dec. 6, 1994 |
| 5356283 |
Metal mold for sealing semiconductor devices with a resin |
Oct. 18, 1994 |
| 5326243 |
Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device |
Jul. 5, 1994 |
| 5316463 |
Encapsulating molding equipment |
May. 31, 1994 |
| 5310330 |
System for molding laminated articles of a thermoplastic resin |
May. 10, 1994 |
| 5302101 |
Mold for resin-packaging electronic components |
Apr. 12, 1994 |
| 5297897 |
Single-strip molding apparatus |
Mar. 29, 1994 |
| 5281121 |
Resin sealing apparatus |
Jan. 25, 1994 |
| 5275546 |
Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor |
Jan. 4, 1994 |
| 5204122 |
Mold for use in resin encapsulation molding |
Apr. 20, 1993 |
| 5158780 |
Device for encapsulating electronic components |
Oct. 27, 1992 |
| 5123826 |
Molding pot having configured bottom |
Jun. 23, 1992 |
| 5122045 |
Mold for molding a package for a semiconductor device for detecting or emitting a magnetic line of force or light |
Jun. 16, 1992 |
| 5108278 |
Resin sealing apparatus |
Apr. 28, 1992 |
| 5071334 |
Multiple transfer molding die |
Dec. 10, 1991 |
| 5061164 |
Dowel-less mold chase for use in transfer molding |
Oct. 29, 1991 |
| 5052907 |
Resin sealing apparatus for use in manufacturing a resin-sealed semiconductor device |
Oct. 1, 1991 |
| 4815961 |
Modeling compound forming toy |
Mar. 28, 1989 |
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