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Class Information
Number: 425/544
Name: Plastic article or earthenware shaping or treating: apparatus > Female mold and charger to supply fluent stock under pressure thereto in fluid-tight relationship (e.g., injection mold, etc.) > Molding of thermosetting or cross-linking stock > Means for transfer molding
Description: Apparatus wherein the means to force the stock material to move comprises a chamber adapted to receive a substantially solid block of stock material and includes means to pressurize the block sufficiently to cause the stock material to flow as a liquid to the shaping cavity.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5656305 |
System for dosed conveying and selecting of cylindrical pellets for molding apparatus for lead frames |
Aug. 12, 1997 |
| 5654017 |
Modular molding apparatus |
Aug. 5, 1997 |
| 5653907 |
Lightweight thermally responsive mold for resin transfer molding |
Aug. 5, 1997 |
| 5650177 |
Resin molding apparatus |
Jul. 22, 1997 |
| 5645864 |
Resin encapsulating molding die for manufacturing a semiconductor device |
Jul. 8, 1997 |
| 5635220 |
Molding die for sealing semiconductor device with reduced resin burrs |
Jun. 3, 1997 |
| 5626887 |
Air exhaust mold plunger |
May. 6, 1997 |
| 5624691 |
Transfer mold design |
Apr. 29, 1997 |
| 5609889 |
Apparatus for encapsulating electronic packages |
Mar. 11, 1997 |
| 5597523 |
Molding apparatus and method in which a mold cavity gasket is deformed by separately applied pressure |
Jan. 28, 1997 |
| 5556647 |
Encapsulation mold |
Sep. 17, 1996 |
| 5522713 |
Direct drive electro-mechanical press for encapsulating semiconductor devices |
Jun. 4, 1996 |
| 5520874 |
Compressible mold plunger |
May. 28, 1996 |
| 5516271 |
Apparatus for resin transfer molding |
May. 14, 1996 |
| 5507633 |
Resin molding apparatus for sealing an electronic device |
Apr. 16, 1996 |
| 5501587 |
Molding machine for semiconductor package |
Mar. 26, 1996 |
| 5501588 |
Mold for a semiconductor package |
Mar. 26, 1996 |
| 5480296 |
Transfer molding apparatus for encapsulating an electrical element in resin |
Jan. 2, 1996 |
| 5478226 |
Automatic plunger apparatus for use in forming encapsulated semiconductor chips |
Dec. 26, 1995 |
| 5460503 |
Mold for forming a coreless armature |
Oct. 24, 1995 |
| 5460502 |
Plunger apparatus used in a resin molding device for encapsulating electronic components |
Oct. 24, 1995 |
| 5454705 |
Semiconductor mold having cavity blocks with cavities on top and bottom surfaces |
Oct. 3, 1995 |
| 5451154 |
Scraping plunger |
Sep. 19, 1995 |
| 5435953 |
Method of molding resin for sealing an electronic device |
Jul. 25, 1995 |
| 5431854 |
Method for pressing a plastic, which cures by means of a reaction, into a mould cavity, a pressing auxiliary in pill form to be used in this method and a holder composed of such material |
Jul. 11, 1995 |
| 5429488 |
Encapsulating molding equipment and method |
Jul. 4, 1995 |
| 5413471 |
Resin-sealing apparatus including a gas spring |
May. 9, 1995 |
| 5409364 |
Extruder assembly for modeling composition |
Apr. 25, 1995 |
| 5409362 |
Encapsulation molding equipment |
Apr. 25, 1995 |
| 5393215 |
Centrifugal resin transfer molding |
Feb. 28, 1995 |
| 5370517 |
Apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device |
Dec. 6, 1994 |
| 5366364 |
Plastic molding apparatus |
Nov. 22, 1994 |
| 5366368 |
Multi-plunger manual transfer mold die |
Nov. 22, 1994 |
| 5358396 |
Multi-functional mould |
Oct. 25, 1994 |
| 5356283 |
Metal mold for sealing semiconductor devices with a resin |
Oct. 18, 1994 |
| 5344302 |
Remote impression tool |
Sep. 6, 1994 |
| 5328347 |
Device for introducing a plastic material into a mould cavity |
Jul. 12, 1994 |
| 5326243 |
Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device |
Jul. 5, 1994 |
| 5316463 |
Encapsulating molding equipment |
May. 31, 1994 |
| 5302101 |
Mold for resin-packaging electronic components |
Apr. 12, 1994 |
| 5297897 |
Single-strip molding apparatus |
Mar. 29, 1994 |
| 5281121 |
Resin sealing apparatus |
Jan. 25, 1994 |
| 5277567 |
Apparatus for mixing reactive synthetic-resin components |
Jan. 11, 1994 |
| 5275546 |
Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor |
Jan. 4, 1994 |
| 5204122 |
Mold for use in resin encapsulation molding |
Apr. 20, 1993 |
| 5204127 |
Compression molding apparatus |
Apr. 20, 1993 |
| 5192555 |
Apparatus for molding plastic articles |
Mar. 9, 1993 |
| 5182071 |
Method of molding a carrier ring to leads |
Jan. 26, 1993 |
| 5178885 |
Resin transfer mold |
Jan. 12, 1993 |
| 5139728 |
Method of using molding pot having configured bottom |
Aug. 18, 1992 |
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