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Class Information
Number: 425/544
Name: Plastic article or earthenware shaping or treating: apparatus > Female mold and charger to supply fluent stock under pressure thereto in fluid-tight relationship (e.g., injection mold, etc.) > Molding of thermosetting or cross-linking stock > Means for transfer molding
Description: Apparatus wherein the means to force the stock material to move comprises a chamber adapted to receive a substantially solid block of stock material and includes means to pressurize the block sufficiently to cause the stock material to flow as a liquid to the shaping cavity.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6214273 |
Molding method with the use of modified runners |
Apr. 10, 2001 |
| 6200121 |
Process for concurrently molding semiconductor chips without void and wire weep and molding die used therein |
Mar. 13, 2001 |
| 6173490 |
Method for forming a panel of packaged integrated circuits |
Jan. 16, 2001 |
| 6106259 |
Transfer molding apparatus with a cull-block having protrusion |
Aug. 22, 2000 |
| 6106274 |
Molding apparatus with charge overflow |
Aug. 22, 2000 |
| 6103150 |
Molding overflow feedback method |
Aug. 15, 2000 |
| 6080354 |
Resin molding method in which a movable cavity piece allows a direct resin feed |
Jun. 27, 2000 |
| 6071457 |
Bellows container packaging system and method |
Jun. 6, 2000 |
| 6071107 |
Apparatus for encapsulating products |
Jun. 6, 2000 |
| 6068809 |
Method of injection molding elements such as semiconductor elements |
May. 30, 2000 |
| 6050802 |
Resin molding machine |
Apr. 18, 2000 |
| 6048483 |
Resin sealing method for chip-size packages |
Apr. 11, 2000 |
| 6019588 |
Moulding apparatus with compensation element |
Feb. 1, 2000 |
| 6015280 |
Apparatus for reducing warping of plastic packages |
Jan. 18, 2000 |
| 6007317 |
Ball grid array (BGA) encapsulation mold |
Dec. 28, 1999 |
| 6000924 |
Pressurized underfill encapsulation of integrated circuits |
Dec. 14, 1999 |
| 5997798 |
Biasing mold for integrated circuit chip assembly encapsulation |
Dec. 7, 1999 |
| 5971737 |
Electrically driven plunger for transfer molding press |
Oct. 26, 1999 |
| 5955115 |
Pre-packaged liquid molding for component encapsulation |
Sep. 21, 1999 |
| 5945130 |
Apparatus for circuit encapsulation |
Aug. 31, 1999 |
| 5932160 |
Process and mold for encapsulating semiconductor chips having radial runners |
Aug. 3, 1999 |
| 5928595 |
Method of manufacturing a semiconductor component |
Jul. 27, 1999 |
| 5925384 |
Manual pellet loader for Boschman automolds |
Jul. 20, 1999 |
| 5912024 |
Sproutless pre-packaged molding for component encapsulation |
Jun. 15, 1999 |
| 5902613 |
Automated thermoset molding apparatus |
May. 11, 1999 |
| 5897883 |
Mold having projections for inhibiting the formation of air pockets |
Apr. 27, 1999 |
| 5891483 |
Automatic molding machine using release film |
Apr. 6, 1999 |
| 5891384 |
Method of operating a molding machine with release film |
Apr. 6, 1999 |
| 5882692 |
Resin molding apparatus |
Mar. 16, 1999 |
| 5876765 |
Injection molding equipment for encapsulating semiconductor die and the like |
Mar. 2, 1999 |
| 5871782 |
Transfer molding apparatus having laminated chase block |
Feb. 16, 1999 |
| 5853771 |
Molding die set and mold package |
Dec. 29, 1998 |
| 5851559 |
Transfer molding press |
Dec. 22, 1998 |
| 5846477 |
Production method for encapsulating a semiconductor device |
Dec. 8, 1998 |
| 5834035 |
Method of and apparatus for molding resin to seal electronic parts |
Nov. 10, 1998 |
| 5824252 |
Method of resin molding and resin molding machine for the same |
Oct. 20, 1998 |
| 5811132 |
Mold for semiconductor packages |
Sep. 22, 1998 |
| 5811041 |
Method and apparatus for vacuum transfer molding |
Sep. 22, 1998 |
| 5800747 |
Method for molding using an ion implanted mold |
Sep. 1, 1998 |
| 5800841 |
Resin molding machine |
Sep. 1, 1998 |
| 5776512 |
Apparatus for encapsulating electronic packages |
Jul. 7, 1998 |
| 5770128 |
Method of transfer molding and a transfer molding machine |
Jun. 23, 1998 |
| 5766650 |
Moulding apparatus with compensation element |
Jun. 16, 1998 |
| 5766649 |
Resin sealing mold die set with less resin remainder for semiconductor device |
Jun. 16, 1998 |
| 5759589 |
Apparatus for encapsulating field windings of rotary electric machines |
Jun. 2, 1998 |
| 5753164 |
Automated thermoset molding method |
May. 19, 1998 |
| 5750154 |
Resin sealing/molding apparatus for electronic parts |
May. 12, 1998 |
| 5750153 |
Mold device and process for resin-packaging semiconductor devices |
May. 12, 1998 |
| 5723156 |
Mold for molding a semiconductor package |
Mar. 3, 1998 |
| 5698242 |
Apparatus for the injection molding of semiconductor elements |
Dec. 16, 1997 |
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