| |
 |
|
Class Information
Number: 425/544
Name: Plastic article or earthenware shaping or treating: apparatus > Female mold and charger to supply fluent stock under pressure thereto in fluid-tight relationship (e.g., injection mold, etc.) > Molding of thermosetting or cross-linking stock > Means for transfer molding
Description: Apparatus wherein the means to force the stock material to move comprises a chamber adapted to receive a substantially solid block of stock material and includes means to pressurize the block sufficiently to cause the stock material to flow as a liquid to the shaping cavity.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7604469 |
Degating device |
Oct. 20, 2009 |
| 7534103 |
Injection molding machine |
May. 19, 2009 |
| 7481641 |
Apparatus and method for producing an article by means of a molding technique |
Jan. 27, 2009 |
| 7470120 |
Configurable die detachment apparatus |
Dec. 30, 2008 |
| 7419627 |
Co-cured vacuum-assisted resin transfer molding manufacturing method |
Sep. 2, 2008 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7175405 |
Compression molding machine |
Feb. 13, 2007 |
| 7169345 |
Method for integrated circuit packaging |
Jan. 30, 2007 |
| 7156633 |
Apparatus for encapsulating a multi-chip substrate array |
Jan. 2, 2007 |
| 7029257 |
Apparatus and method for molding simultaneously a plurality of semiconductor devices |
Apr. 18, 2006 |
| 7005101 |
Virtual gate design for thin packages |
Feb. 28, 2006 |
| 6981859 |
Method for manufacturing electronic component and apparatus for manufacturing the same |
Jan. 3, 2006 |
| 6942478 |
Packaging mold with electrostatic discharge protection |
Sep. 13, 2005 |
| 6908293 |
Resin encapsulation system |
Jun. 21, 2005 |
| 6899533 |
Apparatus for making semiconductor device |
May. 31, 2005 |
| 6887418 |
Post mold cooling of preforms |
May. 3, 2005 |
| 6863516 |
Transfer molding and underfilling apparatus |
Mar. 8, 2005 |
| 6857865 |
Mold structure for package fabrication |
Feb. 22, 2005 |
| 6840751 |
Vertical mold die press machine |
Jan. 11, 2005 |
| 6773247 |
Die used for resin-sealing and molding an electronic component |
Aug. 10, 2004 |
| 6755634 |
Apparatus for forming a golf ball with deep dimples |
Jun. 29, 2004 |
| 6696006 |
Mold for flashless injection molding to encapsulate an integrated circuit chip |
Feb. 24, 2004 |
| 6689303 |
Injection molding method using a stacked mold |
Feb. 10, 2004 |
| 6682958 |
Method for manufacturing semiconductor device by using sealing apparatus |
Jan. 27, 2004 |
| 6616436 |
Apparatus for manufacturing semiconductor packages |
Sep. 9, 2003 |
| 6609041 |
Method and system for SKU tracking and changeover |
Aug. 19, 2003 |
| 6592352 |
Offset edges mold for plastic packaging of integrated semiconductor devices |
Jul. 15, 2003 |
| 6530764 |
Mold for resin-sealing of semiconductor devices |
Mar. 11, 2003 |
| 6508970 |
Liquid transfer molding system for encapsulating semiconductor integrated circuits |
Jan. 21, 2003 |
| 6503433 |
Liquid transfer molding system for encapsulating semiconductor integrated circuits |
Jan. 7, 2003 |
| 6491508 |
Molding die set |
Dec. 10, 2002 |
| 6478562 |
Resin molding machine |
Nov. 12, 2002 |
| 6461558 |
Injection molding apparatus and method |
Oct. 8, 2002 |
| 6457963 |
Resin-sealing apparatus |
Oct. 1, 2002 |
| 6444157 |
Method of resin molding |
Sep. 3, 2002 |
| 6428731 |
Mould part, mould and method for encapsulating electronic components mounted on a carrier |
Aug. 6, 2002 |
| 6425434 |
Casting chamber for a die casting machine |
Jul. 30, 2002 |
| 6382945 |
Resin plunging apparatus for molding resin to seal an electronic device |
May. 7, 2002 |
| 6350113 |
Resin molding machine |
Feb. 26, 2002 |
| 6344162 |
Method of manufacturing semiconductor devices and resin molding machine |
Feb. 5, 2002 |
| 6315540 |
Molding die for concurrently molding semiconductor chips without voids and wire weep |
Nov. 13, 2001 |
| 6309575 |
Transfer molding method for forming integrated circuit package |
Oct. 30, 2001 |
| 6302673 |
Integrated circuit chip mold seal |
Oct. 16, 2001 |
| 6302672 |
Integrated circuit chip mold seal |
Oct. 16, 2001 |
| 6290481 |
Flash-free mold structure for integrated circuit package |
Sep. 18, 2001 |
| 6276913 |
Mold for resin sealing |
Aug. 21, 2001 |
| 6267577 |
Transfer molding apparatus for manufacturing semiconductor devices |
Jul. 31, 2001 |
| 6264454 |
Wrapped SMC charge method and apparatus |
Jul. 24, 2001 |
| 6257857 |
Molding apparatus for flexible substrate based package |
Jul. 10, 2001 |
| 6224360 |
Resin sealing device for chip-size packages |
May. 1, 2001 |
|
|
|
