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Class Information
Number: 420/589
Name: Alloys or metallic compositions > Containing over 50 per cent metal but no base metal > Tin containing
Description: Alloy, or metallic composition which contains tin in an amount which does not exceed 50 percent by weight.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8679635 Bonding material, bonded portion and circuit board Mar. 25, 2014
8541336 Metal-carbon compositions Sep. 24, 2013
8293370 Bonding material, bonded portion and circuit board Oct. 23, 2012
8128868 Grain refinement by precipitate formation in PB-free alloys of tin Mar. 6, 2012
7988908 Filler metal alloy compositions Aug. 2, 2011
7803314 Non-toxic shot formulation and method of making Sep. 28, 2010
7744706 Solder alloy for bonding oxide material, and solder joint using the same Jun. 29, 2010
7048813 Foil-form soldering metal and method for processing the same May. 23, 2006
7041180 Method for joining workpieces using soldering alloy May. 9, 2006
6863746 White gold compositions without nickel and palladium Mar. 8, 2005
6770105 Method and device for treating fuel Aug. 3, 2004
6767653 Coatings, method of manufacture, and the articles derived therefrom Jul. 27, 2004
6613275 Non-precious dental alloy Sep. 2, 2003
6319617 Oxide-bondable solder Nov. 20, 2001
6306185 Method and device for treating fuel Oct. 23, 2001
6306516 Article comprising oxide-bondable solder Oct. 23, 2001
6238823 Non-stoichiometric AB5 alloys for metal hydride electrodes May. 29, 2001
6231693 Alloy, in particular a solder alloy, for joining workpieces May. 15, 2001
6156132 Solder alloys Dec. 5, 2000
6071359 Shot for use as ammunition Jun. 6, 2000
5871690 Low-temperature solder compositions Feb. 16, 1999
5833921 Lead-free, low-temperature solder compositions Nov. 10, 1998
5755896 Low temperature lead-free solder compositions May. 26, 1998
5728913 Moisture based method of improving the performance of hydrocarbon fuels Mar. 17, 1998
5705695 Quaternary Zintl composition (Et.sub.4 N).sub.4 [Au(Ag.sub.1-x Au.sub.x).sub.2 Sn.sub.2 Te.sub.9 ] Jan. 6, 1998
5698160 Lead-free alloys for use in solder bonding Dec. 16, 1997
5637160 Corrosion-resistant bismuth brass Jun. 10, 1997
5625118 Method of improving the performance of hydrocarbon fuels Apr. 29, 1997
5532076 Hydrogen storage alloy and electrode therefrom Jul. 2, 1996
5514334 Fine lead alloy wire for forming bump electrodes May. 7, 1996
5462437 Dental alloys for composite and porcelain overlays Oct. 31, 1995
5393723 Catalyst for improving the combustion and operational qualities of hydrocarbon fuels Feb. 28, 1995
5384090 Fine wire for forming bump electrodes using a wire bonder Jan. 24, 1995
5248476 Fusible alloy containing bismuth, indium, lead, tin and gallium Sep. 28, 1993
5240172 Solder alloy for dental and jewelry parts Aug. 31, 1993
5185125 Dental alloy and amalgam thereof Feb. 9, 1993
5075076 Novel palladium-based alloys containing tin and their use in the glass industry Dec. 24, 1991
5051235 Novel palladium-based alloys containing indium bismuth, silver and copper Sep. 24, 1991
5039479 Silver alloy compositions, and master alloy compositions therefor Aug. 13, 1991
5019336 Micro-additions to tin alloys May. 28, 1991
5011658 Copper doped low melt solder for component assembly and rework Apr. 30, 1991
4975244 Non-ferrous soft soldering lead-tin-antimony alloy compositions Dec. 4, 1990
4904577 Optical recording element and alloy for use therein Feb. 27, 1990
4902342 Method for the manufacture of non-allergy creating precious metal objects Feb. 20, 1990
4891184 Low density heat resistant intermetallic alloys of the Al.sub.3 Ti type Jan. 2, 1990
4874577 Wear-resistant intermetallic compound alloy having improved machineability Oct. 17, 1989
4869871 Pb-Sn-Sb-In solder alloy Sep. 26, 1989
4859240 Dental amalgam alloy Aug. 22, 1989
4816219 Low-temperature solder composition Mar. 28, 1989
4804517 Gold colored palladium - indium alloys Feb. 14, 1989

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